JPH0558597B2 - - Google Patents
Info
- Publication number
- JPH0558597B2 JPH0558597B2 JP60007817A JP781785A JPH0558597B2 JP H0558597 B2 JPH0558597 B2 JP H0558597B2 JP 60007817 A JP60007817 A JP 60007817A JP 781785 A JP781785 A JP 781785A JP H0558597 B2 JPH0558597 B2 JP H0558597B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- frame
- circuit board
- connection electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 125000006850 spacer group Chemical group 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60007817A JPS61166149A (ja) | 1985-01-18 | 1985-01-18 | 多層混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60007817A JPS61166149A (ja) | 1985-01-18 | 1985-01-18 | 多層混成集積回路装置 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1030630A Division JPH01257391A (ja) | 1989-02-08 | 1989-02-08 | 多層混成集積回路装置 |
| JP1030631A Division JPH01257392A (ja) | 1989-02-08 | 1989-02-08 | 多層混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61166149A JPS61166149A (ja) | 1986-07-26 |
| JPH0558597B2 true JPH0558597B2 (en, 2012) | 1993-08-26 |
Family
ID=11676143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60007817A Granted JPS61166149A (ja) | 1985-01-18 | 1985-01-18 | 多層混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61166149A (en, 2012) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02117079A (ja) * | 1988-10-27 | 1990-05-01 | Mazda Motor Corp | 金属基板を有する集積回路のコネクタ構造 |
| JP2760831B2 (ja) * | 1989-01-30 | 1998-06-04 | 三洋電機株式会社 | 金属基板を有する集積回路のコネクタ構造 |
| JPH02220376A (ja) * | 1989-02-20 | 1990-09-03 | Mazda Motor Corp | 金属基板を有する集積回路のコネクタ構造 |
| JPH02226675A (ja) * | 1989-02-28 | 1990-09-10 | Sanyo Electric Co Ltd | 混成集積回路の固定構造 |
| CN114900951B (zh) * | 2022-06-08 | 2022-11-25 | 东莞光阳兴业电子配件有限公司 | 一种便于连接且可分离的双面fpc板及连接及分离方法 |
-
1985
- 1985-01-18 JP JP60007817A patent/JPS61166149A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61166149A (ja) | 1986-07-26 |
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