JPH0558597B2 - - Google Patents

Info

Publication number
JPH0558597B2
JPH0558597B2 JP60007817A JP781785A JPH0558597B2 JP H0558597 B2 JPH0558597 B2 JP H0558597B2 JP 60007817 A JP60007817 A JP 60007817A JP 781785 A JP781785 A JP 781785A JP H0558597 B2 JPH0558597 B2 JP H0558597B2
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
frame
circuit board
connection electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60007817A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61166149A (ja
Inventor
Yoshio Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP60007817A priority Critical patent/JPS61166149A/ja
Publication of JPS61166149A publication Critical patent/JPS61166149A/ja
Publication of JPH0558597B2 publication Critical patent/JPH0558597B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP60007817A 1985-01-18 1985-01-18 多層混成集積回路装置 Granted JPS61166149A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60007817A JPS61166149A (ja) 1985-01-18 1985-01-18 多層混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60007817A JPS61166149A (ja) 1985-01-18 1985-01-18 多層混成集積回路装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP1030631A Division JPH01257392A (ja) 1989-02-08 1989-02-08 多層混成集積回路装置
JP1030630A Division JPH01257391A (ja) 1989-02-08 1989-02-08 多層混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS61166149A JPS61166149A (ja) 1986-07-26
JPH0558597B2 true JPH0558597B2 (cg-RX-API-DMAC10.html) 1993-08-26

Family

ID=11676143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60007817A Granted JPS61166149A (ja) 1985-01-18 1985-01-18 多層混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS61166149A (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02117079A (ja) * 1988-10-27 1990-05-01 Mazda Motor Corp 金属基板を有する集積回路のコネクタ構造
JP2760831B2 (ja) * 1989-01-30 1998-06-04 三洋電機株式会社 金属基板を有する集積回路のコネクタ構造
JPH02220376A (ja) * 1989-02-20 1990-09-03 Mazda Motor Corp 金属基板を有する集積回路のコネクタ構造
JPH02226675A (ja) * 1989-02-28 1990-09-10 Sanyo Electric Co Ltd 混成集積回路の固定構造
CN114900951B (zh) * 2022-06-08 2022-11-25 东莞光阳兴业电子配件有限公司 一种便于连接且可分离的双面fpc板及连接及分离方法

Also Published As

Publication number Publication date
JPS61166149A (ja) 1986-07-26

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