JPH0558564B2 - - Google Patents
Info
- Publication number
- JPH0558564B2 JPH0558564B2 JP2155286A JP2155286A JPH0558564B2 JP H0558564 B2 JPH0558564 B2 JP H0558564B2 JP 2155286 A JP2155286 A JP 2155286A JP 2155286 A JP2155286 A JP 2155286A JP H0558564 B2 JPH0558564 B2 JP H0558564B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- forming
- opening
- contact hole
- bpsg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2155286A JPS62179723A (ja) | 1986-02-03 | 1986-02-03 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2155286A JPS62179723A (ja) | 1986-02-03 | 1986-02-03 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62179723A JPS62179723A (ja) | 1987-08-06 |
JPH0558564B2 true JPH0558564B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-08-26 |
Family
ID=12058161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2155286A Granted JPS62179723A (ja) | 1986-02-03 | 1986-02-03 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62179723A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9021535B2 (en) | 2006-06-13 | 2015-04-28 | Time Warner Cable Enterprises Llc | Methods and apparatus for providing virtual content over a network |
US9386327B2 (en) | 2006-05-24 | 2016-07-05 | Time Warner Cable Enterprises Llc | Secondary content insertion apparatus and methods |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01298765A (ja) * | 1988-05-27 | 1989-12-01 | Fujitsu Ltd | 半導体装置及びその製造方法 |
-
1986
- 1986-02-03 JP JP2155286A patent/JPS62179723A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9386327B2 (en) | 2006-05-24 | 2016-07-05 | Time Warner Cable Enterprises Llc | Secondary content insertion apparatus and methods |
US9021535B2 (en) | 2006-06-13 | 2015-04-28 | Time Warner Cable Enterprises Llc | Methods and apparatus for providing virtual content over a network |
Also Published As
Publication number | Publication date |
---|---|
JPS62179723A (ja) | 1987-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0380327A2 (en) | Structure of semiconductor device with funnel-shaped inter-level connection | |
EP0076105A2 (en) | Method of producing a bipolar transistor | |
JPH05343404A (ja) | 半導体装置 | |
JP2892421B2 (ja) | 半導体素子の製造方法 | |
JPH0558564B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPS609159A (ja) | 半導体装置 | |
JPS6381948A (ja) | 多層配線半導体装置 | |
US5136361A (en) | Stratified interconnect structure for integrated circuits | |
KR900001247B1 (ko) | 반도체 장치 | |
JP2785557B2 (ja) | 半導体装置の製造方法 | |
JPH0587144B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
WO1984001471A1 (en) | An aluminum-metal silicide interconnect structure for integrated circuits and method of manufacture thereof | |
KR970005729B1 (ko) | 반도체 장치의 제조방법 | |
JPS6160580B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
EP0264309B1 (en) | Self-aligned base shunt for transistor | |
JP3688335B2 (ja) | 半導体集積回路装置およびその製造方法ならびに半導体ウエハ | |
JPS63111665A (ja) | 半導体装置 | |
JP3801773B2 (ja) | バイポーラトランジスタの製造方法 | |
JPS61164240A (ja) | 半導体集積回路装置 | |
JPH01230269A (ja) | 半導体集積回路装置 | |
JPH05198789A (ja) | 半導体装置の製造方法 | |
JPS6295869A (ja) | 半導体装置 | |
JPS63104448A (ja) | 半導体集積回路装置 | |
JPS62262443A (ja) | 半導体装置およびその製造方法 | |
JPH08107207A (ja) | 半導体装置の製造方法 |