JPH0555367B2 - - Google Patents
Info
- Publication number
- JPH0555367B2 JPH0555367B2 JP3803786A JP3803786A JPH0555367B2 JP H0555367 B2 JPH0555367 B2 JP H0555367B2 JP 3803786 A JP3803786 A JP 3803786A JP 3803786 A JP3803786 A JP 3803786A JP H0555367 B2 JPH0555367 B2 JP H0555367B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- tape
- tie bar
- lead
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011990 functional testing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3803786A JPS62208318A (ja) | 1986-02-21 | 1986-02-21 | 電子部品のテ−ピング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3803786A JPS62208318A (ja) | 1986-02-21 | 1986-02-21 | 電子部品のテ−ピング方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6158300A Division JP2637369B2 (ja) | 1994-07-11 | 1994-07-11 | 電子部品のテーピング方法 |
| JP6158444A Division JP2637370B2 (ja) | 1994-07-11 | 1994-07-11 | 電子部品のテーピング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62208318A JPS62208318A (ja) | 1987-09-12 |
| JPH0555367B2 true JPH0555367B2 (cs) | 1993-08-16 |
Family
ID=12514335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3803786A Granted JPS62208318A (ja) | 1986-02-21 | 1986-02-21 | 電子部品のテ−ピング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62208318A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6312418A (ja) * | 1986-06-30 | 1988-01-19 | 日本電気株式会社 | 半導体装置のテ−ピング方法 |
-
1986
- 1986-02-21 JP JP3803786A patent/JPS62208318A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62208318A (ja) | 1987-09-12 |
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