JPH0555277A - Method and apparatus for curing - Google Patents
Method and apparatus for curingInfo
- Publication number
- JPH0555277A JPH0555277A JP21775991A JP21775991A JPH0555277A JP H0555277 A JPH0555277 A JP H0555277A JP 21775991 A JP21775991 A JP 21775991A JP 21775991 A JP21775991 A JP 21775991A JP H0555277 A JPH0555277 A JP H0555277A
- Authority
- JP
- Japan
- Prior art keywords
- furnace
- curing
- gas
- adhesive
- gas concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば半導体装置の製
造過程の中でリードフレームに半導体ペレットをエポキ
シ樹脂系導電接着剤で固着する際に用いられるキュア方
法及びキュア装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a curing method and a curing device used for fixing a semiconductor pellet to a lead frame with an epoxy resin type conductive adhesive in the manufacturing process of a semiconductor device.
【０００２】[0002]
【従来の技術】従来より知られているように、例えばリ
ードフレームへの半導体ペレットの固着は、両者の間に
熱硬化性接着剤のエポキシ樹脂系導電接着剤を介在さ
せ、これを加熱硬化させることによって行っていた。2. Description of the Related Art As is conventionally known, for example, a semiconductor pellet is fixed to a lead frame by interposing an epoxy resin-based conductive adhesive, which is a thermosetting adhesive, between them and heat-curing the same. I was going by.
【０００３】以下、従来の技術について図３を参照して
説明する。図３はキュア装置の概略構成図で、図におい
て外箱１の中には炉２がその周囲を断熱材３で覆われて
設けられ、炉２の内壁には炉内を窒素ガス（Ｎ2 ）雰囲
気に維持しておくために換気する換気入口４及び換気出
口５が開口している。また炉２の内部にはヒータ６が配
設されており、ヒータ６は温度調節器７により制御され
ることによって炉内温度が所定の温度を維持するように
なっている。また別にタイマ８とブザー９が設けられて
いて、タイマ８で設定した時間が経過するとブザー９が
動作して音を発するようになっている。なお炉２の内部
に、半導体ペレット１０をエポキシ樹脂系導電接着剤１
１を介在させて載置した多数のリードフレーム１２が、
マガジン１３の棚に収納されて投入できるようになって
いる。A conventional technique will be described below with reference to FIG. FIG. 3 is a schematic configuration diagram of the curing device. In the figure, a furnace 2 is provided in an outer box 1 with its periphery covered with a heat insulating material 3, and the inner wall of the furnace 2 is filled with nitrogen gas (N 2 ) A ventilation inlet 4 and a ventilation outlet 5 for ventilation to maintain the atmosphere are opened. Further, a heater 6 is arranged inside the furnace 2, and the heater 6 is controlled by a temperature controller 7 so that the temperature inside the furnace is maintained at a predetermined temperature. Further, a timer 8 and a buzzer 9 are separately provided, and when the time set by the timer 8 elapses, the buzzer 9 operates and emits a sound. Inside the furnace 2, the semiconductor pellets 10 and the epoxy resin conductive adhesive 1
A large number of lead frames 12 placed with 1 interposed
The magazine 13 is stored in the shelves and can be loaded.
【０００４】そして、上記のように構成されたキュア装
置を用いたリードフレーム１２への半導体ペレット１０
の固着は次のように行われる。Then, the semiconductor pellets 10 on the lead frame 12 using the curing device configured as described above are used.
Is fixed as follows.
【０００５】すなわち、先ず、リードフレーム１２に所
定粘度に調整された未硬化のエポキシ樹脂系導電接着剤
１１を数ｍｇ付着させ、付着されたエポキシ樹脂系導電
接着剤１１上に半導体ペレット１０を貼付する。続いて
半導体ペレット１０を貼付した複数のリードフレーム１
２をマガジン１３の棚に間隙を設けて収納する。That is, first, several mg of an uncured epoxy resin-based conductive adhesive 11 adjusted to have a predetermined viscosity is attached to the lead frame 12, and the semiconductor pellet 10 is attached onto the attached epoxy resin-based conductive adhesive 11. To do. Then, a plurality of lead frames 1 to which the semiconductor pellets 10 are attached
2 is stored on the shelf of the magazine 13 with a space provided.
【０００６】次に、リードフレーム１２が収納された多
数のマガジン１３を所定の加熱処理温度、例えば１５０
℃に維持された炉２の内部に投入する。そして予め実験
や量産試験などで先行して確認されたキュア時間をタイ
マ８に設定して炉２の内部での加熱硬化を開始させる。
所定の炉内温度１５０℃を維持し、タイマ８に設定した
キュア時間が経過した時点でタイマ８に連動するブザー
９が動作し、設定した時間が経過したことを音を発する
ことで作業者に通知する。これにより炉２の内部からリ
ードフレーム１２が収納されたマガジン１３を取り出
し、エポキシ樹脂系導電接着剤１１が硬化して半導体ペ
レット１０が接着されたリードフレーム１２を得る。Next, a large number of magazines 13 in which the lead frames 12 are stored are set at a predetermined heat treatment temperature, for example, 150.
It is charged into the inside of the furnace 2 maintained at ℃. Then, the curing time previously confirmed in the experiment or mass production test is set in the timer 8 to start the heating and curing in the furnace 2.
Maintaining a predetermined furnace temperature of 150 ° C, the buzzer 9 linked to the timer 8 operates at the time when the cure time set in the timer 8 has elapsed, and sounds to the operator that the set time has elapsed. Notice. As a result, the magazine 13 accommodating the lead frame 12 is taken out of the furnace 2, and the epoxy resin conductive adhesive 11 is cured to obtain the lead frame 12 to which the semiconductor pellets 10 are adhered.
【０００７】しかしながら上記の従来技術においては、
予め求められたキュア時間を炉２の内部にリードフレー
ム１２等を投入し硬化処理を行う都度タイマ８に所定時
間を設定している。それで、半導体ペレット１０を固着
する個々の部位ごとにエポキシ樹脂系導電接着剤１１の
量のばらつきが生じた時には、その中のあるものにおい
ては処理時間不足でエポキシ樹脂系導電接着剤１１が硬
化未了のままの状態で炉２の外に取り出されてしまうも
のがある。そして硬化未了のままでは半導体装置として
接着強度不足となってしまう問題が生じ、製造の歩留が
低く、製品の信頼性を低下させてしまう。また、接着強
度不足をなくすためエポキシ樹脂系導電接着剤１１の硬
化が十分に行われるよう、余裕度を多くとり、例えば
１．５時間とキュア時間を長目に設定すると量産性が悪
くなってしまう問題がある。さらに、処理毎に作業者が
キュア時間などの設定を行うため、半導体ペレット１０
の種類や使用する接着剤の種類などが変わってキュア時
間が異なる場合を含め、時間設定を忘れる場合や誤った
時間を設定してしまう場合が生じ、接着剤の硬化が不十
分であったり、半導体ペレットを破損してしまう等の虞
がある。However, in the above prior art,
A predetermined time is set in the timer 8 every time the lead frame 12 or the like is put into the furnace 2 and the curing process is performed for the previously determined curing time. Therefore, when the amount of the epoxy resin-based conductive adhesive 11 varies among the individual parts to which the semiconductor pellet 10 is fixed, in some of them, the processing time is insufficient and the epoxy resin-based conductive adhesive 11 is not cured. Some of them are taken out of the furnace 2 in the state of being finished. If the curing is not completed, there arises a problem that the adhesive strength of the semiconductor device becomes insufficient, the manufacturing yield is low, and the reliability of the product is reduced. Further, if a large margin is set so that the epoxy resin-based conductive adhesive 11 is sufficiently cured to eliminate insufficient adhesive strength, for example, 1.5 hours and a curing time are set to be long, mass productivity deteriorates. There is a problem. Further, since the worker sets the curing time and the like for each treatment, the semiconductor pellet 10
In some cases, such as when the curing time differs due to changes in the type of adhesive or the type of adhesive used, the time setting may be forgotten or the wrong time may be set, resulting in insufficient curing of the adhesive, There is a risk that the semiconductor pellet will be damaged.
【０００８】[0008]
【発明が解決しようとする課題】上記のようなキュア時
間の設定に伴う接着不良の発生、あるいはキュア時間を
長目に設定したときには量産性が悪化してしまうなどの
状況に鑑みて本発明はなされたもので、その目的とする
ところはキュア時間の設定の繁雑さを除いて接着不良の
発生を防止し、製造の歩留及び製品の信頼性を向上させ
られると共に、量産性が高いキュア方法及びキュア装置
を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the situation that the adhesion failure occurs due to the setting of the curing time as described above, or the mass productivity deteriorates when the curing time is set to a long time. The purpose of this curing method is to prevent the occurrence of defective adhesion except for the complicated setting of the curing time, improve the manufacturing yield and the reliability of the product, and have a high mass productivity. And to provide a curing device.
【０００９】[0009]
【課題を解決するための手段】本発明のキュア方法及び
キュア装置は、被接着体と接着基体とを熱硬化性接着剤
を間に介在させて炉内で該熱硬化性接着剤を加熱硬化さ
せ、被接着体を接着基体に接着するのに際し、炉内を換
気しながら加熱して該炉内の熱硬化性接着剤からの硬化
に伴う発生ガスの量が所定値以下になった時点で被接着
体と接着基体との接着を終了するようにしたことを特徴
としており、また、内部が加熱されるように形成された
炉と、この炉内を連続的に換気する換気手段と、炉内に
設けられた熱硬化性接着剤からの硬化に伴う発生ガス濃
度を検出するガス濃度検出手段と、このガス濃度検出手
段の検出結果に基づき炉の運転を停止するように制御す
る制御手段とを備えていることを特徴とするものであ
る。A curing method and a curing device of the present invention are such that a thermosetting adhesive is interposed between an adherend and an adhesive substrate, and the thermosetting adhesive is heat-cured in a furnace. Then, when adhering the adherend to the adhesive substrate, at the time when the amount of gas generated by curing from the thermosetting adhesive in the furnace becomes less than a predetermined value by heating while ventilating the inside of the furnace. The present invention is characterized in that the adhesion between the adherend and the adhesive substrate is terminated, and a furnace formed to heat the inside, a ventilation means for continuously ventilating the inside of the furnace, and a furnace A gas concentration detecting means for detecting a gas concentration generated by curing from a thermosetting adhesive provided therein, and a control means for controlling to stop the operation of the furnace based on the detection result of the gas concentration detecting means; It is characterized by having.
【００１０】[0010]
【作用】上記のように構成されたキュア方法及びキュア
装置は、炉内で熱硬化性接着剤を加熱硬化させて被接着
体を接着基体に接着する際に、熱硬化性接着剤からは硬
化に伴いガスが発生する。この発生ガスの量を炉内を換
気しながら検知していて、炉内の発生ガスの量が所定値
以下になったことが知ることができることにより、全て
の被接着体と接着基体との熱硬化性接着剤の硬化が終了
したことが判る。そのため炉内の発生ガス量を知ること
によって接着の終了が確認できる。また、連続的に換気
する換気手段が設けられ内部が加熱可能な炉に熱硬化性
接着剤の硬化で発生するガスに対するガス濃度検出手段
を設け、検出結果に基づき炉の運転を制御するようにし
ているので、炉内に投入された全ての被接着体と接着基
体との間に介在する熱硬化性接着剤は加熱されて硬化
し、ガス濃度が検出出来ない程度にまで低下した時点で
熱硬化性接着剤の硬化が終了したことで判る。そのため
製品の接着不良が防止でき、信頼性が向上し、量産性を
高めることができる。The curing method and the curing device configured as described above cure the thermosetting adhesive from the thermosetting adhesive when the thermosetting adhesive is heated and cured in the furnace to bond the adherend to the adhesive substrate. Along with that, gas is generated. By detecting the amount of this generated gas while ventilating the inside of the furnace and knowing that the amount of the generated gas in the furnace has fallen below a predetermined value, the heat of all the adherends and the bonding substrate can be detected. It can be seen that the curing of the curable adhesive is completed. Therefore, the completion of bonding can be confirmed by knowing the amount of gas generated in the furnace. In addition, a ventilation means for continuous ventilation is provided and a furnace whose inside can be heated is provided with gas concentration detection means for the gas generated by curing of the thermosetting adhesive, and the operation of the furnace is controlled based on the detection result. As a result, the thermosetting adhesive that is placed between all the adherends and the adhesive substrate placed in the furnace is heated and hardened, and heat is applied when the gas concentration drops to an undetectable level. It can be seen that the curing of the curable adhesive is completed. Therefore, defective adhesion of products can be prevented, reliability can be improved, and mass productivity can be improved.
【００１１】[0011]
【実施例】以下、本発明の一実施例を図１及び図２を参
照して説明する。図１はキュア装置の概略構成図であ
り、図２は特性図である。図において外箱２１の中には
略中央部に炉２２がその周囲を断熱材２３で覆われて設
けられ、炉２２の前面側には炉２２の内部に被加熱物を
出し入れする開口部が設けられており、この開口部は図
示しない前扉で閉塞されるようになっている。また炉２
２の内壁には炉内を窒素ガス（Ｎ2 ）雰囲気に維持して
おくために換気する換気入口２４及び換気出口２５が開
口しており、換気入口２４には図示しない窒素ガス源か
ら連続的に窒素ガスが供給されるようになっている。さ
らに炉２２の内部には炉内を加熱するためのヒータ２６
が配設されており、ヒータ２６は温度調節器２７により
通電量が制御され、設定された所定の炉内温度を維持す
るようになっている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a schematic configuration diagram of the curing device, and FIG. 2 is a characteristic diagram. In the figure, a furnace 22 is provided in the outer box 21 in a substantially central portion with its periphery covered with a heat insulating material 23, and an opening portion for loading and unloading an object to be heated into and out of the furnace 22 is provided on the front side of the furnace 22. It is provided, and this opening is closed by a front door (not shown). Also furnace 2
A ventilation inlet 24 and a ventilation outlet 25 for ventilating in order to maintain the inside of the furnace in a nitrogen gas (N 2 ) atmosphere are opened on the inner wall of No. 2, and the ventilation inlet 24 is continuously connected from a nitrogen gas source (not shown). Nitrogen gas is supplied to the. Further, inside the furnace 22, a heater 26 for heating the inside of the furnace is provided.
The temperature of the heater 26 is controlled by the temperature controller 27 so that the heater 26 maintains a predetermined temperature in the furnace.
【００１２】また、炉２２の内上部で換気出口２５の近
傍には炉内のガス濃度を検出するためのガス濃度検出手
段としてのガスセンサ２８が配設されており、このガス
センサ２８によってエポキシ樹脂系導電接着剤が加熱さ
れて硬化するときに発生する溶剤成分のガスの検出が行
われる。ガスセンサ２８の出力信号はガス濃度検出器２
９に入力されてガス濃度データに変換され、さらに制御
器３０に出力されるようになっている。制御器３０はガ
スセンサ２８の出力信号が炉内のガス濃度に対応して所
定値以下になったとき、あるいは出力信号が所定値以下
になり所定時間経過した後にヒータ２６での加熱を停止
しキュア装置の運転を止めるように制御する。また制御
器３０にはブザー３１が接続されていて、制御器３０で
キュア装置の運転を止める制御が行われ、キュア時間が
終了するとブザー３１が動作して音を発するよう設定で
きるようになっている。Further, a gas sensor 28 as a gas concentration detecting means for detecting the gas concentration in the furnace is provided near the ventilation outlet 25 in the upper part of the furnace 22. The gas of the solvent component generated when the conductive adhesive is heated and cured is detected. The output signal of the gas sensor 28 is the gas concentration detector 2
The gas concentration data is input to the converter 9, converted into gas concentration data, and further output to the controller 30. The controller 30 stops the heating by the heater 26 when the output signal of the gas sensor 28 becomes a predetermined value or less corresponding to the gas concentration in the furnace, or after the output signal becomes the predetermined value or less and a predetermined time passes, and the heating by the heater 26 is stopped. Control to stop the operation of the equipment. Further, a buzzer 31 is connected to the controller 30, and the controller 30 controls to stop the operation of the curing device. When the curing time ends, the buzzer 31 operates so that a sound can be generated. There is.
【００１３】なお、炉２２の内部に、被接着体の半導体
ペレット３２をエポキシ樹脂系導電接着剤３３を介在さ
せて載置した多数の接着基体のリードフレーム３４が、
マガジン３５の棚に収納されて投入できるようになって
いる。It should be noted that a large number of lead frames 34 of an adhesive base, in which the semiconductor pellets 32 to be adhered are placed inside the furnace 22 with an epoxy resin type conductive adhesive 33 interposed,
The magazine 35 can be stored in the shelves and loaded.
【００１４】そして、上記のように構成された本発明の
キュア装置を用いたリードフレーム３４への半導体ペレ
ット３２の固着は次のように行われる。Then, the semiconductor pellet 32 is fixed to the lead frame 34 by using the curing device of the present invention having the above-mentioned structure.
【００１５】すなわち、先ず、リードフレーム３４に所
定粘度に調整された未硬化のエポキシ樹脂系導電接着剤
３３を半導体ペレット３２を貼付する位置に数ｍｇ付着
させ、付着されたエポキシ樹脂系導電接着剤３３上に半
導体ペレット３２を貼付する。続いて半導体ペレット３
２を貼付した複数のリードフレーム３４をマガジン３５
の棚に間隙を設けて収納する。That is, first, a few mg of the uncured epoxy resin type conductive adhesive 33 adjusted to a predetermined viscosity is attached to the lead frame 34 at the position where the semiconductor pellet 32 is attached, and the attached epoxy resin type conductive adhesive is attached. The semiconductor pellet 32 is attached onto 33. Then semiconductor pellet 3
A plurality of lead frames 34 to which 2 is attached are attached to a magazine 35.
Make a space on the shelves to store.
【００１６】次に、半導体ペレット３２が貼付されたリ
ードフレーム３４が収納された多数のマガジン３５を所
定の加熱処理温度、例えば１５０℃に維持され、窒素ガ
スが換気入口２４から供給され換気出口２５から排出す
るように通流し、換気されている炉２２の内部に投入す
る。Next, a large number of magazines 35 accommodating the lead frames 34 to which the semiconductor pellets 32 are attached are maintained at a predetermined heat treatment temperature, for example, 150 ° C., nitrogen gas is supplied from the ventilation inlet 24 and the ventilation outlet 25. It is introduced into the inside of the furnace 22 that is ventilated and ventilated.
【００１７】マガジン３５を投入すると、半導体ペレッ
ト３２とリードフレーム３４の間に介在するエポキシ樹
脂系導電接着剤３３が加熱され、その溶剤が溶剤成分の
ガスとなって炉２２の内部に放出される。これにより炉
２２の内部の溶剤成分のガスはガスセンサ２８で検出さ
れ、その信号はガス濃度検出器２９に入力されてガス濃
度データに変換され、制御器３０に出力される。この溶
剤成分のガスの濃度は図２に横軸に経過時間をとり縦軸
にガス濃度をとって示す特性図のように、ガス濃度は投
入当初の時間ｔ1 から急激に増加するが、換気量との関
係から途中から減少に転じる。溶剤成分のガスの放出と
共にエポキシ樹脂系導電接着剤３３の硬化が進行し、約
３０分後にガスの放出がほとんどなくなって所定の接着
強度が得られる状態となり、これにともない炉２２の内
部がガスセンサ２８での検出限界以下のガス濃度となっ
てエポキシ樹脂系導電接着剤３３の硬化が終了し、さら
に放置時間をとって時間ｔ2 でキュア時間を終了する。When the magazine 35 is put in, the epoxy resin type conductive adhesive 33 interposed between the semiconductor pellet 32 and the lead frame 34 is heated, and the solvent becomes a solvent component gas and is discharged into the furnace 22. .. As a result, the gas of the solvent component inside the furnace 22 is detected by the gas sensor 28, and the signal is input to the gas concentration detector 29, converted into gas concentration data, and output to the controller 30. The concentration of the gas of the solvent component like a characteristic diagram showing taking gas concentration on the vertical axis represents the elapsed time on the horizontal axis in FIG. 2, the gas concentration is abruptly increased from the input initial time t 1, the ventilation Due to the relationship with the amount, it starts to decrease from the middle. The curing of the epoxy resin-based conductive adhesive 33 progresses with the release of the solvent component gas, and after about 30 minutes, the release of gas has almost disappeared and a predetermined adhesive strength can be obtained. At a gas concentration below the detection limit at 28, the curing of the epoxy resin-based conductive adhesive 33 is completed, and after a standing time, the curing time is completed at time t 2 .
【００１８】キュア時間の終了によって制御器３０での
キュア装置の運転を止める制御が行われ、ブザー３１が
動作してキュア時間の終了を作業者に告げる。これによ
り炉２２の内部からリードフレーム３４が収納されたマ
ガジン３５を取り出し、エポキシ樹脂系導電接着剤３３
が硬化して半導体ペレット３２が接着されたリードフレ
ーム３４を得る。When the cure time ends, the controller 30 controls the operation of the cure device to stop, and the buzzer 31 operates to notify the operator of the end of the cure time. As a result, the magazine 35 accommodating the lead frame 34 is taken out from the inside of the furnace 22, and the epoxy resin conductive adhesive 33
Is cured to obtain the lead frame 34 to which the semiconductor pellet 32 is adhered.
【００１９】以上のように構成された本発明によれば、
エポキシ樹脂系導電接着剤３３の硬化に伴ってその溶剤
が炉２２の内部に溶剤成分のガスとなって放出され、ガ
ス放出の終了によって硬化が終了するのを、ガスセンサ
２８を設けこれによって炉内のガス濃度の変化を検出し
て確認するようにしている。このため予めキュア時間を
求める必要もなく、炉２２の内部にリードフレーム３４
等を投入し硬化処理を行う都度キュア時間を設定する必
要もない。またリードフレーム３４に付着されたエポキ
シ樹脂系導電接着剤３３の量にかかわらず、全てが硬化
を完了した時点でキュア時間を終え、リードフレーム３
４への半導体ペレット３２の接着を実施することができ
る。そして確実に全てのものの硬化の完了が確認できる
ので、製造の歩留が及び製品の信頼性を向上させること
ができ、さらに余裕度を大幅にみたキュア時間の設定が
不要になり量産性を高めることができる。According to the present invention configured as described above,
With the curing of the epoxy resin conductive adhesive 33, the solvent is released into the furnace 22 as a gas of a solvent component, and when the gas release is completed, the curing is completed. The change in the gas concentration of is detected and confirmed. Therefore, it is not necessary to obtain the curing time in advance, and the lead frame 34 is placed inside the furnace 22.
It is not necessary to set the curing time each time the ingredients are charged and the curing treatment is performed. Further, regardless of the amount of the epoxy resin-based conductive adhesive 33 attached to the lead frame 34, the curing time ends when all of the lead frame 3 is completely cured.
Adhesion of the semiconductor pellets 32 to the 4 can be carried out. And since it is possible to reliably confirm the completion of curing of all things, it is possible to improve the production yield and the reliability of the product, and it is not necessary to set the cure time with a large margin, thus improving mass productivity. be able to.
【００２０】尚、上記の実施例においては、ガス濃度が
検出されなくなりエポキシ樹脂系導電接着剤３３の硬化
が終了した後、さらに放置時間をとってキュア時間を終
了するようにしているが必ずしも放置時間を取る必要が
なく、また炉２２の内部へのリードフレーム３４等の収
納されたマガジン３５の投入や取り出しを自動化し連続
的に硬化処理が行えるようにしてもよい等、要旨を逸脱
しない範囲内で本発明は適宜変更して実施し得るもので
ある。In the above embodiment, after the gas concentration is no longer detected and the curing of the epoxy resin type conductive adhesive 33 is completed, the curing time is terminated by further allowing a standing time. A range that does not depart from the gist such that it is not necessary to take time, and that the curing process may be continuously performed by automatically loading and unloading the magazine 35 in which the lead frame 34 and the like are stored in the furnace 22. The present invention can be implemented by appropriately changing it.
【００２１】[0021]
【発明の効果】以上の説明から明らかなように、本発明
は、炉内の熱硬化性接着剤からの硬化に伴う発生ガスを
ガス濃度検出手段によって検出し、検出量が所定値以下
になった時点で炉の運転を停止し、被接着体と接着基体
との接着を終了するように構成したことにより、処理作
業における繁雑さがなく、接着不良の発生が防止でき、
製造の歩留及び製品の信頼性が向上し、さらに量産性が
高い等の効果が得られる。As is apparent from the above description, according to the present invention, the gas generated by the curing of the thermosetting adhesive in the furnace is detected by the gas concentration detecting means, and the detected amount becomes the predetermined value or less. At this point, the operation of the furnace is stopped and the bonding between the adherend and the bonding substrate is completed, so that there is no complexity in the processing work and the occurrence of defective adhesion can be prevented.
The yield of manufacture and the reliability of the product are improved, and the mass productivity is high.
【図１】本発明の一実施例を示す概略構成図である。FIG. 1 is a schematic configuration diagram showing an embodiment of the present invention.
【図２】本発明の一実施例に係わるガス濃度を示す特性
図である。FIG. 2 is a characteristic diagram showing a gas concentration according to an embodiment of the present invention.
【図３】従来技術を示す概略構成図である。FIG. 3 is a schematic configuration diagram showing a conventional technique.
２２…炉 ２４…換気入口 ２５…換気出口 ２６…ヒータ ２７…温度調節器 ２８…ガスセンサ ２９…ガス検出器 ３０…制御器 ３２…半導体ペレット（被接着体） ３３…エポキシ樹脂系導電接着剤（熱硬化性接着剤） ３４…リードフレーム（接着基体） 22 ... Furnace 24 ... Ventilation inlet 25 ... Ventilation outlet 26 ... Heater 27 ... Temperature controller 28 ... Gas sensor 29 ... Gas detector 30 ... Controller 32 ... Semiconductor pellet (adhered body) 33 ... Epoxy resin-based conductive adhesive (heat Curable adhesive) 34 ... Lead frame (adhesive substrate)
Claims (2)
を間に介在させて炉内で該熱硬化性接着剤を加熱硬化さ
せ、前記被接着体を前記接着基体に接着するのに際し、
前記炉内を換気しながら加熱して該炉内の前記熱硬化性
接着剤からの硬化に伴う発生ガスの量が所定値以下にな
った時点で前記被接着体と前記接着基体との接着を終了
するようにしたことを特徴とするキュア方法。1. A thermosetting adhesive is interposed between an adherend and an adhesive substrate to heat-cur the thermosetting adhesive in a furnace to bond the adherend to the adhesive substrate. On the occasion of
When the amount of gas generated by curing from the thermosetting adhesive in the furnace is heated while ventilating the inside of the furnace and becomes less than or equal to a predetermined value, the adherend is adhered to the adhered substrate. A curing method characterized by being completed.
と、この炉内を連続的に換気する換気手段と、前記炉内
に設けられた熱硬化性接着剤からの硬化に伴う発生ガス
濃度を検出するガス濃度検出手段と、このガス濃度検出
手段の検出結果に基づき前記炉の運転を停止するように
制御する制御手段とを備えていることを特徴とするキュ
ア装置。2. A furnace whose inside is heated, a ventilation means for continuously ventilating the inside of the furnace, and a gas generated by hardening from a thermosetting adhesive provided in the furnace. A curing device comprising: a gas concentration detecting means for detecting the concentration; and a control means for controlling the operation of the furnace to be stopped based on the detection result of the gas concentration detecting means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21775991A JPH0555277A (en) | 1991-08-29 | 1991-08-29 | Method and apparatus for curing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21775991A JPH0555277A (en) | 1991-08-29 | 1991-08-29 | Method and apparatus for curing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0555277A true JPH0555277A (en) | 1993-03-05 |
Family
ID=16709297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21775991A Withdrawn JPH0555277A (en) | 1991-08-29 | 1991-08-29 | Method and apparatus for curing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0555277A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0849773A1 (en) * | 1996-12-18 | 1998-06-24 | Texas Instruments Incorporated | Die attach material curing apparatus |
| WO2008149609A1 (en) * | 2007-06-05 | 2008-12-11 | Lintec Corporation | Apparatus and method for bonding semiconductor chip |
| JP2011066438A (en) * | 2010-11-05 | 2011-03-31 | Lintec Corp | Device and method for bonding semiconductor chip |
| WO2018143222A1 (en) * | 2017-01-31 | 2018-08-09 | 株式会社新川 | Semiconductor chip mounting apparatus and semiconductor chip mounting method |
| JP2019096534A (en) * | 2017-11-27 | 2019-06-20 | トヨタ自動車株式会社 | Method for manufacturing fuel cell |
-
1991
- 1991-08-29 JP JP21775991A patent/JPH0555277A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0849773A1 (en) * | 1996-12-18 | 1998-06-24 | Texas Instruments Incorporated | Die attach material curing apparatus |
| US5993591A (en) * | 1996-12-18 | 1999-11-30 | Texas Instruments Incorporated | Coring of leadframes in carriers via radiant heat source |
| WO2008149609A1 (en) * | 2007-06-05 | 2008-12-11 | Lintec Corporation | Apparatus and method for bonding semiconductor chip |
| JP2008305842A (en) * | 2007-06-05 | 2008-12-18 | Lintec Corp | Semiconductor chip bonding apparatus and semiconductor chip bonding method |
| JP4625828B2 (en) * | 2007-06-05 | 2011-02-02 | リンテック株式会社 | Semiconductor chip bonding apparatus and bonding method |
| TWI459479B (en) * | 2007-06-05 | 2014-11-01 | Lintec Corp | A semiconductor wafer followed by a device and a subsequent method |
| JP2011066438A (en) * | 2010-11-05 | 2011-03-31 | Lintec Corp | Device and method for bonding semiconductor chip |
| WO2018143222A1 (en) * | 2017-01-31 | 2018-08-09 | 株式会社新川 | Semiconductor chip mounting apparatus and semiconductor chip mounting method |
| US10978420B2 (en) | 2017-01-31 | 2021-04-13 | Shinkawa Ltd. | Semiconductor chip mounting apparatus and semiconductor chip mounting method |
| JP2019096534A (en) * | 2017-11-27 | 2019-06-20 | トヨタ自動車株式会社 | Method for manufacturing fuel cell |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19981112 |