JP2001060594A - Manufacture of semiconductor device and baking apparatus used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress occupancy area and baking time, and at the same time to surely perform baking. SOLUTION: A baking apparatus 30 has first, second, and intermediate ovens 31, 32, and 33 respectively, arranged in series, and first and second shielding doors 35 and 39 are included on the partition wall between the first and middle ovens 31 and 33 and the second oven 32. The first oven 31 is heated to approximately 80 deg.C by a first heater 36, the second oven 32 is heated to approximately 150 deg.C by a second heater 40, and the middle oven 33 is heated to 80 to 150 deg.C. First, second, and middle conveyers 37, 41, and 43 provided in the ovens 31, 32, and 33, respectively, are synchronized with each another. A carrier tool 14, that holds a tape carrier where a resin application part 16 is formed, is accommodated into a magazine 20, and the magazine 20 is made to successively pass through the first, middle, and second ovens 31, 33, and 32 and is baked, thus shortening the entire length of the baking device, and at the same time, securing the desired baking temperature and time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for manufacturing a semiconductor device, and more particularly to a technique for causing a resin (hereinafter, referred to as resin) to react and cure (hereinafter, referred to as baking) by heat treatment. Semiconductor chip (hereinafter referred to as a chip) in which an integrated circuit including
The present invention relates to a technique effective for baking a resin applied to a connection portion between an electrode pad and an inner lead.

[0002]

2. Description of the Related Art As electronic devices using semiconductor integrated circuit devices (hereinafter referred to as ICs) have become smaller and thinner, ICs have been developed.
There is a demand for a smaller package. In order to meet this demand, various chip size packages (hereinafter, referred to as CSPs), which are packages having a size equal to or substantially equal to the size of a chip, have been developed. As an example, there is a micro ball grid array package (hereinafter referred to as μBGA) configured as follows. That is, a tape carrier is mechanically connected to the main surface on the electrode pad side of the chip by an insulating film, each inner lead laid on the tape carrier is bonded to each electrode pad of the chip, and the electrode pad of the chip is connected to the inner lead. A resin as a potting material is applied to the connection portion with the resin. The applied resin is cured by baking. The connection between the electrode pad of the chip and the inner lead is in a resin-sealed state by the resin sealing body formed by applying and baking the resin. The outer leads connected to the respective inner leads are provided with bumps as external terminals by soldering.

Since the μBGA has a tape carrier, it is also an example of a tape carrier package (TCP), and a tape transport is used as a transport format. In the case of the tape transport system, the baking step of baking the applied resin is performed by passing the tape through a baking furnace. By the way, μBG
IC having A (hereinafter referred to as μBGA · IC)
In the manufacturing method of (1), by handling the tape carrier by a carrier jig, a quad flat package (QF) widely used for handling is widely used.
It is intended to be able to be implemented similarly to P). When a carrier jig is used, the baking process is performed by passing the carrier jigs one by one through a baking furnace, or by storing a magazine containing a plurality of carrier jigs in a baking furnace and performing batch processing. It is processed.

As an example describing the potting technique and the baking (cure) technique of TCP, see “Practical Course VLSI” published by Nikkei BP May 31, 1993.
Packaging technology (bottom) "P96 to P100.

[0005]

In the above-described baking step using a carrier jig, when baking is performed one by one through a baking furnace one by one in the same manner as in the tape transport system, the baking furnace becomes long. However, the occupied floor area becomes large. On the other hand, when a plurality of carrier jigs are stored in a magazine and subjected to batch processing, a long time is wasted in fixing or changing the baking temperature.

An object of the present invention is to provide a baking technique capable of reliably performing baking while suppressing the area occupied by a baking furnace and the baking time.

[0007] The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0008]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

[0009] That is, a magazine containing a plurality of objects to be baked is sequentially passed through a plurality of baking furnaces and baked.

For example, a plurality of objects to be baked in a magazine are baked in a low-temperature region in a first-stage baking furnace for a long time, and baked in a high-temperature region in a second-stage baking furnace in a short time. Is done. Since a magazine containing a plurality of objects to be baked is passed through the baking furnace, the total length of the baking furnace can be reduced as compared with a case where the objects to be baked are flowed one by one into the baking furnace. In addition, since the temperature of the first-stage baking furnace and the temperature of the second-stage baking furnace can be set separately, the temperature adjustment and the change can be easily performed, and the baking can be reliably performed while shortening the baking time. can do.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a baking apparatus according to an embodiment of the present invention.
(B) is a temperature distribution diagram. FIG. 2 is a flowchart illustrating a method of manufacturing a μBGA IC according to an embodiment of the present invention. 3A and 3B show a workpiece supplied in the potting step, wherein FIG. 3A is a partially omitted plan view, and FIG. 3B is a partially omitted front sectional view. 4A and 4B show a state after the potting step, in which FIG. 4A is a partially omitted plan view, and FIG.
It is sectional drawing in alignment with the bb line of FIG. FIG. 5 is a perspective view showing a magazine supplied to the baking step. FIG. 6 shows μB
5A shows a GA IC, wherein FIG. 5A is a plan view of a left half, a bottom view of a right half, and FIG.

In the present embodiment, the method of manufacturing a semiconductor device according to the present invention is used in a method of manufacturing a μBGA IC, and is configured as shown in FIG.
That is, as shown in FIG. 2, the tape carrier manufactured in the tape carrier manufacturing process and the chip manufactured in the chip manufacturing process are assembled in the tape carrier and chip assembling process, and the inner lead bonding process is performed. The assembly 1 shown in FIG. 3 is manufactured by lead bonding. Next, in the potting step and the baking step, the resin sealing body shown in FIG. 4 is formed. Then, by being separated into one unit in the separation process,
The BGA IC shown in FIG. 6 is manufactured.

As shown by an assembly 1 in FIG. 3, a tape carrier 2 manufactured in a tape carrier manufacturing process is a TAB used in a method of manufacturing an IC having TCP (TCP / IC). (Tape automated bonding) It is equivalent to a tape. Since the same pattern is repeated in the tape carrier 2 in the longitudinal direction, the description and illustration of the configuration are basically made for only one unit.

The tape carrier 2 has a carrier body 3 integrally formed into a tape shape in which the same pattern is continuous in the longitudinal direction using an insulating resin such as polyimide. The carrier body 3 has a square bump forming portion. 4 are longitudinally aligned in a row. A large number of bump holes 5 are formed in the bump forming section 4 and arranged on a square annular line. Each of the bump holes 5 is configured so that the bumps are electrically connected to the outer leads. I have. Around the bump forming portion 4, a pair of concave window holes 6 are arranged and opened in a square frame shape so as to surround the bump forming portion 4.

A plurality of inner leads 7 are wired on one main surface (hereinafter, referred to as the lower surface) of the carrier body 3 so that each window hole 6 projects in the lateral direction. The groups are wired parallel to one another at intervals in the longitudinal direction of each window hole 6. One end of each inner lead 7 located on the bump forming portion 4 side (hereinafter referred to as an inner end).
The outer leads 8 are connected in series to each other, and the inner leads 7 and the outer leads 8 that are connected to each other are mechanically and electrically integrated. The group of inner leads 7 and the group of outer leads 8 are formed using a conductive material such as copper or gold. The portion of each outer lead 8 facing the bump hole 5 is exposed from the bump forming portion 4.

An insulating film 9 made of an elastomer or silicon rubber is applied to the lower surface of the carrier body 3 by an appropriate means such as bonding, and the outer leads 8 are formed of a rectangular insulating film substantially equal to the inner diameter of the window hole 6. 9.
Therefore, the tape carrier 2 includes the carrier body 3, the inner lead 7 group, the outer lead 8 group, and the insulating film 9.

In this embodiment, the tape carrier 2
Is adhered to the carrier jig 14 as shown in FIG. The carrier jig 14 is formed of a rigid material such as stainless steel and is formed in a rectangular flat plate shape. The carrier jig 14 has a plurality of substantially square window holes 15 corresponding to the size of one unit of the tape carrier 2, which are opened in a line in the length direction of the tape carrier 2. Each unit of the tape carrier 2 is arranged.

As shown by the assembly 1 in FIG. 3, the chip 10 manufactured in the chip manufacturing process is formed in a square flat plate having a size substantially equal to one unit of the tape carrier 2. A desired semiconductor integrated circuit including a semiconductor element is formed on one principal surface side (hereinafter, referred to as an active area side). That is, the chip 10 is manufactured by forming a semiconductor integrated circuit on the active area side in a state of a semiconductor wafer in a so-called pre-IC manufacturing process, and dividing the chip into a square plate shape in a dicing process. The surface of the chip 10 on the active area side is covered with a passivation film 11, and a plurality of openings formed in the passivation film 11 are formed such that each electrode pad 12 is exposed to the outside. Each electrode pad 12 corresponds to each inner lead 7 in the tape carrier 2.

The chip 10 manufactured in the chip manufacturing process is the tape carrier 2 manufactured in the tape carrier manufacturing process.
In a chip assembling step, the tape carrier is mechanically connected to the tape carrier as shown in FIG. That is, the chip 10 is arranged on the tape carrier 2 such that each electrode pad 12 is aligned with each inner lead 7, and is bonded and mechanically connected between the passivation film 11 and the insulating film 9. Each outer lead 8 is separated upward from the passivation film 11 by the thickness of the insulating film 9.

Subsequently, in an inner lead bonding step, each inner lead 7 is bonded to each electrode pad 12 and mechanically and electrically connected, whereby the assembly 1 shown in FIG. 3 is manufactured. You. In the assembly 1, the inner lead 7 is bent in a substantially S-shape, and one end is thermocompression-bonded to the electrode pad 12.

Next, in the potting step, a resin coating device is used to apply a resin as a potting material to the window 6 of the tape carrier 2 as shown in FIG. A resin application section 16 covering the connection section group with the above is formed. The resin as the potting material is a resin in which a curing agent or the like is added to a thermoplastic epoxy resin, and is in a liquid state at the time of application work, and is cured by a reaction of the curing agent by heat treatment after application. It is composed.

When the resin is applied to the window 6 of the tape carrier 2, the tape carrier 2 is attached to the carrier jig 1.
4, the carrier jig 1
The resin application work is sequentially performed by the pitch feed of 4. An assembly 1 in which a resin as a potting material is applied to the window 6 to form a resin application portion 16
Are sequentially stored in the magazine 20 as shown in FIG.

As shown in FIG. 5, the magazine 20
Comprises a main body 21 formed of a rectangular parallelepiped box using a heat-resistant material. The main body 21 is formed in a rectangular parallelepiped box shape having a front surface opened substantially in a plan view substantially equal to the rectangular shape of the carrier jig 14. ing. Left and right side walls 22, 2 of main body 21
2, a plurality of holding grooves 23 extending in the front-rear direction are laid down and arranged at equal intervals in the vertical direction, and the left and right holding grooves 23 of each stage are opposed to each other. The carrier jig 14 is housed in the magazine 20 by inserting the left and right ends into the left and right holding grooves 23.

When a predetermined number of the carrier jigs 14 are stored (unloaded) in the magazine 20, the magazine 20 is immediately sent to the baking device 30 shown in FIG. 1 and is baked as shown in FIG. The process is performed.

Here, the configuration of the baking apparatus according to the embodiment of the present invention shown in FIG. 1 will be described.

As shown in FIG. 1, the baking apparatus 30 includes a first-stage baking furnace (hereinafter, referred to as a first furnace) 31 and a second-stage baking furnace (hereinafter, referred to as a second furnace). )), And an intermediate furnace 33 disposed between the first furnace 31 and the second furnace 32. The first furnace 31, the second furnace 32, and the intermediate furnace 33 are arranged in a single file. In series)
Are located. The length of the first furnace 31 is set to be three times the length of the second furnace 32 and the intermediate furnace 33.

An inlet door 34 is provided on the furnace wall on the inlet side of the first furnace 31.
Is installed on the partition wall of the intermediate furnace 33, which is the furnace wall on the exit side of the first furnace 31, with a shielding door (hereinafter, referred to as the first furnace 31) for shielding the temperature difference between the first furnace 31 and the intermediate furnace 33. A door 35 is provided. A heater (hereinafter, referred to as a first heater) 36 is laid on the ceiling of the first furnace 31 over substantially the entire length, and the first heater 36 can uniformly heat the inside of the first furnace 31 to about 80 ° C. It is configured to be able to. A belt conveyor (hereinafter, referred to as a first conveyor) 37 is laid over substantially the entire length of the floor of the first furnace 31, and the first conveyor 37 has a plurality of (six in the illustrated example) magazines 20 arranged side by side. It is configured to intermittently feed.

An exit door 38 is provided on the furnace wall on the exit side of the second furnace 32.
Is installed on the partition wall of the intermediate furnace 33, which is the furnace wall on the inlet side of the second furnace 32, and a shielding door (hereinafter, referred to as a second door) for shielding the temperature difference between the second furnace 32 and the intermediate furnace 33. A door 39 is provided. A heater (hereinafter, referred to as a second heater) 40 is laid on the ceiling of the second furnace 32 over substantially the entire length, and the second heater 40 can uniformly heat the inside of the second furnace 32 to about 150 ° C. It is configured to be able to. On the floor of the second furnace 32, a belt conveyor (hereinafter, referred to as a second conveyor) 41 is laid substantially over the entire length, and the second conveyor 41 has a plurality (two in the illustrated example) of magazines 20 arranged side by side. It is configured to intermittently feed.

A heater (hereinafter, referred to as an intermediate heater) 42 is laid on the ceiling of the intermediate furnace 33 over substantially the entire length. The intermediate heater 42 has a temperature distribution of 80 ° C. from the upstream side to the downstream side in the intermediate furnace 33. From 150 ° C. to 150 ° C. A belt conveyor (hereinafter, referred to as an intermediate conveyor) 43 is provided on the floor of the intermediate furnace 33.
Are laid almost over the entire length, and the intermediate conveyor 43
Is configured to intermittently feed a plurality of (two in the illustrated example) magazines 20 side by side. The first conveyor 37, the second conveyor 41, and the intermediate conveyor 43 are synchronized with each other.

Next, the μBGA according to one embodiment of the present invention
A case where the above-described baking apparatus is used for the baking step in the IC manufacturing method will be described with reference to FIG.

In the potting step, the carrier jig 1
The magazine 20 in which a predetermined number of the magazines 4 are stored is carried into the first furnace 31 of the baking device 30 from the entrance door 34,
It is placed on the front end of the first conveyor 37. The magazine 20 placed on the front end of the first conveyor 37 advances one pitch inside the first furnace 31 by the pitch feed of the first conveyor 37. After one pitch advance, the next magazine 20 is placed on the front end of the first conveyor 37. Thereafter, this loading operation is repeated.

As shown in FIG. 1B, the first furnace 31 is heated to 80 ° C. by the first heater 36, and the temperature is maintained by the entrance door 34 and the first shielding door 35. The magazine 20 carried into the first furnace 31 is heated to 80 ° C. The heating time at this time is
It is proportional to the length of the first furnace 31, that is, the transport time of the first conveyor 37. For example, in FIG.
If one pitch time is 5 minutes, 5 × 6 = 30,
30 minutes. By this heating, Magazine 2
The resin application section 16 as the part to be baked in the carrier jig 14 housed in the storage unit 0 is hardened by the reaction of the hardener.

By the way, the resin coating section 1 after the resin coating
Since 6 is in a liquid state, it is in a state of being easily damaged and foreign matter is likely to be mixed in. Therefore, it is desirable that the waiting time of the baking step be as short as possible after the application of the resin and sent to the baking apparatus. Therefore, in the present embodiment, the carrier jig 14 as the object to be baked, which has been coated with the resin in the potting step, is sequentially unloaded into the magazine 20, and when a predetermined number of the carrier jigs 14 are stored in the magazine. , Quickly baking equipment 3
By sending it to 0, damage to the resin application section 16 and entry of foreign matter are prevented.

The magazine 20 reaching the rear end of the first conveyor 37 is carried from the first furnace 31 to the intermediate furnace 33 through the first shielding door 35, and is placed on the front end of the intermediate conveyor 43. The magazine 20 placed on the intermediate conveyor 43 advances one pitch in the intermediate furnace 33 by the pitch feed of the intermediate conveyor 43. At this time, since the pitch feed of the intermediate conveyor 43 and the pitch feed of the first conveyor 37 are synchronized, the delivery operation can be smoothly performed. When moving forward by one pitch, the next magazine 20 is moved to the intermediate conveyor 43.
From the first furnace 31. Thereafter, the delivery work is repeated.

As shown in FIG. 1B, the temperature range of the intermediate furnace 33 is set to 80 ° C.
Since the temperature is controlled so as to gradually increase to 50 ° C., the temperature of the magazine 20 that is pitch-fed by the intermediate conveyor 43 in the intermediate furnace 33 gradually rises following the pitch feeding. Incidentally, the heating time at this time is also proportional to the length of the intermediate furnace 33, that is, the pitch feed time of the intermediate conveyor 43. For example, in FIG. 1, when the time of one pitch of the intermediate conveyor 43 is 5 minutes, 5 × 2 = 1
0 gives enough time. By this heating, the resin coating section 16 of the carrier jig 14 housed in the magazine 20 progresses the curing by the reaction of the curing agent.

The magazine 20 that has reached the rear end of the intermediate conveyor 43 is carried from the intermediate furnace 33 to the second furnace 32 through the second shielding door 39, and is placed on the front end of the second conveyor 41. The magazine 20 placed on the second conveyor 41 advances one pitch in the second furnace 32 by the pitch feed of the second conveyor 41. Also at this time, since the pitch feed of the second conveyor 41 and the pitch feed of the intermediate conveyor 43 and the first conveyor 37 are synchronized, the delivery operation can be performed smoothly. After one pitch advance, the next magazine 20 is delivered to the front end of the second conveyor 41 from the intermediate furnace 33. Thereafter, the delivery work is repeated.

As shown in FIG. 1B, the second furnace 32 is heated to 150 ° C. by the second heater 40, and the temperature is maintained by the outlet door 38 and the second shielding door 39. The magazine 20 carried into the second furnace 32 is heated to 150 ° C. The heating time at this time is proportional to the length of the second furnace 32, that is, the transport time of the second conveyor 41. For example, in FIG. 1, when one pitch time of the second conveyor 41 is 5 minutes, 5 × 2 = 1
0 gives enough time. By this heating, the resin application section 16 as the baking target in the carrier jig 14 housed in the magazine 20 is further hardened by the reaction of the hardener. The magazine 20 that has reached the rear end of the second conveyor 41 is carried out of the second furnace 32 through the exit door 38 and is unloaded, completing the baking process.

As shown in FIG. 1, the resin coating unit 1 of the carrier jig 14 housed in the magazine 20 is carried into the first furnace 31 and carried out of the second furnace 32.
6 is a preset time (for example, 30 + 10 + 10 =
50, the heat treatment is performed, so that the sufficiently cured resin sealing body 16A shown in FIG. 6 is formed.

Thereafter, in a bump forming step shown in FIG. 2, a solder ball is soldered to a portion of each outer lead 8 of the tape carrier 2 exposed at the bottom of each bump hole 5, so that the bump forming section 4 is formed. Are formed on the tape carrier 2 as shown in FIG.

Next, in the separating step shown in FIG. 2, when the tape carrier 2 is separated for each unit, the μBGA IC 18 shown in FIG. 6 is manufactured. In this state, the final baked resin sealing body 16A is in a state in which the connection portion between the inner lead 7 and the electrode pad 12 is well sealed with resin.

According to the above embodiment, the following effects can be obtained.

1) A plurality of carrier jigs holding a tape carrier on which a resin coating section is formed are housed in a magazine, and the magazine is baked by sequentially passing through a first furnace, an intermediate furnace, and a second furnace. Since the desired baking temperature and time can be ensured while suppressing the overall length of the baking apparatus to be short, the resin application section can be reliably baked while suppressing the occupied floor area.

2) By setting the heating temperature of the first furnace to be low and the heating temperature of the second furnace to be high, it is possible to perform temporary baking by the first furnace and final baking by the second furnace. Appropriate control can be performed, and the quality and reliability of the resin sealing body can be improved.

3) The temperature difference between the first furnace and the second furnace can be maintained by providing a shielding door at the boundary between the first furnace and the second furnace to shield heat between the furnaces. Therefore, temporary baking and final baking can be distinguished.

4) The temperature difference between the first furnace and the second furnace can be buffered by providing an intermediate furnace between the first furnace and the second furnace that changes the temperature difference between the two furnaces. The transition from the temporary baking to the final baking can be appropriately performed.

5) The distribution and increase / decrease of the temporary baking time and the final baking time are easily controlled by controlling the length of the first furnace and the second furnace to control the passage time of the object to be baked through the furnace. Therefore, the cost of the baking device can be reduced.

6) By configuring the magazine to be conveyed by a conveyor, the structure and control of the magazine handling device can be simplified, so that the cost of the baking device can be reduced.

7) The object to be baked after application of the resin is stored in a magazine, immediately sent to a baking device, and quickly baked, thereby reducing the chances of foreign matter entering into the resin application portion and damage. Therefore, the quality and reliability of the resin sealing body can be improved.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

The baking furnace is not limited to two stages, but may be three or more stages.

The temporary baking temperature and the final baking temperature are not limited to 80 ° C. and 150 ° C., but are desirably set appropriately according to various conditions such as the material and amount of the resin as the potting material.

The resin coating portion to be baked is
It is not limited to the resin application part applied to the connection part between the inner lead and the electrode pad, but also forms the underfill between the cavity of the BGA and the chip and the base, and the resin sealing body of another package. Alternatively, a resin application section may be applied with a resin.

Further, the baking technique according to the present invention is not limited to the technique of baking a resin-coated portion to which a resin is applied to form a resin sealing body. The present invention can be applied to all baking techniques for baking an application portion applied to a bonding floor.

In the above description, the invention made mainly by the present inventor has been applied to the μBG
A case where the present invention is applied to a method for manufacturing an A / IC has been described, but the present invention is not limited to this.
The present invention can be applied to all IC manufacturing methods and baking techniques used for TCP / IC and the like.

[0055]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

By baking the magazine containing the objects to be baked sequentially through a plurality of baking ovens, it is possible to secure a desired baking temperature and time while keeping the overall length of the baking apparatus short, so that the occupied floor can be secured. The object to be baked can be reliably baked while suppressing the area.

[Brief description of the drawings]

FIG. 1 shows a baking apparatus according to an embodiment of the present invention, in which (a) is a front sectional view, and (b) is a temperature distribution chart.

FIG. 2 is a flowchart illustrating a method of manufacturing a μBGA IC according to an embodiment of the present invention.

3A and 3B show an assembly supplied to the potting step, wherein FIG. 3A is a partially omitted plan view, and FIG. 3B is a partially omitted front sectional view.

4A and 4B show a state after the potting step, in which FIG. 4A is a partially omitted plan view, and FIG. 4B is a cross-sectional view taken along line bb of FIG.

FIG. 5 is a perspective view showing a magazine supplied to a baking step.

6A and 6B show a μBGA IC, wherein FIG. 6A is a plan view of the left half, a bottom view of the right half, and FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Assembly, 2 ... Tape carrier, 3 ... Carrier main body,
4 ... Bump forming part, 5 ... Bump hole, 6 ... Window hole, 7 ...
Inner lead, 8 ... Outer lead, 9 ... Insulating film, 10 ...
Chip (semiconductor chip), 11 ... passivation film,
Reference numeral 12: electrode pad, 14: carrier jig (baked object), 15: window hole, 16: resin coating portion, 16A: resin sealing body, 17: bump, 18: μBGA / IC (semiconductor device), 20: Magazine, 21: Main body, 22: Side wall, 2
Reference numeral 3: holding groove, 30: baking apparatus, 31: first-stage baking furnace (first furnace), 32: second-stage baking furnace (second furnace), 33: intermediate furnace, 34: entrance door, 35: shielding door (first shielding door), 36: heater (first heater), 3
7 ... belt conveyor (first conveyor), 38 ... exit door,
39: shielding door (second shielding door), 40: heater (second heater), 41: belt conveyor (second conveyor), 42 ...
Heater (intermediate heater), 43 ... Belt conveyor (intermediate conveyor).

Continuing on the front page (72) Inventor Kazunori Higuchi 3-3-2 Fujibashi, Ome-shi, Tokyo Within Hitachi Tokyo Electronics Co., Ltd. (72) Inventor Katsuhiko Miya3-3-2-2 Fujibashi, Ome-shi, Tokyo Hitachi Tokyo Electronics Co., Ltd. In-house (72) Inventor Tomoji Suda 3-3-2 Fujihashi, Ome-shi, Tokyo F-term in Hitachi Tokyo Electronics Co., Ltd. (reference) 4F203 AA39 AH33 DA12 DB01 DC13 DK02 DL01 DN02 5F061 AA01 BA03 CA04 CB13

Claims (10)

[Claims] 1. A method of manufacturing a semiconductor device, wherein a magazine containing a plurality of objects to be baked is sequentially passed through a plurality of baking furnaces and baked. 2. The method according to claim 1, wherein the magazine is continuously passed through a plurality of baking furnaces. 3. The heating temperature of the magazine is changed every time the baking furnace is moved to each stage.
Or a method for manufacturing a semiconductor device according to item 2. 4. A baking apparatus characterized in that a plurality of baking furnaces through which a magazine containing objects to be baked is passed are arranged in series. 5. The baking apparatus according to claim 4, wherein the baking temperature of each of the baking furnaces is different. 6. The baking apparatus according to claim 4, wherein a shielding door for shielding heat is interposed at a boundary between the adjacent baking furnaces. 7. The baking apparatus according to claim 4, wherein an intermediate furnace for changing a temperature difference between the respective baking furnaces is provided between the respective baking furnaces. 8. The baking apparatus according to claim 4, wherein a ratio of a passage time of the magazine in each of the baking furnaces is controlled. 9. The baking apparatus according to claim 8, wherein the ratio of the passage time of the magazine in each of the baking ovens is controlled by adjusting the length of the baking oven in each of the stages. . 10. The baking apparatus according to claim 4, wherein a conveyor that conveys the magazine is laid in the baking furnace.