JP2936016B2 - Baking equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a baking apparatus, and more particularly to an improvement in work efficiency of a resin drying / curing process and a semiconductor integrated circuit device in a resin sealing step of a semiconductor integrated circuit device in TAB (Tape Automated Bonding) mounting. The present invention relates to a technique which is effective when applied to a baking apparatus capable of improving the quality of a product.

[0002]

2. Description of the Related Art For example, TAB mounting has recently attracted attention as one of the assembling techniques for semiconductor integrated circuit devices as an alternative to wire bonding, and its application, packaging, and automation techniques have changed greatly. ing.

In particular, inner lead bonding (IL)
B: With the development of Inner Lead Bonding) equipment and the development of peripheral technologies such as transfer solder bumps, TAB mounting technology enables electrical testing and burn-in testing on tape, higher mounting density, and higher pin count than wire bonding. Suitable for mass production, batch bonding is possible, thin thickness, highly reliable bonding, modularization is possible, correspondence to SMT (Surface Mount Technology),
In recent years, it has become a general-purpose technology because of its advantages such as good high-frequency characteristics, and it is further expanding.

In the assembling process using the TAB technology, mounting leads are attached and arranged at a predetermined pitch in the length direction of the insulating long carrier tape, and each of the leads is mounted. By bonding individual semiconductor chips via solder bumps or the like, the efficiency of the assembly process of a large number of semiconductor integrated circuit devices can be improved.

In this case, in order to protect the semiconductor chip from moisture and dust in the external environment, for example, an epoxy resin or the like is applied so as to cover the lead portion of the semiconductor chip after the ILB, and then heat treatment or the like is performed. Drying by
It is common to perform resin sealing to give the sealing resin a predetermined strength by curing.

[0006] For example, as a baking device for drying and curing the sealing resin, two pairs of reversing rollers are rotatably arranged in a horizontal direction of a baking chamber, and a carrier tape is rotated with the rotation of the reversing rollers. It is designed to be transported upside down.

In this case, a heater and a gas outlet are provided below the carrier tape to be conveyed, and the sealing resin applied thereto is dried and cured to form a predetermined hardness. I have.

[0008] As a technique similar to this, for example, there is a TAB resin sealing apparatus described in "Electronic Materials" P100 issued by the Industrial Research Institute, Inc., July 1, 1989.

[0009]

However, in the prior art as described above, it is necessary to cure the sealing resin to a certain extent up to the position of the first reversing roller, and to cure to a predetermined strength in the baking chamber. For this purpose, it is necessary to increase the ambient temperature in the baking chamber or to increase the gas flow rate, which causes a problem that manufacturing failure occurs in the resin-sealed semiconductor integrated circuit.

[0010] For example, baking defects such as voids due to air bubbles and the like inside the sealing resin, discoloration of the leads due to the attachment of gas particles, and deformation of the leads due to deformation of the carrier tape occur. There is a problem.

In addition, since the atmosphere conditions in the baking chamber are limited, and the condition management such as adjustment and control of the atmosphere conditions corresponding to the type of the sealing resin is limited, the work time such as the processing time in the baking process is reduced. There is also a problem that sufficient working efficiency cannot be obtained in terms of sex.

Further, since the reversing rollers are arranged in the horizontal direction, the carrier tape being conveyed is bent between the reversing rollers due to its own weight such as a sealing resin, so that the conveyance of the carrier tape becomes unstable. .

Therefore, in the conventional baking apparatus, good working efficiency in the resin sealing step cannot be obtained.
In particular, there is a problem that quality control cannot be performed sufficiently under atmospheric conditions.

[0014] Therefore, an object of the present invention is to carry out the functional management of the atmospheric conditions sufficiently and to carry out the drying /
An object of the present invention is to provide a baking device capable of improving the working efficiency of a curing process.

Another object of the present invention is to provide a baking apparatus capable of stabilizing the transport of a carrier tape.

Still another object of the present invention is to provide a baking apparatus capable of improving the quality of a resin drying / curing process by sufficiently controlling the atmospheric conditions.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0018]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, in the baking apparatus of the present invention, a liquid resin is applied to a predetermined portion of a carrier tape to which a plurality of semiconductor chips are bonded, and the resin tape coated with the resin is held in a predetermined atmosphere condition. A TAB mounting type baking apparatus in which the baking chamber is inverted and conveyed, the resin is dried and hardened, and then the carrier tape is wound by an unloader mechanism. It is functionally separated.

Further, the reversing rollers are arranged in a staggered manner in the vertical direction of the cure baking chamber.

Further, a tape tension stabilizing mechanism for stabilizing the tension of the carrier tape is provided in a conveying path of the carrier tape coated with the resin.

Further, the flow direction of gas, which is one of the atmospheric conditions in the dry baking chamber, is different from the transport direction of the carrier tape coated with the resin.

Further, at least one or more curing baking chambers can be added.

[0024]

According to the above-described baking apparatus, the baking chamber is functionally separated into a drying baking chamber and a curing baking chamber, thereby changing internal conditions such as the temperature and atmosphere of the drying baking chamber and the curing baking chamber. be able to.

Thus, the applied resin can be first dried in the drying baking chamber under optimum conditions up to the reversible hardness of the carrier tape, and further, cured baking controlled under the optimum conditions different from those of the drying baking chamber. It can be cured to a predetermined hardness in a chamber.

Further, by disposing the reversing roller of the carrier tape in the vertical direction of the cure baking chamber, the carrier tape can be transported in the same vertical direction as the own weight direction. Thereby, the transport of the carrier tape can be stabilized.

Further, the provision of the tape tension stabilizing mechanism in the carrier tape transport path enables the carrier tape to be maintained at a predetermined constant tension. This makes it possible to stabilize the transport of the carrier tape.

Further, since the flow direction of the gas is different from the transport direction of the carrier tape, it is possible to prevent gas particles scattered during drying from being attached. As a result, it is possible to reduce the occurrence of defects due to the attachment of foreign matter.

Further, since the curing baking chamber can be added, the curing baking section can be connected according to the curing characteristics depending on the type of the resin. Thereby, the quality in the resin drying / curing step can be improved.

[0030]

FIG. 1 is a schematic diagram showing a baking apparatus according to an embodiment of the present invention, FIG. 2 is a detailed view showing a main part of a drying baking chamber in the baking apparatus of this embodiment, and FIG. And FIG. 4 is a cross-sectional view showing a carrier tape resin-sealed using the baking apparatus of the present embodiment.

First, the configuration of the baking apparatus of this embodiment will be described with reference to FIG.

The baking apparatus of this embodiment is, for example,
Baking device 1 in resin sealing by AB mounting method
As shown in FIG. 4, the semiconductor chip 4 is bonded to the carrier tape 3 on which the leads 2 are formed, and further applied to the carrier tape 3 coated with the liquid resin 5 so that the carrier tape 3 can be turned over. The drying and baking unit 6 for drying the resin 5 and the curing and baking unit 7 for curing the dried resin 5 to a predetermined hardness. The atmosphere is functionally different.

The drying baking section 6 is, for example, a drying baking chamber 8 in which the inside is maintained at a temperature of 80 degrees.
The tape transport path 9 is disposed in the horizontal direction, and a heater 10 for heating the infrared rays or the like whose temperature can be adjusted is provided on the upper side of the tape transport path 9 along the tape transport path 9. Then, the heater 10 controls the internal temperature of the drying and baking chamber 8 to a variation within, for example, 5 degrees.

Further, inside the drying baking chamber 8, as shown in FIG. 2, a gas outflow path 11 for flowing out nitrogen gas is provided between the tape transport path 9 and the heater 10, and this gas outflow path 11 is provided. It is connected to a gas tank 12 whose flow rate can be adjusted. Then, nitrogen gas is preheated in the gas tank 12 to a predetermined temperature in advance, and the solvent of the resin 5 can be scattered to some extent by spraying the nitrogen gas onto the resin 5 on the carrier tape 3 to apply preheating. It has become. In this case, the nitrogen gas is blown from a direction perpendicular to the transport direction of the carrier tape 3.

The cure baking section 7 is, for example, a cure baking chamber 1 in which the inside is kept at a temperature of 120 degrees.
3, two pairs of reversing rollers 14 are disposed in a staggered manner in the vertical direction of the curing and baking chamber 13, and a tension-adjustable balancer that stabilizes the tension of the carrier tape 3 after the two pairs of reversing rollers 14. A movable roller 16 to which a (tape tension stabilizing mechanism) 15 is connected is provided. Then, with the rotation of the reversing roller 14, the carrier tape 3 is reversed and conveyed in the up and down direction.
The tension of the carrier tape 3 is maintained at a predetermined constant tension by the vertical movement of the movable roller 16 due to the above.

In the vicinity of the transport path of the carrier tape 3, a heating heater 17 similar to the dry baking section 6 and a gas outflow path 18 for flowing out nitrogen gas are provided along the transport path, and cure baking is performed. The temperature of the chamber 13 is controlled to be higher than that of the dry baking chamber 8 and the atmosphere condition of the nitrogen gas is small.

The baking apparatus 1 configured as described above
Is configured as a part of a resin sealing system as shown in FIG. 3, for example, and a potting device 19 for a resin coating process, which is a pre-process of the baking process, is connected to the left side. A loader mechanism 20 for supplying the tape 3 is connected.

On the other hand, on the right side of the baking apparatus 1, a reel type unloader mechanism 21 that winds up the carrier tape 3 after the baking process is connected.

Next, the operation of this embodiment will be described.

First, in each of the steps of manufacturing the carrier tape 3 and forming the bumps on the semiconductor chip 4, the carrier tape 3 and the semiconductor chip 4 on which the bumps are formed are manufactured. Then, in the packaging step, first, an ILB step in which the leads 2 on the carrier tape 3 and the electrodes of the semiconductor chip 4 are connected via bumps is performed, and then the resin sealing step of the present invention is performed.

First, the carrier tape 3 on which the ILB process has been completed is set on the loader mechanism 20 in a state of being wound on a reel, while an empty reel is set on the unloader mechanism 21 and resin sealing is completed on the carrier tape 3. Is wound up.

First, in the potting device 19,
The resin 5 is applied to a predetermined portion corresponding to each semiconductor chip 4 on the carrier tape 3 conveyed from the loader mechanism 20, for example, the entire region including the inner lead like a device hole sealing. Then, the carrier tape 3 coated with the resin 5 is transported to the baking device 1.

Further, in the baking apparatus 1, first, the resin 5 is conveyed through the drying baking chamber 8 of the drying baking section 6 in which the temperature is maintained at 80 ° C. by a predetermined atmospheric condition, and the resin 5 is dried to some extent. In this case, preheating is applied to the resin 5 by blowing a preheated nitrogen gas, and the solvent of the resin 5 can be blown off to some extent, thereby reducing the generation of bubbles inside the resin 5 which has been a problem in the past. It is possible to do.

At the same time, nitrogen gas is blown from a direction perpendicular to the transport direction of the carrier tape 3 to prevent gas particles such as a solvent scattered by preheating from adhering. And baking defects such as deformation of the leads 2 due to deformation of the carrier tape 3 can be reduced.

Subsequently, the carrier tape 3 coated with the resin 5 which has been dried to a certain extent is
Transport to And in the cure baking part 7,
The resin is turned upside down in a cure baking chamber 13 maintained at a predetermined atmospheric condition, for example, at a temperature of 120 degrees, to cure the resin to a predetermined hardness, for example, a hardness of 2H or more of a pencil.

In this case, since the carrier tape 3 can be transported in the vertical direction, the deflection of the carrier tape 3 which has been a conventional problem can be prevented and the transport can be stabilized. Further, since the tension of the carrier tape 3 is kept constant by the vertical movement of the movable roller 16 by the balancer 15, the carrier tape 3 can be transported more stably.

After the resin 5 is cured to a predetermined hardness, the carrier tape 3 which has been completely sealed with the resin is wound around the reel of the unloader mechanism 21, and the resin sealing process for one reel is completed. As described above, the above steps are repeated for each reel, and a large number of semiconductor integrated circuit devices can be efficiently assembled.

Therefore, according to the baking apparatus 1 of the present embodiment, the work efficiency of the resin baking process is improved by functionally separating the drying baking section 6 and the curing baking section 7 having different atmospheric conditions. Can be.

The transport of the carrier tape 3 can be stabilized by reversing and transporting the carrier tape 3 vertically by the reversing roller 14 and stabilizing the tension of the carrier tape 3 by the balancer 15.

Further, in addition to the functional separation of the drying baking section 6 and the curing baking section 7, the nitrogen gas is blown at right angles to the transport direction of the carrier tape 3 so that the quality of the resin 5 in the baking process is improved. Can be improved.

As described above, the invention made by the inventor has been specifically described based on the embodiments. However, the present invention is not limited to the above embodiments, and can be variously modified without departing from the gist thereof. Needless to say.

For example, in the baking apparatus 1 of this embodiment, the drying baking section 6 and the curing baking section 7
Has been described in the case where each is composed of one unit,
The present invention is not limited to the above-described embodiment, but is also applicable to a case where the curing and baking unit 7 is added according to the curing characteristics of the type of the resin 5 or the like.

Further, the case where the baking apparatus 1 of the present embodiment is used in connection with the loader mechanism 20, the potting apparatus 19 and the unloader mechanism 21 has been described, but for example, the baking apparatus 1 may be used alone, It is also possible to use them in combination. For example, the present invention can be applied to a case where a bonding device for ILB is inserted between the loader mechanism 20 and the potting device 19, or a case where a marking device and a resin thickness measuring mechanism are connected after the baking device 1.

In the above description, the case where the invention made mainly by the present inventor is applied to the baking apparatus 1 used for TAB mounting, which is the field of use, has been described. The present invention can be widely applied to a baking device used in a resin sealing process of a semiconductor integrated circuit device.

[0055]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1) By functionally separating the baking chamber into a drying baking chamber and a curing baking chamber having different atmospheric conditions, internal conditions such as the temperature and atmosphere of the drying baking chamber and the curing baking chamber are changed. First, the liquid resin is dried in a drying baking chamber under optimal conditions to the reversible hardness of the carrier tape coated with this resin, and then the dried resin is cured in the curing baking chamber under the optimal conditions to a predetermined hardness. Therefore, the work efficiency of the resin drying / curing process can be improved.

(2) By disposing the reversing rollers in a staggered manner in the vertical direction of the cure baking chamber, the carrier tape can be transported in the same vertical direction as the own weight direction of the carrier tape with the rotation of the reversing roller. Therefore, the transport of the carrier tape can be stabilized.

(3) By providing a tape tension stabilizing mechanism for stabilizing the tension of the carrier tape in the carrier tape transport path, the carrier tape can be maintained at a predetermined constant tension. In addition to (2), the transport of the carrier tape can be further stabilized.

(4) By making the flow direction of the gas, which is one of the atmospheric conditions of the drying baking chamber, different from the direction of transport of the carrier tape, it is possible to prevent gas particles scattered during drying from being attached. It is possible to reduce the occurrence of defects due to the adhesion of foreign substances, and to improve the quality.

(5) By allowing at least one or more curing baking chambers to be added, the curing and baking chambers are connected in accordance with the curing characteristics depending on the type of resin and the like.
In addition to (4), the quality in the resin drying / curing step can be further improved.

(6) According to the above (1) to (5), in the resin sealing step of the semiconductor integrated circuit device in the TAB mounting, the baking apparatus capable of improving the work efficiency and quality of the resin drying / curing process can be realized. Can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a baking apparatus according to one embodiment of the present invention.

FIG. 2 is a detailed view showing a main part of a drying baking chamber in the baking apparatus of the present embodiment.

FIG. 3 is a configuration diagram illustrating a resin sealing system including a baking device and the like according to the present embodiment.

FIG. 4 is a cross-sectional view showing a carrier tape sealed with a resin using the baking apparatus of the present embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Baking apparatus 2 Lead 3 Carrier tape 4 Semiconductor chip 5 Resin 6 Dry baking part 7 Cure baking part 8 Dry baking chamber 9 Tape transport path 10 Heater 11 Gas outflow path 12 Gas tank 13 Cure baking chamber 14 Reversing roller 15 Balancer (Tape tension stability) Mechanism 16 movable roller 17 heater 18 gas outflow path 19 potting device 20 loader mechanism 21 unloader mechanism

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-108346 (JP, A) JP-A 64-18736 (JP, U) JP-A 2-144394 (JP, U) (58) Investigation Field (Int.Cl. ⁶ , DB name) H01L 21/56

Claims (5)

(57) [Claims] A liquid resin is applied to a predetermined portion of a carrier tape to which a plurality of semiconductor chips are bonded,
A the resin will reverse conveying the baking chamber which is holding the carrier tape which is applied on a predetermined ambient conditions, the resin dried and cured, then the carrier tape
A baking device of a TAB mounting type for winding by a loader mechanism , wherein the baking chamber is functionally separated into a drying baking chamber and a curing baking chamber having different atmospheric conditions, and the resin is dried in the drying baking chamber. A baking device, wherein the baking device is dried to a reversible hardness of the carrier tape coated with the resin, and further cured in the cure baking chamber to a predetermined hardness. 2. A reversing roller is disposed in a staggered manner in a vertical direction of the cure baking chamber, and a carrier tape coated with the resin is conveyed in a vertical direction with the rotation of the reversing roller. The baking device according to claim 1, wherein 3. A method for stabilizing the tension of a carrier tape provided in a conveyance path of the carrier tape coated with the resin, wherein the carrier tape is maintained at a predetermined constant tension. The baking device according to claim 1 or 2, wherein 4. The method according to claim 1, wherein the flow direction of the gas, which is one of the atmospheric conditions of the dry baking chamber, is different from the transport direction of the carrier tape coated with the resin. Baking equipment. 5. The apparatus according to claim 1, wherein at least one or more curing baking chambers can be added.
The baking apparatus according to 2, 3 or 4.