JPH05102211A - Baking device - Google Patents

Abstract

PURPOSE:To contrive improvement in the work efficiency of the drying and hardening process in a resin sealing process by the functional control of an atmospheric condition, to stabilize the conveyance of a carrier tape, and to improve quality in resin drying and hardening treatment. CONSTITUTION:The title baking device is the baking device 1 which is used in the resin sealing of a TAB mounting system, and the device 1 is provided with a dry baking part 6, with which resin 5 is dried up to the state wherein a carrier tape 3, on which liquid resin 5 is coated, can be inverted, and a cure baking part 7 with which the dried resin 5 is hardened to the prescribed hardness. The atmospheres of the dry baking part 6 and the cure baking part 7 are controlled by heaters 10 and 17 and gas flow-out paths 11 and 18 under different functional conditions respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a baking apparatus, and more particularly, in the resin sealing process of a semiconductor integrated circuit device in TAB (Tape Automated Bonding) mounting, the working efficiency of the resin drying and curing process is improved and the semiconductor integrated circuit device is improved. The present invention relates to a technique effectively applied to a baking device capable of improving the quality of the product.

[0002]

2. Description of the Related Art For example, as one of the techniques for assembling semiconductor integrated circuit devices, TAB mounting has recently attracted attention as a technique replacing wire bonding, and its application, packaging, and automation techniques have changed drastically. ing.

In particular, inner lead bonding (IL
B: Inner Lead Bonding) device development and maintenance of peripheral technology such as transfer solder bumps, TAB mounting technology enables electrical test and burn-in test on tape compared to wire bonding, high packing density, high pin count Suitable for integration, batch bonding is possible, thickness is thin, highly reliable bonding, modularization is possible, SMT (Surface Mount Technology) is supported,
It has become a general-purpose technology in recent years due to its advantages such as excellent high-frequency characteristics, and is in the direction of further expansion.

In the assembly process using the TAB technique, mounting lead groups are attached and arranged at a predetermined pitch in the length direction of an insulating long carrier tape. By bonding individual semiconductor chips to each other via solder bumps or the like, it is possible to improve the efficiency of the assembly process of a large number of semiconductor integrated circuit devices.

In this case, in order to protect the semiconductor chip from moisture and dust in the external environment, for example, epoxy resin is applied so as to cover the lead portion of the semiconductor chip after ILB, and then heat treatment or the like is performed. Due to
It is common to perform resin encapsulation to give the encapsulating resin a predetermined strength by curing.

For example, as a baking device for drying and curing the sealing resin, two pairs of reversing rollers are rotatably arranged in the horizontal direction of the baking chamber, and the carrier tape is rotated by the rotation of the reversing rollers. It is designed to be reversed and conveyed.

In this case, a heater and a gas outlet are provided on the lower side of the carrier tape to be conveyed, and the sealing resin applied by these is dried and cured to form a predetermined hardness. There is.

A technique similar to this is, for example, the TAB resin sealing device described in "Electronic Materials" P100, published by Industrial Research Institute Co., Ltd., July 1, 1989.

[0009]

However, in the prior art as described above, it is necessary to cure the sealing resin to a certain extent by the position of the first reversing roller, and the curing resin is cured to a predetermined strength in the baking chamber. In order to do so, it is necessary to raise the ambient temperature in the baking chamber and increase the gas flow rate, which causes a problem that manufacturing defects occur in the resin-sealed semiconductor integrated circuit.

For example, a baking defect occurs such that voids are generated inside the sealing resin due to air bubbles, the leads are discolored due to the adhesion of gas particles, and the leads are deformed due to the deformation of the carrier tape. There is a problem.

Moreover, since the atmospheric conditions in the baking chamber are limited and the condition management such as the adjustment and control of the atmospheric conditions corresponding to the type of the sealing resin is limited, the work such as processing time in the baking process is limited. There is also a problem that sufficient work efficiency cannot be obtained in terms of sex.

Further, since the reversing rollers are arranged in the horizontal direction, the carrier tape being conveyed is bent due to the weight of the sealing resin or the like between the reversing rollers, and the carrier tape is not stably conveyed. ..

Therefore, in the conventional baking apparatus, good working efficiency in the resin sealing process cannot be obtained,
In particular, there is a problem in that quality control cannot be sufficiently performed under atmospheric conditions.

Therefore, an object of the present invention is to sufficiently perform functional control of atmospheric conditions and to perform drying / drying in the resin sealing process.
It is an object of the present invention to provide a baking device capable of improving the work efficiency of the curing process.

Another object of the present invention is to provide a baking device capable of stabilizing the transport of the carrier tape.

Still another object of the present invention is to provide a baking apparatus capable of improving quality in resin drying / curing processing by sufficiently controlling atmospheric conditions.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0018]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, in the baking apparatus of the present invention, a liquid resin is applied to a predetermined portion of a carrier tape to which a plurality of semiconductor chips are bonded, and the carrier tape coated with the resin is kept under a predetermined atmospheric condition. A baking apparatus of a TAB mounting system in which a resin is dried and cured by reversing and conveying the inside of the baking chamber, and the baking chamber is functionally separated into a dry baking chamber and a cure baking chamber under different atmospheric conditions.

Further, reversing rollers are arranged in a zigzag pattern in the vertical direction of the cure baking chamber.

Further, a tape tension stabilizing mechanism for stabilizing the tension of the carrier tape is provided in the conveying path of the carrier tape coated with the resin.

Further, the gas flow direction, which is one of the atmospheric conditions in the dry baking chamber, is set to be different from the conveying direction of the carrier tape coated with the resin.

Further, at least one or more cure baking chambers can be added.

[0024]

According to the above-described baking apparatus, the baking chamber is functionally divided into the dry baking chamber and the cure baking chamber, so that the internal conditions such as the temperature and atmosphere of the dry baking chamber and the cure baking chamber are changed. be able to.

As a result, the applied resin can be first dried in the dry baking chamber under the optimum conditions up to the reversible hardness of the carrier tape, and the cure baking controlled under the optimum conditions different from the dry baking chamber. It can be cured to a desired hardness in the chamber.

By disposing the carrier tape reversing roller in the vertical direction of the cure baking chamber, the carrier tape can be conveyed in the same vertical direction as the self-weight direction. This makes it possible to stabilize the transport of the carrier tape.

Further, since the tape tension stabilizing mechanism is provided in the carrier tape conveying path, the carrier tape can be maintained at a constant tension of a predetermined value. As a result, the carrier tape can be more stably transported.

Further, since the gas flow direction is different from the carrier tape transport direction, it is possible to prevent adhesion of gas particles scattered during drying. As a result, it is possible to reduce the occurrence of defects due to the adhesion of foreign matter.

Further, since the cure baking chamber can be additionally provided, the cure baking section can be connected according to the curing characteristics depending on the type of resin. As a result, the quality of the resin drying / curing process can be improved.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic configuration diagram showing a baking apparatus which is an embodiment of the present invention, FIG. 2 is a detailed view showing a main part of a drying baking chamber in the baking apparatus of this embodiment, and FIG. 3 is this embodiment. FIG. 4 is a configuration diagram showing a resin sealing system composed of the baking device of FIG. 4, and FIG. 4 is a sectional view showing a carrier tape resin-sealed by using the baking device of the present embodiment.

First, the construction of the baking apparatus of this embodiment will be described with reference to FIG.

The baking apparatus of this embodiment has, for example, a T
Baking device 1 for resin sealing by AB mounting method
As shown in FIG. 4, the semiconductor chip 4 is bonded to the carrier tape 3 on which the leads 2 are formed, and the carrier tape 3 applied with the liquid resin 5 is applied. Up to this point, a dry baking section 6 for drying the resin 5 and a cure baking section 7 for further curing the dried resin 5 to a predetermined hardness are formed, and the dry baking section 6 and the cure baking section 7 are combined. The atmosphere is functionally different.

The dry baking unit 6 is a dry baking chamber 8 whose inside is maintained at a temperature of 80 ° C., for example, and the carrier tape 3 is provided on the dry baking chamber 8.
The tape transport path 9 is arranged in the horizontal direction, and a heater 10 for heating temperature-adjustable far infrared rays is provided along the tape transport path 9 on the upper side of the tape transport path 9. Then, the internal temperature of the dry baking chamber 8 is controlled by the heater 10 to be within 5 degrees, for example.

Further, as shown in FIG. 2, a gas outflow path 11 for outflowing nitrogen gas is provided between the tape transport path 9 and the heater 10 inside the dry baking chamber 8, and this gas outflow path 11 is provided. It is connected to a gas tank 12 whose flow rate can be adjusted. Then, the nitrogen gas is preheated to a predetermined temperature in the gas tank 12, and the solvent of the resin 5 or the like can be scattered to some extent by spraying the nitrogen gas onto the resin 5 on the carrier tape 3 to preheat it. It has become. In this case, the nitrogen gas is blown from a direction perpendicular to the carrying direction of the carrier tape 3.

The curing and baking section 7 is, for example, a curing and baking chamber 1 whose inside is kept at a temperature of 120 degrees.
3, two pairs of reversing rollers 14 are arranged in a staggered manner in the vertical direction of the curing baking chamber 13, and a tension adjustable balancer for stabilizing the tension of the carrier tape 3 is provided after the two pairs of reversing rollers 14. A movable roller 16 to which a (tape tension stabilizing mechanism) 15 is connected is provided. Then, as the reversing roller 14 rotates, the carrier tape 3 is reversed and conveyed in the vertical direction, and the balancer 15
The tension of the carrier tape 3 is maintained at a predetermined constant tension by the vertical movement of the movable roller 16 due to.

Further, in the vicinity of the carrier path of the carrier tape 3, a heater 17 for heating similar to the dry baking unit 6 and a gas outflow path 18 for outflowing nitrogen gas are provided along the carrier path, and the cure baking is performed. The temperature of the chamber 13 is higher than that of the dry baking chamber 8 and the nitrogen gas is controlled to have a small amount of nitrogen gas.

Baking apparatus 1 configured as described above
Is configured as a part of a resin sealing system as shown in FIG. 3, for example, a potting device 19 for resin coating process which is a pre-process of the baking process is connected to the left side, and a carrier system by a reel method is further provided on the left side thereof. A loader mechanism 20 for supplying the tape 3 is connected.

On the other hand, on the right side of the baking apparatus 1, a reel type unloader mechanism 21 for winding the carrier tape 3 in the post process of the baking process is connected.

Next, the operation of this embodiment will be described.

First, in each step of manufacturing the carrier tape 3 and forming bumps on the semiconductor chip 4, the carrier tape 3 and the semiconductor chip 4 on which the bumps are formed are manufactured. Then, in the packaging process, first, the ILB process in which the lead 2 on the carrier tape 3 and the electrode of the semiconductor chip 4 are connected via the bump is performed, and then the resin sealing process of the present invention is performed.

First, the carrier tape 3 which has finished the ILB process is set on the loader mechanism 20 in a state of being wound on a reel, while the empty reel is set on the unloader mechanism 21 and the carrier tape 3 whose resin sealing is completed. Is wound up.

First, in the potting device 19,
The resin 5 is applied to a predetermined portion of the carrier tape 3 conveyed from the loader mechanism 20 corresponding to each semiconductor chip 4, for example, the entire area including inner leads such as device hole sealing. Then, the carrier tape 3 coated with the resin 5 is conveyed to the baking device 1.

Further, in the baking apparatus 1, first, the resin 5 is transported to a certain extent by being conveyed in the dry baking chamber 8 of the dry baking unit 6 in which the temperature is kept at 80 degrees by the heater 10. In this case, the preheated nitrogen gas is blown to preheat the resin 5 and thereby the solvent of the resin 5 can be blown to some extent, so that the generation of bubbles inside the resin 5 which has been a conventional problem is reduced. It becomes possible to do.

At the same time, nitrogen gas is blown from a direction perpendicular to the conveying direction of the carrier tape 3 to prevent adhesion of gas particles such as solvent scattered by preheating, which is a problem of the prior art. In addition, it is possible to reduce the baking failure such as the discoloration of No. 2 and the deformation of the lead 2 due to the deformation of the carrier tape 3.

Subsequently, the carrier tape 3 coated with the resin 5 which has been dried to a certain extent is cured by the cure baking unit 7.
Transport to. Then, in the cure baking unit 7,
The resin is cured to a predetermined hardness, for example, a hardness of 2H or more of a pencil by being reversed and conveyed in the cure baking chamber 13 kept at a predetermined atmospheric condition, for example, a temperature of 120 degrees.

In this case, since the carrier tape 3 can be conveyed in the vertical direction, it is possible to prevent the carrier tape 3 from sagging, which has been a problem in the prior art, and to stabilize the conveyance. Further, since the tension of the carrier tape 3 is kept constant by the vertical movement of the movable roller 16 by the balancer 15, the carrier tape 3 can be transported more stably.

Then, after the resin 5 is hardened to a predetermined hardness, the resin tape-sealed carrier tape 3 is wound around the reel of the unloader mechanism 21, and the resin sealing process for one reel is completed. In this way, the above steps can be repeated for each reel to efficiently assemble a large number of semiconductor integrated circuit devices.

Therefore, according to the baking apparatus 1 of this embodiment, the working efficiency of the resin baking process can be improved by functionally separating the dry baking section 6 and the cure baking section 7 under different atmospheric conditions. You can

The carrier tape 3 can be stably conveyed by vertically reversing and conveying the carrier tape 3 by the reversing roller 14 and stabilizing the tension of the carrier tape 3 constant by the balancer 15.

Furthermore, in addition to the functional separation between the dry baking section 6 and the cure baking section 7, nitrogen gas is blown from the direction perpendicular to the carrying direction of the carrier tape 3 so that the quality of the resin 5 in the baking process is improved. Can be improved.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in the baking apparatus 1 of this embodiment, a dry baking section 6 and a cure baking section 7 are provided.
I explained the case where and consisted of 1 unit each,
The present invention is not limited to the above-described embodiment, but is applicable to the case where the cure baking unit 7 is additionally installed depending on the curing characteristics of the type of the resin 5 or the like.

The baking apparatus 1 of the present embodiment has been described in connection with the loader mechanism 20, the potting apparatus 19 and the unloader mechanism 21. However, for example, the baking apparatus 1 may be used alone, or still another type. It is also possible to use it in combination. For example, the present invention is also applicable to a case where a bonding device for ILB is inserted between the loader mechanism 20 and the potting device 19, or a marking device and a resin thickness measuring mechanism are connected after the baking device 1.

In the above description, the case where the invention mainly made by the present inventor is applied to the baking apparatus 1 used for the TAB mounting, which is the field of use of the invention, is not limited to this and other embodiments are described. The present invention is also widely applicable to a baking device used in a resin sealing process for semiconductor integrated circuit devices.

[0055]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1). By functionally separating the baking chamber into a dry baking chamber and a cure baking chamber having different atmospheric conditions, the internal conditions such as temperature and atmosphere of the dry baking chamber and the cure baking chamber are changed, Liquid resin is first dried in a dry baking chamber under the optimum conditions up to the hardness at which the carrier tape coated with this resin can be inverted, and then the dried resin is cured under the optimum conditions up to the specified hardness in the cure baking chamber. Therefore, the work efficiency of the resin drying / curing process can be improved.

(2) By arranging the reversing rollers in a staggered manner in the vertical direction of the cure baking chamber, the carrier tape can be conveyed in the same vertical direction as the self-weight direction of the carrier tape as the reversing roller rotates. Therefore, the carrier tape can be stably transported.

(3) By providing a tape tension stabilizing mechanism for stabilizing the tension of the carrier tape in the carrier tape conveying path, the carrier tape can be maintained at a constant tension of a predetermined value. In addition to (2), it is possible to further stabilize the transport of the carrier tape.

(4) By making the gas flow direction, which is one of the atmospheric conditions of the dry baking chamber, different from the transport direction of the carrier tape, it is possible to prevent the adhesion of gas particles scattered during drying. It is possible to reduce the occurrence of defects due to adhesion of foreign matter and improve the quality.

(5). By making it possible to add at least one or more curing baking chambers, the curing baking chambers are connected according to the curing characteristics depending on the type of resin and the like.
In addition to (4), it is possible to further improve quality in the resin drying / curing process.

(6) According to the above (1) to (5), a baking apparatus capable of improving the working efficiency and quality of the resin drying / curing process in the resin sealing step of the semiconductor integrated circuit device in the TAB mounting. Can be obtained.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing a baking apparatus that is an embodiment of the present invention.

FIG. 2 is a detailed view showing a main part of a dry baking chamber in the baking apparatus of this embodiment.

FIG. 3 is a configuration diagram showing a resin sealing system including a baking device according to the present embodiment.

FIG. 4 is a cross-sectional view showing a carrier tape which is resin-sealed by using the baking apparatus of this embodiment.

[Explanation of symbols]

 1 Baking Device 2 Lead 3 Carrier Tape 4 Semiconductor Chip 5 Resin 6 Dry Baking Section 7 Cure Baking Section 8 Dry Baking Chamber 9 Tape Conveying Path 10 Heater 11 Gas Outflow Path 12 Gas Tank 13 Cure Baking Chamber 14 Reversing Roller 15 Balancer 16 movable roller 17 heater 18 gas outflow path 19 potting device 20 loader mechanism 21 unloader mechanism

Claims (5)

[Claims] 1. A liquid resin is applied to a predetermined portion of a carrier tape to which a plurality of semiconductor chips are bonded,
A baking apparatus of a TAB mounting system, in which a carrier tape coated with the resin is reversely conveyed in a baking chamber kept under a predetermined atmospheric condition to dry and cure the resin, the baking chamber having different atmospheric conditions. It is functionally separated into a dry baking chamber and a cure baking chamber, the resin is dried in the dry baking chamber to a reversible hardness of a carrier tape coated with the resin, and the resin is further dried in the cure baking chamber. A baking device for curing to a predetermined hardness. 2. The stirrer reversing rollers are arranged in a vertical direction in the cure baking chamber, and the carrier tape coated with the resin is conveyed in the vertical direction as the reversing rollers rotate. The baking device according to claim 1. 3. A tape tension stabilizing mechanism for stabilizing the tension of the carrier tape, which is provided in a conveying path of the carrier tape coated with the resin, and holds the carrier tape at a constant tension of a predetermined value. The baking apparatus according to claim 1 or 2. 4. The gas flow direction, which is one of the atmospheric conditions in the dry baking chamber, is different from the conveying direction of the carrier tape coated with the resin. Baking equipment. 5. The at least one cure baking chamber can be additionally installed.
The baking apparatus according to 2, 3, or 4.