KR100621598B1 - Apparatus for packaging plurality of chips using laser and method of the same - Google Patents

Abstract

Disclosed are a plurality of chip packaging apparatus and methods using a laser. The chip bonding part adheres a plurality of chips to a ceramic substrate and applies a resin for insulation and chip protection between the plurality of chips. The laser generator emits a laser beam having a predetermined energy. The optical unit adjusts the laser beam emitted from the laser generating unit to have a uniform energy distribution with respect to the irradiation area formed on the resin-coated ceramic substrate. The stage is intermittently driven by the first movement interval in one direction, rotates at a predetermined rotation angle, and is intermittently driven by the second movement interval in the other direction. The transfer module transfers the resin-coated ceramic substrate to the stage, and unloads the processed ceramic substrate from the stage. At this time, the laser beam is irradiated to the ceramic substrate mounted on the stage while the stage driven intermittently in one direction and the other direction is stopped, and the resin exists between the plurality of chips in the first and second axis directions on the ceramic substrate. Remove it. According to the present invention, by removing the resin region between the chip using a laser not only provides the reliability of the next process but also can process several ceramic substrates at the same time, productivity is improved to reduce the production cost of the chip package Can be reduced.

Laser, package, flip chip, ceramic substrate, polyimide

Description

Apparatus for packaging multiple of chips using laser and method of the same}

1 is a block diagram showing the configuration of an embodiment of a chip packaging apparatus using a laser according to the present invention,

2 is a diagram illustrating a detailed configuration of a ceramic substrate 200 on which a plurality of chips are mounted.

3 is a flowchart illustrating a process of performing an embodiment of a chip packaging method using a laser according to the present invention.

The present invention relates to a chip packaging apparatus and method using a laser, and more particularly, to a method and apparatus capable of packaging a plurality of chips at a chip size at a time.

In general, devices such as semiconductor devices and optical devices are mounted on a printed circuit board in the form of a package. This package has a structure that can easily connect the terminal of the device to the signal pattern of the printed circuit board, and serves to ensure reliability by protecting the element from external influences. In addition, the package of the device is gradually miniaturized in accordance with the miniaturization of the product, there is a chip scale package (chip scale package) as a typical miniaturization package method. The chip-scale package, on the other hand, combines flip-chip technology with advantages in small-die-size, low inductance, high I / O count, and direct thermal path. In order to improve the productivity when applying the package technology that combines flip chip technology and chip scale package method, a plurality of chips are attached on the ceramic substrate to complete the package and sawing by the package unit.

In detail, a plurality of chip packaging methods will be described. A plurality of chip dies are bonded to a ceramic substrate by flip chip bonding using a solder bump for electrical connection between the ceramic substrate and the chip. After the chips are bonded to the ceramic substrate, resin is applied to the entire substrate for electrical insulation, chip protection, and chip support. Next, the resin between the chip and the chip is removed to open the ground pad existing for each chip and to open the ceramic substrate between the chips. Thereafter, a metal is used that is used for the outer shield housing and is in electrical contact with the ground pad. The ceramic substrate coated with metal is singulated by a sawing machine.

According to the aforementioned conventional chip packaging method, the process of removing the resin present between the chips after applying the resin to the substrate has a great influence on the process of applying the metal, which is the next process. If the resin is not completely removed or the pattern boundary area from which the resin is removed is not removed neatly, adhesion between the metal and the open ceramic substrate may be a problem during metal application, which may cause the metal housing to detach from the resin after the package is completed. have. In addition, when the ground pad is not completely open or any damage (for example, oxidation, delamination) occurs, a poor electrical contact between the metal housing and the ground pad causes a problem in the ground role.

Meanwhile, a process of removing the resin between the chip and the chip after applying the resin may be performed by using a dicing machine or a sawing machine. However, the dicing or sawing machine removes the resin by mechanical action, so the resin in the ground pad area may be affected by resin delamination, ceramic damage, and the step between the ground pad and the ground pad. May not be completely removed or the ceramics around the pad area may not be completely opened, thereby causing a problem in the reliability of the post process.

The technical problem to be achieved by the present invention is to apply the resin to the entire ceramic substrate for the purpose of chip protection and support on the ceramic substrate to which a plurality of chips are attached by a flip chip bonding method is present in all spaces between the chip and the chip. The present invention provides an apparatus and method for packaging a plurality of chips at a time by allowing the contact of a metal outer shield, which is the next process, by opening a ground pad existing for each chip by removing the resin at once.

A plurality of chip packaging apparatus using a laser according to the present invention for achieving the above technical problem, a chip for bonding a plurality of chips to a ceramic substrate, and coating a resin for insulation and chip protection between the plurality of chips Adhesive portion; A laser generator for emitting a laser beam having a predetermined energy; An optical unit which controls the laser beam emitted from the laser generation unit to have a uniform energy distribution with respect to an irradiation area formed on the resin-coated ceramic substrate; A stage which is intermittently driven by the first movement interval in one direction and rotates at a predetermined rotation angle, and is intermittently driven by the second movement interval in the other direction; And a transport module for transporting the resin-coated ceramic substrate to the stage, and unloading the processed ceramic substrate from the stage, wherein the laser beam is intermittently in the one direction and the other direction. While the stage being driven is stopped, the ceramic substrate mounted on the stage is irradiated to remove resin existing between the plurality of chips in the first axis and second axis directions on the ceramic substrate.

In order to achieve the above technical problem, a plurality of chip packaging methods using a laser according to the present invention include (a) bonding a plurality of chips to a ceramic substrate, and a resin for insulating and chip protection between the plurality of chips. Applying a; (b) loading the resin-coated ceramic substrate on a stage; (c) a resin existing between the plurality of chips from the ceramic substrate by irradiating a ceramic substrate coated with the resin with a laser beam having a predetermined energy and having a uniform energy distribution over an irradiation area formed on the ceramic substrate; Removing; And (d) unloading the ceramic substrate, from which the resin has been removed by the laser beam, from the stage, wherein step (c) comprises: (c1) the stage at a first movement interval in one direction; Irradiating the laser beam to the ceramic substrate while the stage is stopped while driving intermittently by removing the resin existing in the first axial direction on the ceramic substrate; (c2) rotating the stage at a predetermined rotation angle when the removal of the resin existing in the first axial direction on the ceramic substrate is completed; And (c3) a resin present in the second axial direction on the ceramic substrate by irradiating the laser beam onto the ceramic substrate while the stage is stopped while driving the stage intermittently by a second moving interval in the other direction. Removing;

As a result, by using a laser to remove the resin region between the chip and the chip of the coated resin layer for the purpose of insulating and protecting the chips in the manufacture of a large number of chip packages, not only provide the reliability of the following process but also several ceramic substrates Can be processed at the same time, increasing productivity and reducing production costs per chip package.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of a plurality of chip packaging apparatus and method using a laser according to the present invention.

1 is a block diagram showing the configuration of an embodiment of a chip packaging apparatus using a laser according to the present invention.

Referring to FIG. 1, the chip packaging apparatus 100 using the laser according to the present invention includes a chip adhesive part 110, a laser generating part 120, an optical part 130, a chamber 140, a gas box 150, The transfer module 160, the pumping module 170, the alignment unit 180, and the controller 190 are provided.

The chip adhesive part 110 adheres a plurality of chips to the ceramic substrate 200 using solder balls by flip chip bonding. At this time, at the wafer level, each chip is electrically connected to a chip pad, a wiring layer, or the like, and then solder balls are formed thereon. In addition, the chips to be attached to the ceramic substrate 200 are prepared by singulation of the respective chips by a dicing machine. On the other hand, the chip adhesive part 110 directly adheres the chips after applying a viscous liquefied resin directly to the ceramic substrate 200 or a solidified resin with a thin film by a press method. At this time, the chip adhesive portion 110 is baked at an appropriate temperature to improve the adhesive strength of the resin.

The laser generator 120 supplies a laser source and oscillates a laser beam. The laser generator 120 may oscillate a pulse beam and a continuous wave laser beam, and furthermore, any laser having photon energy may be used as the laser beam. The laser generator 120 emits a laser beam having a level of energy capable of removing the resin present on the ceramic substrate 200. In this case, the emitted laser beam is an excimer laser having a high energy per pulse, and preferably has a form of a line beam to process a plurality of ceramic substrates. On the other hand, the oscillation operation of the laser by the laser generation unit 120, the pulse repetition rate of the oscillation laser, the energy of the laser oscillation is controlled by a control signal input from the controller 190 to be described later.

The optical unit 130 transmits the laser beam oscillated by the laser generator 120 to the ceramic substrate 200 positioned on the chuck 142. The optical unit 130 includes an attenuator 132, a mirror 134, an energy detector 136, and a beam profiler 138, and optionally a homogenizer (not shown) and various lenses (not shown). Etc. are provided. The attenuator 132 adjusts the amount of energy of the laser oscillated from the laser generator 120. The mirror 134 changes the path of the laser beam. The energy detector 136 calculates the laser energy density by measuring the energy irradiated onto the ceramic substrate 200 to be processed. The beam profiler 138 measures the uniformity of the laser beam. The homogenizer allows the laser beam irradiated onto the ceramic substrate 200 to have a uniform energy distribution temporally and spatially with respect to a specific area of the ceramic substrate 200. Field and doublet lenses provide a uniform beam profile over the semiconductor substrate to be processed.

The chamber 140 is a place where the ceramic substrate 200 is processed. The chamber 140 is maintained in a vacuum or gas atmosphere to efficiently process the ceramic substrate 200. The chuck 142 is disposed through a support 144 located above the stage 146. The ceramic substrate 200 is positioned on the chuck 142. Meanwhile, since a plurality of chips exist on the ceramic substrate 200 to be processed, a plurality of lines must be processed when patterning the ceramic substrate 200 using a laser. At this time, the ceramic substrate 200 to be processed must be moved by a certain distance, which is performed by the stage 146 capable of driving the chuck 142. The stage 146 employs a rotating stage capable of moving and rotating on the x and y axes.

2 is a diagram illustrating a detailed configuration of a ceramic substrate 200 on which a plurality of chips are mounted. Referring to FIG. 2, when the resin present in the region is completely removed by irradiating a laser beam to the x1 region of the ceramic substrate 200 located in the chuck 142 in the chamber 140, the stage is a predetermined distance in the x-axis direction. Are sequentially driven, and the removal of the resin present in the x2 to x9 regions is performed. On the other hand, when the resin present in the x1 to x9 region is completely removed, the stage is rotated by 90 degrees, and the resin present in the y1 to y9 region is removed by the same method as the removal method of the resin present in the x-axis direction. At this time, the process of aligning the ceramic substrate 200 by the alignment unit 180 after rotating the ceramic substrate 200 by a rotating stage 90 °.

The gas box 150 supplies a reactive gas and a purge gas to help increase the processing efficiency of the ceramic substrate 200 using a laser. The gas box 150 may include a mass flow controller (MFC) for adjusting a flow rate of gas flowing into the chamber 140, an air valve for starting or blocking gas inflow into the chamber 140, a solenoid valve for driving the air valve, Includes a three-way valve for purging hazardous gases, a check valve to prevent backflow, a filter to prevent particle ingress, a manual valve to control gas opening and closing manually, a regulator to control gas pressure, and a variety of gas lines .

The transfer module 160 transfers the ceramic substrate 200 to the chuck 142. That is, the transfer module 160 supplies the plurality of ceramic substrates 200 into the chamber 140 from the magazine (not shown) by the robot means and draws out the processed ceramic substrate 200 to the outside of the chamber 140. . The transfer module 160 includes a magazine stage on which a magazine is placed, an aligner for aligning the ceramic substrate 200, a cooling stage for cooling the heated ceramic substrate 200 during the process, a robot for transferring the ceramic substrate 200, And a FFU (Fan Filter Unit) for suppressing particle adhesion such as dust in the air. Meanwhile, the transfer module 160 may mount n ² (n = 1, 2, 3, ...) ceramic substrates on the stage at a time to increase processing efficiency. In this case, the laser beam may be mounted on one ceramic substrate 200. ) Is long enough to handle n times the length.

The pumping module 170 has a pumping line that provides a passage for discharging the atmosphere inside the chamber 140. The pumping module 170 is composed of a discharge valve of the chamber 140 and a check valve for preventing pressure, a butterfly valve (throttle valve) for adjusting the pumping amount, and a gate valve. The gate valve is composed of a soft valve for slow pumping and a rough valve for fast pumping. The pumping line is connected to a vacuum pump or the like to induce the formation of a vacuum system in the chamber 140. In addition, the pumping module 170 quickly discharges foreign substances generated by irradiating the laser onto the ceramic substrate 200 to be processed and prevents the foreign substances from adhering to the quartz window.

Although foreign matters generated by laser irradiation to the ceramic substrate 200 to be processed are preferably converted into volatile gases, a large amount of foreign matters having a particle shape substantially occurs. This particle-like foreign matter is moved almost vertically in the vacuum and atmospheric conditions. Because of this, the generated particles are more likely to adhere to the quartz window which must maintain a high transmittance. This causes a problem of energy decay when the laser beam is irradiated through the quartz window. In order to solve this problem, in the present invention, the pumping module 170 is separated into several ports, and two ports are positioned near the chuck 142 on which the ceramic substrate 200 to be processed is placed before foreign matters are attached to the quartz window. Quickly discharges and the remaining ports are installed in appropriate locations to remove any remaining debris.

The alignment unit 180 aligns the ceramic substrate 200 rotated by 90 ° by the rotation of the stage 146. To this end, the alignment unit 180 includes a camera for photographing the alignment state of the ceramic substrate 200 and alignment means for aligning the ceramic substrate 200 based on the image photographed by the camera.

The cleaning unit 185 performs wet cleaning to completely remove the resin remaining in the unloaded ceramic substrate 200 from the chamber 140 after the patterning by the laser is completed. Removal of the resin by such wet cleaning is performed before depositing the metal on the ceramic substrate 200.

The controller 190 controls each component of the chip packaging apparatus 100. In particular, the controller 190 controls the laser generator 110, the optical unit 120, the chamber 140, the gas box 150, the stage 146, the transfer module 160, and the like. In the registers included in the controller 190, recipes for processing various types of semiconductor substrates are stored.

Figure 3 is a flow chart showing the implementation of a preferred embodiment of a plurality of chip packaging method using a laser according to the present invention.

Referring to FIG. 3, at least one ceramic substrate 200 coated with a resin for insulating and protecting chips between a plurality of chips is loaded onto a chuck 142 mounted to a stage 146 in a chamber 140. It becomes (S300). The alignment unit 180 aligns the ceramic substrate 200 loaded on the chuck 142 to perform accurate patterning by the laser beam (S310). The laser beam oscillated from the laser oscillator 120 is irradiated onto the ceramic substrate 200, and the stage 146 is moved at regular intervals in the x-axis direction, thereby patterning a resin layer existing on the ceramic substrate 200 ( S320). When patterning in the x-axis direction is completed, the stage 146 rotates 90 ° (S330). When the rotation of the ceramic substrate 200 is completed, the alignment unit 180 aligns the ceramic substrate 200 to perform accurate patterning in the y-axis direction (S340). The laser beam oscillated from the laser oscillator 120 is irradiated onto the ceramic substrate 200, and the stage 146 is moved at regular intervals in the y-axis direction, thereby patterning the resin layer existing on the ceramic substrate 200 ( S350). In this patterning process, an inert gas is supplied to the ceramic substrate 200 from a nozzle disposed around the chuck 142 in order to completely discharge the resin removed by the laser beam, and an inert gas introduced by a hood located opposite the nozzle. The resin liberated from the ceramic substrate 200 is discharged to the outside of the chamber 140 (S360). When the patterning by the laser beam is completed, the ceramic substrate 200 is unloaded from the chamber 140 by the transfer module 160 and moved to the magazine (S370). Meanwhile, before the metal deposition process is performed on the unloaded ceramic substrate 200 from the chamber 140, a wet cleaning process by the cleaning unit 185 may be selectively performed to remove the resin more completely (S380). .

Hereinafter, a patterning result by a plurality of chip packaging apparatuses and methods using a laser according to the present invention will be presented. The laser used for the experiment was KrF excimer laser having a pulse length of 23 ns, and the experiment was performed considering the laser energy density, the number of pulses, the pulse repetition rate, and the gas atmosphere in the chamber. The sample used in this experiment is a ceramic substrate coated with polyimide after a plurality of chips are attached by a flip chip bonding method. The thickness of the polyimide is 50 μm. The polyimide existing between the chip and the chip was removed using a laser, and the removal was observed using an optical microscope. The optical microscope was used to observe the damage and discoloration of the metal, and the removal of polyimide and the damage of the ceramic substrate. The experimental results are listed in Table 1.

division Energy density (mJ / cm2) Laser irradiation time (sec) Experiment result Metal damage Remove PI Board Damage One 100 23.8 none Complete removal none 2 150 16 none Complete removal none 3 200 12 none Complete removal none 4 250 11 none Complete removal none 5 300 9.4 none Complete removal none 6 350 8.6 none Complete removal none 7 400 8.1 none Complete removal none

Although the present invention exemplifies a method of attaching chip dies cut from a wafer to a substrate by a flip chip method in manufacturing a plurality of chips, a wafer level package (WLP) or a wafer that can be fully packaged without cutting a wafer. It can be applied to the advanced packaging method.

Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the specific preferred embodiments described above, and the present invention belongs to the present invention without departing from the gist of the present invention as claimed in the claims. Various modifications can be made by those skilled in the art, and such changes are within the scope of the claims.

 According to a plurality of chip packaging methods and apparatus using a laser according to the present invention, by removing the resin region between the chip and the chip of the resin layer applied for the purpose of insulating and protecting the chip in the manufacture of a plurality of chip packages by using a laser In addition to providing reliability for the next process, multiple ceramic substrates can be processed simultaneously, increasing productivity and reducing production costs per chip package.

Claims (12)

A chip bonding part for adhering a plurality of chips to a ceramic substrate and coating a resin for insulation and chip protection between the plurality of chips; A laser generator for emitting a laser beam having a predetermined energy; An optical unit which controls the laser beam emitted from the laser generation unit to have a uniform energy distribution with respect to an irradiation area formed on the resin-coated ceramic substrate; A stage which is intermittently driven by the first movement interval in one direction and rotates at a predetermined rotation angle, and is intermittently driven by the second movement interval in the other direction; And And a transport module for transporting the resin-coated ceramic substrate to be mounted on the stage and unloading the ceramic substrate from which the processing is completed. The laser beam is irradiated onto a ceramic substrate mounted on the stage while the stage driven intermittently in the one direction and the other direction is stopped, and is disposed between the plurality of chips in the first and second axis directions on the ceramic substrate. Chip packaging apparatus using a laser, characterized in that the resin present in the. The method of claim 1, A chamber in which the stage is located and maintained in a predetermined gas atmosphere or vacuum atmosphere; A gas box for supplying a predetermined inert gas to the chamber; And And a pumping module for discharging the resin removed from the ceramic substrate together with the inert gas from the chamber or forming a vacuum atmosphere in the chamber. The method according to claim 1 or 2, A plurality of chip packaging apparatus using a laser, characterized in that further comprising an alignment unit for aligning the ceramic substrate rotated by a predetermined rotation angle by the stage. The method according to claim 1 or 2, A plurality of chip packaging apparatus using a laser, characterized in that the resin is a thermosetting resin or a thermoplastic resin. The method according to claim 1 or 2, The stage is mounted with n ² (n = 1, 2, 3, ...) ceramic substrates, and the laser beam has a length corresponding to a length multiplied by n times the size of one ceramic substrate. A plurality of chip packaging device using. The method according to claim 1 or 2, And removing the resin by the laser beam prior to depositing the metal on the ceramic substrate, and performing a wet cleaning to completely remove the resin remaining on the unloaded ceramic substrate from the chamber. A plurality of chip packaging device using a laser. (a) adhering a plurality of chips to a ceramic substrate and applying a resin for insulation and chip protection between the plurality of chips; (b) loading the resin-coated ceramic substrate on a stage; (c) a resin existing between the plurality of chips from the ceramic substrate by irradiating a ceramic substrate coated with the resin with a laser beam having a predetermined energy and having a uniform energy distribution over an irradiation area formed on the ceramic substrate; Removing; And (d) unloading the ceramic substrate from the stage where the removal of the resin by the laser beam is completed; Step (c) is, (c1) irradiating the laser beam to the ceramic substrate while the stage is stopped while driving the stage intermittently by a first moving interval in one direction to remove resin existing in the first axial direction on the ceramic substrate; step; (c2) rotating the stage at a predetermined rotation angle when the removal of the resin existing in the first axial direction on the ceramic substrate is completed; And (c3) while irradiating the stage with the second moving interval in the other direction intermittently, the laser beam is irradiated onto the ceramic substrate while the stage is stopped to remove resin existing in the second axial direction on the ceramic substrate. Chip packaging method using a laser, characterized in that it comprises a. The method of claim 7, wherein Step (c) is, (c4) supplying a predetermined inert gas to the chamber in which the stage is located; And and (c5) discharging the resin removed from the ceramic substrate together with the inert gas from the chamber. The method according to claim 7 or 8, Step (c) further comprises the step of aligning the ceramic substrate rotated by a predetermined rotation angle by the stage, a plurality of chip packaging method using a laser. The method according to claim 7 or 8, The resin is a plurality of chip packaging method using a laser, characterized in that the thermosetting resin or thermoplastic resin. The method according to claim 7 or 8, The stage is mounted with n ² (n = 1, 2, 3, ...) ceramic substrates, and the laser beam has a length corresponding to a length multiplied by n times the size of one ceramic substrate. A plurality of chip packaging method using. The method according to claim 7 or 8, (e) performing wet cleaning to completely remove the resin remaining in the unloaded ceramic substrate from the chamber by removing the resin by the laser beam before depositing the metal on the ceramic substrate. A plurality of chip packaging method using a laser, characterized in that.

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