JPH055400B2 - - Google Patents
Info
- Publication number
- JPH055400B2 JPH055400B2 JP26325385A JP26325385A JPH055400B2 JP H055400 B2 JPH055400 B2 JP H055400B2 JP 26325385 A JP26325385 A JP 26325385A JP 26325385 A JP26325385 A JP 26325385A JP H055400 B2 JPH055400 B2 JP H055400B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- wiring board
- multilayer wiring
- printed
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 81
- 238000007639 printing Methods 0.000 claims description 18
- 238000000605 extraction Methods 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000010304 firing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26325385A JPS62123797A (ja) | 1985-11-22 | 1985-11-22 | セラミツク多層配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26325385A JPS62123797A (ja) | 1985-11-22 | 1985-11-22 | セラミツク多層配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62123797A JPS62123797A (ja) | 1987-06-05 |
| JPH055400B2 true JPH055400B2 (enrdf_load_stackoverflow) | 1993-01-22 |
Family
ID=17386898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26325385A Granted JPS62123797A (ja) | 1985-11-22 | 1985-11-22 | セラミツク多層配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62123797A (enrdf_load_stackoverflow) |
-
1985
- 1985-11-22 JP JP26325385A patent/JPS62123797A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62123797A (ja) | 1987-06-05 |
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