JPH0221157B2 - - Google Patents

Info

Publication number
JPH0221157B2
JPH0221157B2 JP62071906A JP7190687A JPH0221157B2 JP H0221157 B2 JPH0221157 B2 JP H0221157B2 JP 62071906 A JP62071906 A JP 62071906A JP 7190687 A JP7190687 A JP 7190687A JP H0221157 B2 JPH0221157 B2 JP H0221157B2
Authority
JP
Japan
Prior art keywords
ceramic green
green sheet
surface layer
ceramic
conductive paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62071906A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63239999A (ja
Inventor
Fukuzo Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP7190687A priority Critical patent/JPS63239999A/ja
Publication of JPS63239999A publication Critical patent/JPS63239999A/ja
Publication of JPH0221157B2 publication Critical patent/JPH0221157B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP7190687A 1987-03-27 1987-03-27 セラミツク多層積層体の製造方法 Granted JPS63239999A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7190687A JPS63239999A (ja) 1987-03-27 1987-03-27 セラミツク多層積層体の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7190687A JPS63239999A (ja) 1987-03-27 1987-03-27 セラミツク多層積層体の製造方法

Publications (2)

Publication Number Publication Date
JPS63239999A JPS63239999A (ja) 1988-10-05
JPH0221157B2 true JPH0221157B2 (enrdf_load_stackoverflow) 1990-05-11

Family

ID=13474050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7190687A Granted JPS63239999A (ja) 1987-03-27 1987-03-27 セラミツク多層積層体の製造方法

Country Status (1)

Country Link
JP (1) JPS63239999A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009155379A (ja) * 2007-12-25 2009-07-16 Kyocera Corp 接着用樹脂組成物及びそれを用いたセラミック基板の製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6572830B1 (en) 1998-10-09 2003-06-03 Motorola, Inc. Integrated multilayered microfludic devices and methods for making the same
US6592696B1 (en) * 1998-10-09 2003-07-15 Motorola, Inc. Method for fabricating a multilayered structure and the structures formed by the method
TW507484B (en) * 2000-03-15 2002-10-21 Matsushita Electric Ind Co Ltd Method of manufacturing multi-layer ceramic circuit board and conductive paste used for the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61270896A (ja) * 1985-05-24 1986-12-01 富士通株式会社 セラミツク基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009155379A (ja) * 2007-12-25 2009-07-16 Kyocera Corp 接着用樹脂組成物及びそれを用いたセラミック基板の製造方法

Also Published As

Publication number Publication date
JPS63239999A (ja) 1988-10-05

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