JPS63239999A - セラミツク多層積層体の製造方法 - Google Patents
セラミツク多層積層体の製造方法Info
- Publication number
- JPS63239999A JPS63239999A JP7190687A JP7190687A JPS63239999A JP S63239999 A JPS63239999 A JP S63239999A JP 7190687 A JP7190687 A JP 7190687A JP 7190687 A JP7190687 A JP 7190687A JP S63239999 A JPS63239999 A JP S63239999A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic green
- green sheet
- ceramic
- surface layer
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 87
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000002344 surface layer Substances 0.000 claims description 38
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 10
- 238000010304 firing Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 9
- 238000003475 lamination Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000007606 doctor blade method Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 210000001217 buttock Anatomy 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000001932 seasonal effect Effects 0.000 description 1
- 238000007569 slipcasting Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7190687A JPS63239999A (ja) | 1987-03-27 | 1987-03-27 | セラミツク多層積層体の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7190687A JPS63239999A (ja) | 1987-03-27 | 1987-03-27 | セラミツク多層積層体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63239999A true JPS63239999A (ja) | 1988-10-05 |
| JPH0221157B2 JPH0221157B2 (enrdf_load_stackoverflow) | 1990-05-11 |
Family
ID=13474050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7190687A Granted JPS63239999A (ja) | 1987-03-27 | 1987-03-27 | セラミツク多層積層体の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63239999A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6527890B1 (en) | 1998-10-09 | 2003-03-04 | Motorola, Inc. | Multilayered ceramic micro-gas chromatograph and method for making the same |
| US6592696B1 (en) * | 1998-10-09 | 2003-07-15 | Motorola, Inc. | Method for fabricating a multilayered structure and the structures formed by the method |
| US6846375B2 (en) * | 2000-03-15 | 2005-01-25 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing multilayer ceramic wiring board and conductive paste for use |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5408869B2 (ja) * | 2007-12-25 | 2014-02-05 | 京セラ株式会社 | 接着用樹脂組成物及びそれを用いたセラミック基板の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61270896A (ja) * | 1985-05-24 | 1986-12-01 | 富士通株式会社 | セラミツク基板の製造方法 |
-
1987
- 1987-03-27 JP JP7190687A patent/JPS63239999A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61270896A (ja) * | 1985-05-24 | 1986-12-01 | 富士通株式会社 | セラミツク基板の製造方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6527890B1 (en) | 1998-10-09 | 2003-03-04 | Motorola, Inc. | Multilayered ceramic micro-gas chromatograph and method for making the same |
| US6592696B1 (en) * | 1998-10-09 | 2003-07-15 | Motorola, Inc. | Method for fabricating a multilayered structure and the structures formed by the method |
| US6732567B2 (en) | 1998-10-09 | 2004-05-11 | Motorola, Inc. | Multilayered ceramic micro-gas chromatograph and method for making the same |
| US6846375B2 (en) * | 2000-03-15 | 2005-01-25 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing multilayer ceramic wiring board and conductive paste for use |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0221157B2 (enrdf_load_stackoverflow) | 1990-05-11 |
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