JPH0551861B2 - - Google Patents
Info
- Publication number
- JPH0551861B2 JPH0551861B2 JP58001630A JP163083A JPH0551861B2 JP H0551861 B2 JPH0551861 B2 JP H0551861B2 JP 58001630 A JP58001630 A JP 58001630A JP 163083 A JP163083 A JP 163083A JP H0551861 B2 JPH0551861 B2 JP H0551861B2
- Authority
- JP
- Japan
- Prior art keywords
- tape layer
- tape
- semiconductor chip
- semiconductor
- membrane electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 30
- 239000012528 membrane Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 230000005669 field effect Effects 0.000 claims 2
- 239000000126 substance Substances 0.000 description 19
- 238000005538 encapsulation Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 238000004382 potting Methods 0.000 description 4
- 239000013464 silicone adhesive Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000002775 capsule Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 102000004190 Enzymes Human genes 0.000 description 1
- 108090000790 Enzymes Proteins 0.000 description 1
- 239000012620 biological material Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000000984 immunochemical effect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- WABPQHHGFIMREM-IGMARMGPSA-N lead-207 Chemical compound [207Pb] WABPQHHGFIMREM-IGMARMGPSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000009834 selective interaction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012549 training Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Molecular Biology (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/350,929 US4449011A (en) | 1982-01-08 | 1982-01-08 | Method and apparatus for encapsulation of chemically sensitive field effect device |
| US350929 | 1982-01-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58129244A JPS58129244A (ja) | 1983-08-02 |
| JPH0551861B2 true JPH0551861B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-08-03 |
Family
ID=23378801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58001630A Granted JPS58129244A (ja) | 1982-01-08 | 1983-01-07 | 化学的にセンシテイブな電界効果型デバイスのカプセル封じ方法および装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4449011A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
| JP (1) | JPS58129244A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0116117B1 (en) * | 1982-10-21 | 1989-06-14 | Abbott Laboratories | A method of establishing electrical connections at a semiconductor device |
| US4772377A (en) * | 1987-05-22 | 1988-09-20 | Abbott Laboratories | Membrane anchor for ion-selective electrodes |
| US4889612A (en) * | 1987-05-22 | 1989-12-26 | Abbott Laboratories | Ion-selective electrode having a non-metal sensing element |
| DE3827314C1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1988-08-11 | 1989-10-19 | Christoff Prof. Dr. Braeuchle | |
| US4980753A (en) * | 1988-11-21 | 1990-12-25 | Honeywell Inc. | Low-cost high-performance semiconductor chip package |
| US4981817A (en) * | 1988-12-29 | 1991-01-01 | International Business Machines Corporation | Tab method for implementing dynamic chip burn-in |
| US5833824A (en) * | 1996-11-15 | 1998-11-10 | Rosemount Analytical Inc. | Dorsal substrate guarded ISFET sensor |
| DE19814857C2 (de) * | 1998-04-02 | 2000-09-28 | Siemens Ag | Gassensor nach dem Prinzip der Austrittsarbeitsmessung |
| US6117292A (en) * | 1998-05-06 | 2000-09-12 | Honeywell International Inc | Sensor packaging having an integral electrode plug member |
| US6153070A (en) * | 1998-05-07 | 2000-11-28 | Honeywell Inc | Sensor packaging using heat staking technique |
| US6896778B2 (en) | 2001-06-04 | 2005-05-24 | Epocal Inc. | Electrode module |
| CN112985652B (zh) * | 2019-12-17 | 2023-11-28 | 北京钛方科技有限责任公司 | 一种应变片及其制备方法、安装方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3393392A (en) * | 1966-04-27 | 1968-07-16 | Rca Corp | Printed circuit connector |
| US4020830A (en) * | 1975-03-12 | 1977-05-03 | The University Of Utah | Selective chemical sensitive FET transducers |
| JPS5843355B2 (ja) * | 1976-12-20 | 1983-09-26 | 日本特殊陶業株式会社 | セラミツクと低膨張性金属部材の封止構造体 |
| US4132856A (en) * | 1977-11-28 | 1979-01-02 | Burroughs Corporation | Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby |
-
1982
- 1982-01-08 US US06/350,929 patent/US4449011A/en not_active Expired - Lifetime
-
1983
- 1983-01-07 JP JP58001630A patent/JPS58129244A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| US4449011A (en) | 1984-05-15 |
| JPS58129244A (ja) | 1983-08-02 |
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