JPH0550132B2 - - Google Patents
Info
- Publication number
- JPH0550132B2 JPH0550132B2 JP26272588A JP26272588A JPH0550132B2 JP H0550132 B2 JPH0550132 B2 JP H0550132B2 JP 26272588 A JP26272588 A JP 26272588A JP 26272588 A JP26272588 A JP 26272588A JP H0550132 B2 JPH0550132 B2 JP H0550132B2
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- resin
- movable mold
- main surface
- molding cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 95
- 229920005989 resin Polymers 0.000 claims description 95
- 238000000465 moulding Methods 0.000 claims description 70
- 238000007789 sealing Methods 0.000 claims description 60
- 238000002347 injection Methods 0.000 claims description 24
- 239000007924 injection Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 description 12
- 239000011800 void material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26272588A JPH02110946A (ja) | 1988-10-20 | 1988-10-20 | 樹脂封止型電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26272588A JPH02110946A (ja) | 1988-10-20 | 1988-10-20 | 樹脂封止型電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02110946A JPH02110946A (ja) | 1990-04-24 |
| JPH0550132B2 true JPH0550132B2 (enrdf_load_stackoverflow) | 1993-07-28 |
Family
ID=17379726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26272588A Granted JPH02110946A (ja) | 1988-10-20 | 1988-10-20 | 樹脂封止型電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02110946A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2535926Y2 (ja) * | 1989-06-29 | 1997-05-14 | 関西日本電気 株式会社 | 樹脂モールド装置 |
| DE102006017997A1 (de) * | 2005-08-05 | 2007-02-08 | Varta Microbattery Gmbh | Mobiles Ladegerät zum Aufladen von Sekundärbatterien aus Sekundärbatterien |
| US8120309B2 (en) | 2005-08-05 | 2012-02-21 | Varta Microbattery Gmbh | Apparatus and method for charging a first battery from a second battery |
-
1988
- 1988-10-20 JP JP26272588A patent/JPH02110946A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02110946A (ja) | 1990-04-24 |
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