JPH0548619B2 - - Google Patents

Info

Publication number
JPH0548619B2
JPH0548619B2 JP61046502A JP4650286A JPH0548619B2 JP H0548619 B2 JPH0548619 B2 JP H0548619B2 JP 61046502 A JP61046502 A JP 61046502A JP 4650286 A JP4650286 A JP 4650286A JP H0548619 B2 JPH0548619 B2 JP H0548619B2
Authority
JP
Japan
Prior art keywords
component
rectangular parallelepiped
board
parts
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61046502A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62203339A (ja
Inventor
Akihiro Yamamoto
Yutaka Makino
Hisashi Nakamura
Teruo Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP61046502A priority Critical patent/JPS62203339A/ja
Publication of JPS62203339A publication Critical patent/JPS62203339A/ja
Publication of JPH0548619B2 publication Critical patent/JPH0548619B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Special Conveying (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
  • Facsimile Heads (AREA)
  • Die Bonding (AREA)
JP61046502A 1986-03-04 1986-03-04 部品のボンデイング方法 Granted JPS62203339A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61046502A JPS62203339A (ja) 1986-03-04 1986-03-04 部品のボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61046502A JPS62203339A (ja) 1986-03-04 1986-03-04 部品のボンデイング方法

Publications (2)

Publication Number Publication Date
JPS62203339A JPS62203339A (ja) 1987-09-08
JPH0548619B2 true JPH0548619B2 (enrdf_load_stackoverflow) 1993-07-22

Family

ID=12749016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61046502A Granted JPS62203339A (ja) 1986-03-04 1986-03-04 部品のボンデイング方法

Country Status (1)

Country Link
JP (1) JPS62203339A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2722601B2 (ja) * 1989-02-06 1998-03-04 松下電器産業株式会社 ダイボンディング装置及びダイボンディング方法
DE10140661C1 (de) * 2001-08-24 2003-01-16 Orga Kartensysteme Gmbh Vorrichtung und Verfahren zur Herstellung von Flip-Chip-Modulen
EP3310147B1 (en) * 2015-06-15 2019-09-11 FUJI Corporation Component mounting machine

Also Published As

Publication number Publication date
JPS62203339A (ja) 1987-09-08

Similar Documents

Publication Publication Date Title
EP1084599A2 (de) Verfahren und vorrichtung zum linearen positionieren und zur lageerkennung eines substrates
JPH0548619B2 (enrdf_load_stackoverflow)
JP2009004652A (ja) 電子部品の実装装置及び実装方法
JPS6344620B2 (enrdf_load_stackoverflow)
JP4909539B2 (ja) スキージヘッド
CN218677056U (zh) 一种固晶机及其压料装置
JP4708896B2 (ja) 粘着性テープの貼着装置及び貼着方法
JPH1117397A (ja) ワークの下受装置
JPH062995Y2 (ja) 基板給送装置
JPS60259446A (ja) スクリーン印刷におけるスクリーン版と被印刷体の位置整合装置
US11006560B2 (en) Method of manufacturing component-mounted substrate
JP2722601B2 (ja) ダイボンディング装置及びダイボンディング方法
JPS6351400B2 (enrdf_load_stackoverflow)
JP7265304B1 (ja) テープ貼着装置
JP2751550B2 (ja) 半導体チップのボンディング装置
JPS607399B2 (ja) 自動スクリ−ン印刷機
JPH05198993A (ja) 電子部品の実装方法および実装装置
JP2679240B2 (ja) ダイコレット及びダイコレットによるベアチップの搭載方法
US4385718A (en) Strip advancing mechanism
JP7429701B2 (ja) 作業機、および部品装着方法
JPH0734511Y2 (ja) 磁気ヘッド装置
JPH0743066Y2 (ja) ホッパ機構
JPH0126159Y2 (enrdf_load_stackoverflow)
JPH02251152A (ja) 接着シートの貼付け方法
JPH0814953B2 (ja) テープパッドの折り曲げ方法