JPH0548619B2 - - Google Patents

Info

Publication number
JPH0548619B2
JPH0548619B2 JP4650286A JP4650286A JPH0548619B2 JP H0548619 B2 JPH0548619 B2 JP H0548619B2 JP 4650286 A JP4650286 A JP 4650286A JP 4650286 A JP4650286 A JP 4650286A JP H0548619 B2 JPH0548619 B2 JP H0548619B2
Authority
JP
Japan
Prior art keywords
component
rectangular parallelepiped
board
parts
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4650286A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62203339A (ja
Inventor
Akihiro Yamamoto
Yutaka Makino
Hisashi Nakamura
Teruo Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP4650286A priority Critical patent/JPS62203339A/ja
Publication of JPS62203339A publication Critical patent/JPS62203339A/ja
Publication of JPH0548619B2 publication Critical patent/JPH0548619B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Special Conveying (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
  • Facsimile Heads (AREA)
JP4650286A 1986-03-04 1986-03-04 部品のボンデイング方法 Granted JPS62203339A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4650286A JPS62203339A (ja) 1986-03-04 1986-03-04 部品のボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4650286A JPS62203339A (ja) 1986-03-04 1986-03-04 部品のボンデイング方法

Publications (2)

Publication Number Publication Date
JPS62203339A JPS62203339A (ja) 1987-09-08
JPH0548619B2 true JPH0548619B2 (enrdf_load_stackoverflow) 1993-07-22

Family

ID=12749016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4650286A Granted JPS62203339A (ja) 1986-03-04 1986-03-04 部品のボンデイング方法

Country Status (1)

Country Link
JP (1) JPS62203339A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2722601B2 (ja) * 1989-02-06 1998-03-04 松下電器産業株式会社 ダイボンディング装置及びダイボンディング方法
DE10140661C1 (de) * 2001-08-24 2003-01-16 Orga Kartensysteme Gmbh Vorrichtung und Verfahren zur Herstellung von Flip-Chip-Modulen
EP3310147B1 (en) * 2015-06-15 2019-09-11 FUJI Corporation Component mounting machine

Also Published As

Publication number Publication date
JPS62203339A (ja) 1987-09-08

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