JPH0547999B2 - - Google Patents
Info
- Publication number
- JPH0547999B2 JPH0547999B2 JP59043240A JP4324084A JPH0547999B2 JP H0547999 B2 JPH0547999 B2 JP H0547999B2 JP 59043240 A JP59043240 A JP 59043240A JP 4324084 A JP4324084 A JP 4324084A JP H0547999 B2 JPH0547999 B2 JP H0547999B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- insulated
- wires
- grid
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4324084A JPS60187096A (ja) | 1984-03-07 | 1984-03-07 | 絶縁電線を配線パタ−ンに使用した配線板の製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4324084A JPS60187096A (ja) | 1984-03-07 | 1984-03-07 | 絶縁電線を配線パタ−ンに使用した配線板の製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60187096A JPS60187096A (ja) | 1985-09-24 |
JPH0547999B2 true JPH0547999B2 (it) | 1993-07-20 |
Family
ID=12658374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4324084A Granted JPS60187096A (ja) | 1984-03-07 | 1984-03-07 | 絶縁電線を配線パタ−ンに使用した配線板の製造法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60187096A (it) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4899651A (it) * | 1972-02-28 | 1973-12-17 | ||
JPS5171961A (en) * | 1974-12-20 | 1976-06-22 | Hitachi Ltd | Haisenkibanno shingosensogokanno rowateigenho |
JPS5694697A (en) * | 1979-12-27 | 1981-07-31 | Nippon Electric Co | Multiwire circuit board |
-
1984
- 1984-03-07 JP JP4324084A patent/JPS60187096A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4899651A (it) * | 1972-02-28 | 1973-12-17 | ||
JPS5171961A (en) * | 1974-12-20 | 1976-06-22 | Hitachi Ltd | Haisenkibanno shingosensogokanno rowateigenho |
JPS5694697A (en) * | 1979-12-27 | 1981-07-31 | Nippon Electric Co | Multiwire circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS60187096A (ja) | 1985-09-24 |
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