JPH0547513B2 - - Google Patents
Info
- Publication number
- JPH0547513B2 JPH0547513B2 JP17256989A JP17256989A JPH0547513B2 JP H0547513 B2 JPH0547513 B2 JP H0547513B2 JP 17256989 A JP17256989 A JP 17256989A JP 17256989 A JP17256989 A JP 17256989A JP H0547513 B2 JPH0547513 B2 JP H0547513B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- melting point
- heat treatment
- ceramics
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims description 130
- 239000002184 metal Substances 0.000 claims description 130
- 239000000919 ceramic Substances 0.000 claims description 61
- 238000005219 brazing Methods 0.000 claims description 50
- 238000002844 melting Methods 0.000 claims description 44
- 230000008018 melting Effects 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 39
- 238000010438 heat treatment Methods 0.000 claims description 36
- 239000000945 filler Substances 0.000 claims description 15
- 239000010935 stainless steel Substances 0.000 claims description 9
- 229910001220 stainless steel Inorganic materials 0.000 claims description 9
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 229910052790 beryllium Inorganic materials 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 description 8
- 239000001993 wax Substances 0.000 description 7
- 239000010936 titanium Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 239000002905 metal composite material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- -1 SiC and SiN Chemical class 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17256989A JPH0337166A (ja) | 1989-07-04 | 1989-07-04 | セラミックスと金属との接合方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17256989A JPH0337166A (ja) | 1989-07-04 | 1989-07-04 | セラミックスと金属との接合方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0337166A JPH0337166A (ja) | 1991-02-18 |
JPH0547513B2 true JPH0547513B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-07-16 |
Family
ID=15944269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17256989A Granted JPH0337166A (ja) | 1989-07-04 | 1989-07-04 | セラミックスと金属との接合方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0337166A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102728918B (zh) * | 2012-06-13 | 2014-06-25 | 陕西渭河煤化工集团有限责任公司 | 一种通过热粘结连接wc阀芯与不锈钢阀杆的方法 |
CN102924109B (zh) * | 2012-10-18 | 2013-12-11 | 北京科技大学 | 一种Cf/SiC陶瓷基复合材料连接方法 |
CN103273155B (zh) * | 2013-05-10 | 2015-07-08 | 山东大学 | 一种碳化硅陶瓷与铁素体不锈钢的扩散连接方法 |
JP7576413B2 (ja) * | 2020-08-19 | 2024-10-31 | 日本特殊陶業株式会社 | 接合体および基板保持部材 |
-
1989
- 1989-07-04 JP JP17256989A patent/JPH0337166A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0337166A (ja) | 1991-02-18 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080716 Year of fee payment: 15 |
|
LAPS | Cancellation because of no payment of annual fees |