JPH0546282Y2 - - Google Patents
Info
- Publication number
- JPH0546282Y2 JPH0546282Y2 JP1987180582U JP18058287U JPH0546282Y2 JP H0546282 Y2 JPH0546282 Y2 JP H0546282Y2 JP 1987180582 U JP1987180582 U JP 1987180582U JP 18058287 U JP18058287 U JP 18058287U JP H0546282 Y2 JPH0546282 Y2 JP H0546282Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- frame
- island
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180582U JPH0546282Y2 (en:Method) | 1987-11-26 | 1987-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180582U JPH0546282Y2 (en:Method) | 1987-11-26 | 1987-11-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0184450U JPH0184450U (en:Method) | 1989-06-05 |
| JPH0546282Y2 true JPH0546282Y2 (en:Method) | 1993-12-03 |
Family
ID=31472096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987180582U Expired - Lifetime JPH0546282Y2 (en:Method) | 1987-11-26 | 1987-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0546282Y2 (en:Method) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53108283A (en) * | 1977-03-03 | 1978-09-20 | Kyushu Nippon Electric | Loading frame for lead frame |
| JPS55146952A (en) * | 1979-05-02 | 1980-11-15 | Hitachi Ltd | Lead frame |
-
1987
- 1987-11-26 JP JP1987180582U patent/JPH0546282Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0184450U (en:Method) | 1989-06-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE102017205116A1 (de) | Halbleitervorrichtung und Fertigungsverfahren derselben | |
| JPH0546282Y2 (en:Method) | ||
| JP3091424B2 (ja) | 穿孔装置 | |
| US4597816A (en) | Scrap-less taping system for IC lead-frames | |
| JP2617218B2 (ja) | 半導体部品の製造方法及びその製造方法に使用するリードフレーム | |
| GB1322788A (en) | Methods of forming electrical connections | |
| JPH077071U (ja) | 端子盤 | |
| JPH0582739B2 (en:Method) | ||
| JPH073645Y2 (ja) | 半導体装置用リードフレーム | |
| JPH0451487Y2 (en:Method) | ||
| JPH06834Y2 (ja) | 半導体装置用リ−ドフレ−ム | |
| JPS62101058A (ja) | 半導体素子用リ−ドフレ−ム | |
| JPS5987152U (ja) | 半導体装置用フレ−ム | |
| JP2527673Y2 (ja) | 搬送用送り孔を有する帯状連続部材の継手板 | |
| JPH056867U (ja) | 印刷回路基板 | |
| KR200145263Y1 (ko) | 리드 프레임 | |
| JPH0252860B2 (en:Method) | ||
| JP2505295Y2 (ja) | 電線処理機におけるカッタ―の取付け用治具 | |
| JPH064582Y2 (ja) | フィルムキャリア | |
| JPS6050347B2 (ja) | シングルインライン半導体装置用リ−ドフレ−ム | |
| JPS588697Y2 (ja) | 電子部品の保持テ−プ | |
| JPH02288259A (ja) | 樹脂封止型半導体装置用リードフレーム | |
| JPS59229824A (ja) | ロツトエンド検出方法 | |
| JPH04164357A (ja) | 半導体装置用リードフレーム | |
| JPS6398136A (ja) | 半導体装置の製造方法 |