JPH0546063U - Multi-sided printed circuit board - Google Patents

Abstract

(57) [Abstract] [Purpose] An object of the present invention is to provide a multi-sided printed circuit board in which a plurality of sub printed circuit boards are arranged, and to facilitate the work of separating the sub printed circuit boards. [Structure] A perforation 4 including a gap 5 and a connection margin 6 is formed around the sub-printed board 2, and the connection margin 6 is
Formed to extend inside the side of the sub-printed circuit board 2,
The connection margin strength reinforcing pattern 7 is formed in a region including the connection margin 6 and a region in the vicinity thereof, except for the slit 8 located inside the side of the sub-printed circuit board 2 on the connection margin 6.
Are formed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to improvement of a multi-sided printed circuit board.

[0002]

[Prior Art]

 On a multi-sided printed circuit board in which a large number of sub printed circuit boards are arranged in a separable state, the wiring process and component assembly process are performed collectively for each sub printed circuit board, and the individual sub printed circuit boards are separated in the final process. The method is widely used due to its high work efficiency.

FIG. 3 is a plan view of the multiple-sided printed circuit board 1 in which the sub printed circuit boards 2 are arranged. A perforation 4 including a gap 5 and a connection margin 6 is formed around the sub-printed circuit board 2, and is cut off from each other by cutting the connection margin 6 in the final step. In addition, a discarding plate 3 is provided in the peripheral area of the multi-sided printed circuit board 1 in order to adjust the outer dimensions of the sub printed circuit board 2. The separated sub-printed circuit boards 2 are mounted on a device (not shown) as needed.

The cutting of the connection margin 6 is usually performed by an operator by bending it with a tool such as a nipper or by hand. As shown in the enlarged view of FIG. 3, the connection margin 6 is formed to extend inside the side of the sub-printed circuit board 2. As a result, the effective length of the connection allowance 6 becomes longer, so that the influence of the force applied to the connection allowance 6 on the sub-printed circuit board 2 when the connection allowance 6 is bent is reduced. It is possible to prevent an accident that breaks at a location.

[0005]

[Problems to be solved by the device]

 However, since the strength of the connection margin 6 itself is uniform on the connection margin 6, when the connection margin 6 is bent, it is not constant at which position the connection margin 6 is cut. For example, when cutting is performed near the center of the connection margin 6 as seen in the cut surface 9 in FIG. 2, the separated sub-print substrate 2 is connected to the outside of the side of the sub-printed substrate 2 in a protruding shape. The margin is left so as to protrude, which may hinder the mounting of the separated sub-printed circuit board 2 in the device. Therefore, conventionally, it was necessary to remove the projecting connection allowance after separating the sub-printed circuit board 2. There is a problem that performing such an operation for a large number of connection costs requires time and reduces the efficiency of the work of separating the sub-printed circuit board 2.

Therefore, an object of the present invention is to improve the efficiency of the sub-printed board separating operation.

[0007]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, in a multi-sided printed circuit board 1 in which a plurality of sub-printed circuit boards 2 are arranged, perforations 4 including a gap 5 and a connection allowance 6 are formed around the sub-printed circuit board 2, and the connection is performed. The margin 6 is formed by extending to the inside of the side of the sub-printed circuit board 2 and includes the connection margin 6 and a region in the vicinity thereof, and is inside the side of the sub-printed circuit board 2 on the connection margin 6. This is achieved by a multi-faced printed circuit board 1 characterized in that a pattern 7 for strengthening the connection margin strength is formed in a region excluding the slit 8 located at.

[0008]

[Action]

 In the present invention, since the connection margin strength reinforcing pattern 7 is formed in a region on the connection margin 6 excluding the slit 8 located inside the side of the sub-printed circuit board 2, the slit 8 is formed on the connection margin 6. Only the strength is weaker in comparison with other areas. Therefore, when the connection margin 6 is bent with a tool or by hand, it is likely to be cut at the position of the slit 8. Further, since the slit 8 is located inside the side of the sub-printed circuit board 2, the protruding connection margin does not extend outside the side of the sub-printed circuit board 2 from the separated sub-printed circuit board 2.

[0009]

【Example】

 FIG. 1 is a plan view of a multi-faced printed circuit board showing an embodiment of the present invention, and the same parts as those in FIG. 3 are designated by the same reference numerals.

The multi-sided printed circuit board 1 is formed by mixing epoxy resin or phenol resin with polyester fiber or aramid fiber into a plate shape, and adhering a copper foil on one side or both sides thereof. The copper foil is patterned to form wiring. If necessary, a plurality of such substrates are adhered to each other to form a multilayer structure.

In this embodiment, when forming the above-mentioned wiring pattern, at the same time, as shown in an enlarged view of FIG. 1, a connection margin strength reinforcing pattern 7 made of copper foil is formed. Strength of connection allowance The reinforcing pattern 7 is a region including the connection allowance 6 and a region in the vicinity thereof, and a copper foil is formed in an area on the connection allowance 6 except for the slit 8 located inside the side of the sub-printed circuit board 2. Composed of what you made. Fig. 2 shows a cross-sectional view of the connection allowance 6, and as seen in the figure, since the copper foil is not formed on the slits 8, as compared to the other areas of the connection allowance 6, it is relatively large. The strength becomes weak. Therefore, when the connection margin 6 is bent by a tool such as a nipper or by hand, the connection margin 6 is cut at the position of the slit 8, and as a result, the sub-printed circuit board 2 without the protrusion connection margin can be obtained.

As shown in FIG. 1, when two slits 8 are provided in the connection margin strength reinforcing pattern 7, when the sub-printed circuit board 2 is separated, one sub-printed board has a protrusion shape. Although the connection allowance remains, the remaining connection allowance is easily cut at the position of the slit 8 by bending and can be removed.

The connection margin strength reinforcing pattern 7 can be obtained by patterning a copper foil on one side or both sides of a printed circuit board. Further, among printed circuit boards having a multilayer structure, any printed circuit board or all printed circuit boards can be obtained. It may be patterned into.

[0014]

[Effect of the device]

 As described above, according to the present invention, it is possible to easily obtain a sub-printed circuit board without a protruding connection margin, which is useful for improving the efficiency of the work for separating the sub-printed circuit board.

[Brief description of drawings]

1 is a plan view showing an embodiment of the present invention,

FIG. 2 is a sectional view showing a connection allowance,

FIG. 3 is a plan view showing the problems of the conventional example,

[Explanation of symbols]

1 multi-sided printed circuit board, 6 connection fee, 2
Sub-printed board, 7 pattern for strengthening connection strength, 3 discarding board, 8 slits, 4 perforations, 9 cut surface,
5 voids,

Claims (1)

[Scope of utility model registration request] 1. A multi-sided printed circuit board (1) in which a plurality of sub printed circuit boards (2) are arranged, wherein a void (5) and a connection margin are provided around the sub printed circuit board (2).
A perforation (4) consisting of (6) is formed, and the connection margin (6) is formed by extending inside the side of the sub-printed circuit board (2), and the connection margin (6) and its vicinity are formed. In the area including the area, except for the slit (8) located inside the side of the sub-printed board (2) on the connection margin (6), the connection margin strength reinforcing pattern (7) is formed. A multi-faced printed circuit board characterized by being formed.