JPH0545947B2 - - Google Patents
Info
- Publication number
- JPH0545947B2 JPH0545947B2 JP26893586A JP26893586A JPH0545947B2 JP H0545947 B2 JPH0545947 B2 JP H0545947B2 JP 26893586 A JP26893586 A JP 26893586A JP 26893586 A JP26893586 A JP 26893586A JP H0545947 B2 JPH0545947 B2 JP H0545947B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- data
- inspected
- dimensional
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 9
- 238000007689 inspection Methods 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 2
- 230000015654 memory Effects 0.000 description 23
- 238000013461 design Methods 0.000 description 10
- 230000007547 defect Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Analysis (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Image Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61268935A JPS63122218A (ja) | 1986-11-12 | 1986-11-12 | 微細パタ−ン検査方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61268935A JPS63122218A (ja) | 1986-11-12 | 1986-11-12 | 微細パタ−ン検査方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63122218A JPS63122218A (ja) | 1988-05-26 |
| JPH0545947B2 true JPH0545947B2 (enrdf_load_stackoverflow) | 1993-07-12 |
Family
ID=17465326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61268935A Granted JPS63122218A (ja) | 1986-11-12 | 1986-11-12 | 微細パタ−ン検査方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63122218A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010534408A (ja) * | 2007-07-20 | 2010-11-04 | ケーエルエー−テンカー・コーポレーション | 標準参照ダイ比較検査に用いるための標準参照ダイを生成する方法及びウエハーを検査するための方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5198546B2 (ja) * | 2010-12-03 | 2013-05-15 | 株式会社日立ハイテクノロジーズ | 回路パターン検査方法、及び回路パターン検査システム |
| JP6273094B2 (ja) * | 2013-03-21 | 2018-01-31 | 株式会社荏原製作所 | 検査用表示装置、欠陥判別方法、検査用表示プログラム |
| JP6513951B2 (ja) * | 2015-01-08 | 2019-05-15 | 株式会社ニューフレアテクノロジー | 検査方法 |
-
1986
- 1986-11-12 JP JP61268935A patent/JPS63122218A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010534408A (ja) * | 2007-07-20 | 2010-11-04 | ケーエルエー−テンカー・コーポレーション | 標準参照ダイ比較検査に用いるための標準参照ダイを生成する方法及びウエハーを検査するための方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63122218A (ja) | 1988-05-26 |
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