JPH0543482Y2 - - Google Patents

Info

Publication number
JPH0543482Y2
JPH0543482Y2 JP1988000883U JP88388U JPH0543482Y2 JP H0543482 Y2 JPH0543482 Y2 JP H0543482Y2 JP 1988000883 U JP1988000883 U JP 1988000883U JP 88388 U JP88388 U JP 88388U JP H0543482 Y2 JPH0543482 Y2 JP H0543482Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
cooling structure
cooling pipe
heat
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988000883U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01107148U (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988000883U priority Critical patent/JPH0543482Y2/ja
Publication of JPH01107148U publication Critical patent/JPH01107148U/ja
Application granted granted Critical
Publication of JPH0543482Y2 publication Critical patent/JPH0543482Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988000883U 1988-01-08 1988-01-08 Expired - Lifetime JPH0543482Y2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988000883U JPH0543482Y2 (de) 1988-01-08 1988-01-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988000883U JPH0543482Y2 (de) 1988-01-08 1988-01-08

Publications (2)

Publication Number Publication Date
JPH01107148U JPH01107148U (de) 1989-07-19
JPH0543482Y2 true JPH0543482Y2 (de) 1993-11-02

Family

ID=31200286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988000883U Expired - Lifetime JPH0543482Y2 (de) 1988-01-08 1988-01-08

Country Status (1)

Country Link
JP (1) JPH0543482Y2 (de)

Also Published As

Publication number Publication date
JPH01107148U (de) 1989-07-19

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