JPH0542382A - Laser beam processing method using higher harmonic wave of yag laser - Google Patents
Laser beam processing method using higher harmonic wave of yag laserInfo
- Publication number
- JPH0542382A JPH0542382A JP3199150A JP19915091A JPH0542382A JP H0542382 A JPH0542382 A JP H0542382A JP 3199150 A JP3199150 A JP 3199150A JP 19915091 A JP19915091 A JP 19915091A JP H0542382 A JPH0542382 A JP H0542382A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- wavelength
- harmonic wave
- work
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/35—Non-linear optics
- G02F1/353—Frequency conversion, i.e. wherein a light beam is generated with frequency components different from those of the incident light beams
- G02F1/3534—Three-wave interaction, e.g. sum-difference frequency generation
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/35—Non-linear optics
- G02F1/3501—Constructional details or arrangements of non-linear optical devices, e.g. shape of non-linear crystals
- G02F1/3507—Arrangements comprising two or more nonlinear optical devices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/35—Non-linear optics
- G02F1/353—Frequency conversion, i.e. wherein a light beam is generated with frequency components different from those of the incident light beams
- G02F1/354—Third or higher harmonic generation
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/35—Non-linear optics
- G02F1/37—Non-linear optics for second-harmonic generation
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＹＡＧレーザの高調波
を用いてワークに吸収され易い状態でワーク加工するＹ
ＡＧレーザの高調波を用いたレーザ加工方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a harmonic wave of a YAG laser to machine a workpiece in a state where it is easily absorbed by the workpiece.
The present invention relates to a laser processing method using harmonics of an AG laser.
【０００２】[0002]
【従来の技術】一般に、レーザビームがワークの表面に
照射されたとき、その一部は反射され、残りはワーク中
に吸収されて熱となる。鏡面研磨されたワークの場合
に、照射されたレーザビームの大部分が反射されて損失
となる。2. Description of the Related Art Generally, when a surface of a work is irradiated with a laser beam, a part of it is reflected and the rest is absorbed in the work to become heat. In the case of a mirror-polished work, most of the irradiated laser beam is reflected and becomes a loss.
【０００３】[0003]
【発明が解決しようとする課題】ところで、ＹＡＧレー
ザ発振器のレーザビームは波長が１．０６μm である
が、この波長１．０６μm によるワークの金属表面の反
射率が非常に高く、吸収率が低くなり（ただしＣＯ2 レ
ーザよりは吸収率がよい）、その加工性能が低下すると
いう問題があった。そのために、場合によつては表面吸
収剤をワーク面に塗布してレーザビームの反射を防止し
ていたが、必ずしも満足すべきものではなかった。すな
わち、レーザビームが金属表面で反射するから、ＣＯ2
レーザでは表面吸収剤の塗布が必要であるが、ＹＡＧレ
ーザでも吸収率は低いから必ずしもその効率がよくなか
った。By the way, the wavelength of the laser beam of the YAG laser oscillator is 1.06 μm, but the reflectance of the metal surface of the work due to this wavelength of 1.06 μm is very high and the absorptivity becomes low. (However, the absorptivity is better than that of CO 2 laser), and there is a problem that its processing performance is deteriorated. Therefore, in some cases, a surface absorber is applied to the work surface to prevent reflection of the laser beam, but this is not always satisfactory. That is, since the laser beam is reflected by the metal surface, CO 2
The laser requires the application of a surface absorber, but the efficiency is not always good even with the YAG laser because the absorptivity is low.
【０００４】そこで、本発明者達の長年の研究と実験の
繰り返しの結果、レーザビームを波長変換することによ
り、ワークに吸収され易くなり、その加工性能が大幅に
向上し得るとの結論に到達した。Therefore, as a result of repeated years of research and experiments by the present inventors, it is concluded that the wavelength conversion of the laser beam facilitates absorption by the workpiece and the machining performance thereof can be greatly improved. did.
【０００５】本発明の目的は、上記問題点を改善するた
めに、レーザビームの波長がワークに吸収され易い波長
に容易に変換され、例えば第２高調波の場合には可視光
とすることにより作業上の安全が確保され、その加工性
能が向上するＹＡＧレーザの高調波を用いたレーザ加工
方法を提供することにある。In order to improve the above problems, the object of the present invention is to easily convert the wavelength of the laser beam into a wavelength that is easily absorbed by the work, for example, in the case of the second harmonic, it is made visible light. It is an object of the present invention to provide a laser processing method using a harmonic wave of a YAG laser, which secures work safety and improves the processing performance.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、ＹＡＧレーザ発振器から発振されたレー
ザ光を、適数の高調波変換用結晶体に透過せしめて、加
工すべきワークに吸収され易い波長に変換して加工を行
うことを特徴とするＹＡＧレーザの高調波を用いたレー
ザ加工方法である。In order to achieve the above object, the present invention provides a work to be processed by transmitting a laser beam oscillated from a YAG laser oscillator to an appropriate number of crystal materials for harmonic conversion. It is a laser processing method using harmonics of a YAG laser, which is characterized in that processing is performed by converting the wavelength into a wavelength that is easily absorbed.
【０００７】また、本発明の他の態様によれば、ＹＡＧ
レーザ発振器からのレーザ光を可視光である第２高調波
に変換し、レーザ光を検視できる状態に保持してワーク
の加工を行うことを特徴とするＹＡＧレーザの高調波を
用いたレーザ加工方法である。According to another aspect of the present invention, YAG
A laser processing method using harmonics of a YAG laser, characterized in that laser light from a laser oscillator is converted into second harmonics that are visible light, and the workpiece is processed while maintaining the laser light in a visible state. Is.
【０００８】[0008]
【作用】本発明のＹＡＧレーザの高調波を用いたレーザ
加工方法を採用することにより、ＹＡＧレーザ発振器か
ら発振されたレーザ光を、適数の高調波発生体に透過せ
しめて波長変換して、例えば第２高調波の場合にはレー
ザ光を検視できる状態に保持してレーザ加工することに
よって、レーザビームの波長がワークに吸収され易い波
長に容易に変換され、可視光による作業上の安全が確保
され、その加工性能が向上する。By employing the laser processing method using the harmonics of the YAG laser of the present invention, the laser light oscillated from the YAG laser oscillator is transmitted through an appropriate number of harmonic generators for wavelength conversion, For example, in the case of the second harmonic, laser processing is performed while holding the laser beam in a state in which the laser beam can be visually inspected, so that the wavelength of the laser beam is easily converted to a wavelength that is easily absorbed by the work, and work safety by visible light is improved. It is ensured and its processing performance is improved.
【０００９】[0009]
【実施例】以下、本発明の実施例を素面に基づいて、詳
細に説明する。Embodiments of the present invention will be described in detail below with reference to the bare surface.
【００１０】図１は本発明の一実施例の構成を示すブロ
ック図である。ＹＡＧレーザの照射するレーザビームは
波長（λ）＝１．０６μm で、第２高調波変換用結晶体
（第２高調波発生体）ＳＨＧを透過することによって、
波長が半分に変換されλ＝５３２nm( ０．５３２μm ）
として出力される。この第２高調波は緑色の可視光であ
るから、レーザ加工が検視ができる状態に保持されて、
作業上の安全が確保される。FIG. 1 is a block diagram showing the configuration of an embodiment of the present invention. The laser beam emitted by the YAG laser has a wavelength (λ) = 1.06 μm and is transmitted through the second harmonic conversion crystal (second harmonic generator) SHG.
Wavelength is converted to half, λ = 532nm (0.532μm)
Is output as. Since this second harmonic is green visible light, it is held in a state where laser processing can be visually inspected.
Work safety is ensured.
【００１１】また、ＹＡＧレーザの照射するレーザビー
ム（波長（λ）＝１．０６μm ）と、第２高調波変換用
結晶体（第２高調波発生体）ＳＨＧを透過した波長
（λ）＝５３２nmとが合成されて、第３高調波変換用結
晶体（第３高調波発生体）ＴＨＧを透過することによっ
て、波長が変換されλ＝３５５nm( ０．３５５μm ）と
して出力する。この第３高調波は可視光ではない。しか
し、図２に示す各種金属の反射率によれば、第２高調波
と比較してその金属材料の吸収率はさらに向上している
ことが明らかである。The wavelength (λ) transmitted through the laser beam (wavelength (λ) = 1.06 μm) emitted by the YAG laser and the second harmonic conversion crystal (second harmonic generator) SHG = 532 nm. And are combined and transmitted through the third harmonic conversion crystal body (third harmonic generator) THG, and the wavelength is converted and output as λ = 355 nm (0.355 μm). This third harmonic is not visible light. However, according to the reflectivities of various metals shown in FIG. 2, it is apparent that the absorptivity of the metal material is further improved as compared with the second harmonic.
【００１２】なお、第２高調波発生体ＳＨＧを透過した
波長（λ）＝５３２nmが第４高調波変換用結晶体（第４
高調波発生体）４ＨＧを透過することによって、波長が
半分に変換されλ＝２６６nm( ０．２６６μm ）として
出力される。この第４高調波は可視光ではないが、その
金属材料の吸収率はさらに向上していることが明らかで
ある。The wavelength (λ) = 532 nm transmitted through the second harmonic generator SHG is equal to the fourth harmonic conversion crystal (fourth harmonic).
After passing through the harmonic generator 4HG, the wavelength is converted to half and output as λ = 266 nm (0.266 μm). Although the fourth harmonic is not visible light, it is clear that the absorptivity of the metallic material is further improved.
【００１３】さらに、第２高調波発生体ＳＨＧを透過し
た波長（λ）＝５３２nmと、第３高調波発生体ＴＨＧを
透過する波長（λ）＝３５５nm( ０．３５５μm ）とが
合成されて、第５高調波変換用結晶体（第５高調波発生
体）５ＨＧを透過することによって、波長が変換されλ
＝２１２nm( ０．２１２μm ）として出力される。この
第５高調波は同じく可視光ではないが、その金属材料の
吸収率がさらに向上している。Further, the wavelength (λ) = 532 nm transmitted through the second harmonic generator SHG and the wavelength (λ) = 355 nm (0.355 μm) transmitted through the third harmonic generator THG are synthesized, By passing through the fifth harmonic conversion crystal (fifth harmonic generator) 5HG, the wavelength is converted to λ
= 212 nm (0.212 μm). Although the fifth harmonic is not visible light as well, the absorptivity of the metal material is further improved.
【００１４】従って、各波長（λ）＝０．５３２μm,
０．３５５μm ，０．２６６μm ，０．２１２μm は切
換えにより、任意の波長を選択することが容易である。
一般に、第２高調波発生体ＳＨＧないし第５高調波発生
体５ＨＧは、非線形光学素子とも称され、化学式ＫＨ2
ＰＯ4 ，ＫＤ2 ＰＯ4 ，ＫＴi ＯＰＯ4 ，β−ＢａＢＯ
4 からなる結晶体である。さらに、新しい開発された光
学素子が、この目的のために開発されたものである場合
もすべて含む。Therefore, each wavelength (λ) = 0.532 μm,
It is easy to select any wavelength of 0.355 μm, 0.266 μm and 0.212 μm by switching.
Generally, the second harmonic generator SHG to the fifth harmonic generator 5HG are also called non-linear optical elements and have the chemical formula KH 2
PO 4 , KD 2 PO 4 , KTi OPO 4 , β-BaBO
It is a crystal composed of 4 . Further, it includes all cases where the newly developed optical element is developed for this purpose.
【００１５】次に、図２は各種金属に照射される光の波
長に対する反射率線図を示す。光が金属表面に照射され
ると一部は反射され、残りは金属内に吸収されて熱とな
り、その金属が高温になり、表面が酸化したり、溶融状
態になると、金属の反射率は低下するものである。Next, FIG. 2 shows a reflectance diagram with respect to the wavelength of light with which various metals are irradiated. When light is applied to the surface of a metal, part of it is reflected, and the rest is absorbed by the metal and becomes heat. When the metal becomes hot and the surface oxidizes or melts, the reflectance of the metal decreases. To do.
【００１６】図においてＹＡＧレーザビームの波長
（λ）＝１．０６μm を、金（Ａｕ）、銅（Ｃｕ）の表
面に照射したとき、その反射率はそれぞれ９９％，９０
％程度で高く、反対にレーザビームの吸収率が極めて低
い。これに対して、第２高調波発生体ＳＨＧを透過した
波長（λ）＝５３２nmを、金（Ａｕ）、銅（Ｃｕ）の表
面に照射したとき、その反射率はそれぞれ５８％，５１
％程度となり、レーザビームの吸収率が向上する。この
ときの波長は、金属に吸収され易い波長であるととも
に、上述の緑色の可視光ある。In the figure, when the wavelength (λ) = 1.06 μm of the YAG laser beam is applied to the surfaces of gold (Au) and copper (Cu), the reflectances thereof are 99% and 90, respectively.
%, The absorption rate of the laser beam is extremely low. On the other hand, when the wavelength (λ) = 532 nm transmitted through the second harmonic generator SHG is applied to the surfaces of gold (Au) and copper (Cu), the reflectances are 58% and 51, respectively.
%, The absorption rate of the laser beam is improved. The wavelength at this time is a wavelength that is easily absorbed by the metal and is the above-mentioned green visible light.
【００１７】さらに、第３高調波発生体ＴＨＧを透過す
る波長（λ）＝０．３５５μm を、金（Ａｕ）、銅（Ｃ
ｕ）の表面に照射したとき、その反射率はそれぞれ３５
％，２６％程度となり、レーザビームの吸収率がさらに
向上し、金属に吸収され易い波長である。Further, the wavelength (λ) = 0.355 μm transmitted through the third harmonic generator THG is set to gold (Au), copper (C).
When the surface of (u) is irradiated, its reflectance is 35 each.
%, About 26%, the absorption rate of the laser beam is further improved, and the wavelength is easily absorbed by the metal.
【００１８】従って、ＹＡＧレーザ発振器から発振され
るレーザビームを、適数の高調波発生体ＳＨＧ，ＴＨ
Ｇ，４ＨＧ，５ＨＧに透過させて、加工されるワークに
吸収され易い波長に変換されることにより、ワークのレ
ーザ吸収率が大幅に向上し、従来塗布された表面吸収剤
等が不要となり、高反射金属であるアルミニウム（Ａ
ｌ），金（Ａｕ）等のレーザ加工に極めて有効である。Therefore, the laser beam oscillated from the YAG laser oscillator is supplied with an appropriate number of harmonic wave generators SHG, TH.
By transmitting to G, 4HG, 5HG and converting to a wavelength that is easily absorbed by the workpiece to be processed, the laser absorptivity of the workpiece is greatly improved, and the conventionally applied surface absorber and the like are no longer required. Aluminum (A
l), gold (Au), etc. are extremely effective for laser processing.
【００１９】なお、本発明は、上記実施例に限定される
ものではなく、適宜の設計的変更を行うことにより、他
の態様においても実施し得るものである。The present invention is not limited to the above embodiment, but can be implemented in other modes by making appropriate design changes.
【００２０】[0020]
【発明の効果】上記説明ですでに明らかなように、本発
明のＹＡＧレーザの高調波を用いたレーザ加工方法は、
ＹＡＧレーザ発振器から発振されたレーザ光が、適数の
高調波発生体に透過せしめて波長変換され、しかもレー
ザ光が検視できる状態に保持されレーザ加工されること
によって、従来技術の問題点が有効に解決され、例えば
第２高調波の場合にはレーザビームの波長がワークに吸
収され易い波長に容易に変換され、可視光による作業上
の安全が確保され、その加工性能が向上する。As apparent from the above description, the laser processing method using the harmonics of the YAG laser of the present invention is
The laser light oscillated from the YAG laser oscillator is transmitted through an appropriate number of harmonic generators for wavelength conversion, and the laser light is held in a state in which it can be inspected and laser-processed. In the case of the second harmonic, for example, the wavelength of the laser beam is easily converted into a wavelength that is easily absorbed by the work, the work safety by visible light is secured, and the processing performance is improved.
【図１】本発明の一実施例の構成を示すブロック図であ
る。FIG. 1 is a block diagram showing a configuration of an exemplary embodiment of the present invention.
【図２】各種金属に照射される光の波長に対する反射率
線図である。FIG. 2 is a reflectance diagram with respect to wavelengths of light with which various metals are irradiated.
ＹＡＧ ＹＡＧレーザ発振器 ＳＨＧ 第２高調波発生体 ＴＨＧ 第３高調波発生体 ４ＨＧ 第４高調波発生体 ５ＨＧ 第４高調波発生体 YAG YAG laser oscillator SHG 2nd harmonic generator THG 3rd harmonic generator 4HG 4th harmonic generator 5HG 4th harmonic generator
Claims (2)
ザ光線を、適数の高調波変換用結晶体に透過せしめて、
加工すべきワークに吸収され易い波長に変換して加工を
行うことを特徴とするＹＡＧレーザの高調波を用いたレ
ーザ加工方法。1. A laser beam oscillated from a YAG laser oscillator is transmitted through an appropriate number of harmonic conversion crystal bodies,
A laser processing method using a harmonic wave of a YAG laser, which is characterized in that a wavelength is converted into a wavelength that is easily absorbed by a workpiece to be processed.
視光である第２高調波に変換し、レーザ光を検視できる
状態に保持してワークの加工を行うことを特徴とする請
求項１に記載のＹＡＧレーザの高調波を用いたレーザ加
工方法。2. The work according to claim 1, wherein the laser light from the YAG laser oscillator is converted into a second harmonic wave which is visible light, and the work is processed while maintaining the laser light in a visible state. Laser processing method using the harmonics of the YAG laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3199150A JPH0542382A (en) | 1991-08-08 | 1991-08-08 | Laser beam processing method using higher harmonic wave of yag laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3199150A JPH0542382A (en) | 1991-08-08 | 1991-08-08 | Laser beam processing method using higher harmonic wave of yag laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0542382A true JPH0542382A (en) | 1993-02-23 |
Family
ID=16402986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3199150A Pending JPH0542382A (en) | 1991-08-08 | 1991-08-08 | Laser beam processing method using higher harmonic wave of yag laser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0542382A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5392124A (en) * | 1993-12-17 | 1995-02-21 | International Business Machines Corporation | Method and apparatus for real-time, in-situ endpoint detection and closed loop etch process control |
| US5977512A (en) * | 1995-12-01 | 1999-11-02 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung Ev | Multi-wavelength laser soldering device with substrate cleaning beam |
| US6172331B1 (en) * | 1997-09-17 | 2001-01-09 | General Electric Company | Method and apparatus for laser drilling |
| US6222156B1 (en) * | 1997-06-12 | 2001-04-24 | International Business Machines Corporation | Laser repair process for printed wiring boards |
| JP2006066794A (en) * | 2004-08-30 | 2006-03-09 | Miyachi Technos Corp | Wire bonding method |
| WO2006035870A1 (en) * | 2004-09-29 | 2006-04-06 | Mitsubishi Materials Corporation | Laser processing method and laser processing apparatus |
| JP2012509500A (en) * | 2008-11-21 | 2012-04-19 | エオリト システム | Device for extending the lifetime of a nonlinear optical system exposed to radiation of an intense laser beam and a nonlinear light source comprising said device |
| JP2012161816A (en) * | 2011-02-08 | 2012-08-30 | Mitsui Chemicals Inc | Laser marking processing method using polypropylene type surface protection film |
| CN107293483A (en) * | 2017-06-09 | 2017-10-24 | 苏晋苗 | A kind of laser chip planarization processing unit (plant) and method |
| CN111106521A (en) * | 2019-12-24 | 2020-05-05 | 北京科益虹源光电技术有限公司 | Sum frequency device and laser |
| CN111129935A (en) * | 2019-12-24 | 2020-05-08 | 北京科益虹源光电技术有限公司 | Sum frequency method |
| WO2022110284A1 (en) * | 2020-11-27 | 2022-06-02 | 北京科益虹源光电技术有限公司 | Method for regulating output power of 213 nm laser, and apparatus thereof |
-
1991
- 1991-08-08 JP JP3199150A patent/JPH0542382A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5392124A (en) * | 1993-12-17 | 1995-02-21 | International Business Machines Corporation | Method and apparatus for real-time, in-situ endpoint detection and closed loop etch process control |
| US5977512A (en) * | 1995-12-01 | 1999-11-02 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung Ev | Multi-wavelength laser soldering device with substrate cleaning beam |
| US6222156B1 (en) * | 1997-06-12 | 2001-04-24 | International Business Machines Corporation | Laser repair process for printed wiring boards |
| US6172331B1 (en) * | 1997-09-17 | 2001-01-09 | General Electric Company | Method and apparatus for laser drilling |
| JP2006066794A (en) * | 2004-08-30 | 2006-03-09 | Miyachi Technos Corp | Wire bonding method |
| WO2006035870A1 (en) * | 2004-09-29 | 2006-04-06 | Mitsubishi Materials Corporation | Laser processing method and laser processing apparatus |
| JP2012509500A (en) * | 2008-11-21 | 2012-04-19 | エオリト システム | Device for extending the lifetime of a nonlinear optical system exposed to radiation of an intense laser beam and a nonlinear light source comprising said device |
| US8885246B2 (en) | 2008-11-21 | 2014-11-11 | Eolite Systems | Device for extending the service life of a non-linear optical system subjected to the radiation of an intense laser beam and non-linear optical source including said device |
| JP2012161816A (en) * | 2011-02-08 | 2012-08-30 | Mitsui Chemicals Inc | Laser marking processing method using polypropylene type surface protection film |
| CN107293483A (en) * | 2017-06-09 | 2017-10-24 | 苏晋苗 | A kind of laser chip planarization processing unit (plant) and method |
| CN111106521A (en) * | 2019-12-24 | 2020-05-05 | 北京科益虹源光电技术有限公司 | Sum frequency device and laser |
| CN111129935A (en) * | 2019-12-24 | 2020-05-08 | 北京科益虹源光电技术有限公司 | Sum frequency method |
| WO2022110284A1 (en) * | 2020-11-27 | 2022-06-02 | 北京科益虹源光电技术有限公司 | Method for regulating output power of 213 nm laser, and apparatus thereof |
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