JP2001170788A - Method of laser machining and device therfor - Google Patents
Method of laser machining and device therforInfo
- Publication number
- JP2001170788A JP2001170788A JP35238499A JP35238499A JP2001170788A JP 2001170788 A JP2001170788 A JP 2001170788A JP 35238499 A JP35238499 A JP 35238499A JP 35238499 A JP35238499 A JP 35238499A JP 2001170788 A JP2001170788 A JP 2001170788A
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- Japan
- Prior art keywords
- laser beam
- laser
- optical system
- processing
- wavelength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、レーザービームを
ワークに照射して切断や穴あけなどの除去加工を行うた
めのレーザー加工方法およびこのレーザー加工方法を実
現し得るレーザー加工装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing method for irradiating a workpiece with a laser beam to perform a cutting process such as cutting or drilling, and a laser processing apparatus capable of realizing the laser processing method.
【０００２】[0002]
【従来の技術】レーザー加工は、あらゆる固体に対する
除去加工をほとんど瞬時に行うことが可能であり、特に
難削材や複合材料の切断あるいは微小な穴あけ加工など
に有効である。このようなレーザー加工に用いられるレ
ーザー光源としては、波長が１０.６μmのＣＯ2レーザ
ー発振器や波長が１.０６μmのＹＡＧレーザー発振器な
どが知られており、これらは連続出力のものおよびパル
ス出力のもの両方がある。2. Description of the Related Art Laser processing can remove almost all solids almost instantaneously, and is particularly effective for cutting difficult-to-cut materials or composite materials or for making minute holes. As a laser light source used for such laser processing, a CO 2 laser oscillator having a wavelength of 10.6 μm or a YAG laser oscillator having a wavelength of 1.06 μm is known. There are both things.
【０００３】このようなレーザー加工において、加工効
率の向上や加工面の品質向上などを企図して波長が異な
る２種類のレーザービームを用いて加工を行うことが試
みられており、例えば特開昭６２−２８９３９０号公報
に開示されているように、金属加工においてはワークで
ある金属に対して反射率の低い低出力の短波長レーザー
ビームでワークの表面をまず溶融させ、次に大出力の長
波長レーザービームで所定形状にワークを加工したり、
あるいは大出力の長波長レーザービームでワークを加工
した後、短波長レーザービームを照射して仕上げ加工を
行っている。In such laser processing, attempts have been made to use two types of laser beams having different wavelengths in order to improve the processing efficiency and the quality of the processed surface. As disclosed in Japanese Patent Application Laid-Open No. 62-289390, in metal working, the surface of a work is first melted by a low-output short-wavelength laser beam having a low reflectance with respect to the metal which is a work, and then a long output of a high power is produced. Work a workpiece into a predetermined shape with a wavelength laser beam,
Alternatively, a workpiece is processed with a high-power long-wavelength laser beam, and then a finishing process is performed by irradiating a short-wavelength laser beam.
【０００４】[0004]
【発明が解決しようとする課題】特開昭６２−２８９３
９０号公報に開示された従来のレーザー加工方法では、
加工効率の向上や加工面の品質向上などを企図して波長
の異なる２種類のレーザービームを使用する場合、これ
に対応して２種類、例えば長波長レーザービームを発振
するＣＯ2レーザー発振器やＹＡＧレーザー発振器と、
短波長レーザービームを発振する紫外線レーザー発振器
とを用いる必要があり、そのための設備投資に要する費
用が嵩む上、そのための設置スペースも確保する必要が
あり、設備のコンパクト化が困難である。SUMMARY OF THE INVENTION Japanese Patent Laid-Open No. 62-2893
In the conventional laser processing method disclosed in Japanese Patent Publication No. 90,
When two types of laser beams having different wavelengths are used for the purpose of improving the processing efficiency and the quality of the processed surface, a CO 2 laser oscillator oscillating two types, for example, a long wavelength laser beam, or a YAG laser is used. A laser oscillator,
It is necessary to use an ultraviolet laser oscillator that oscillates a short-wavelength laser beam, which increases the cost required for equipment investment, and also requires that an installation space be secured, making it difficult to make the equipment compact.
【０００５】[0005]
【発明の目的】本発明の目的は、単一のレーザー光源か
ら波長の異なる２種類のレーザービームを用いてレーザ
ー加工を行い得る方法およびこの方法を実現し得るレー
ザー加工装置を提供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a method capable of performing laser processing using two types of laser beams having different wavelengths from a single laser light source and a laser processing apparatus capable of realizing this method. .
【０００６】[0006]
【課題を解決するための手段】本発明の第１の形態は、
単一のレーザービームを２つに分けるステップと、一方
のレーザービームをそのままワークの加工領域に集光す
るステップと、他方のレーザービームを波長変換して前
記ワークの加工領域に集光するステップとを具えたこと
を特徴とするレーザー加工方法にある。According to a first aspect of the present invention, there is provided:
A step of dividing a single laser beam into two, a step of condensing one laser beam as it is on a processing area of the work, and a step of converting the wavelength of the other laser beam to focus on the processing area of the work. A laser processing method characterized by comprising:
【０００７】本発明によると、２つに分けられたうちの
一方のレーザービームをそのままワークの加工領域に集
光して所定の加工を行い、さらに他方のレーザービーム
を波長変換してワークの加工領域に集光し、所定の加工
を行う。According to the present invention, one of the two laser beams is focused on the work area of the work as it is to perform a predetermined work, and the other laser beam is wavelength-converted to work the work. The light is condensed on the area, and predetermined processing is performed.
【０００８】本発明の第２の形態は、単一のレーザービ
ームを発振するレーザー光源と、このレーザー光源から
発振したレーザービームを２つのレーザービームに分け
るビームスプリッタと、一方のレーザービームをそのま
まワークの加工面に向けて集光させる第１の集光光学系
と、他方のレーザービームを波長変換する非線形光学系
と、この非線形光学系によって波長変換されたレーザー
ビームを前記ワークの加工面に向けて集光させる第２の
集光光学系とを具えたことを特徴とするレーザー加工装
置にある。According to a second aspect of the present invention, there is provided a laser light source that oscillates a single laser beam, a beam splitter that divides the laser beam oscillated from the laser light source into two laser beams, and works by using one of the laser beams as it is. A first condensing optical system for condensing the laser beam toward the processing surface, a non-linear optical system for converting the wavelength of the other laser beam, and a laser beam whose wavelength has been converted by the non-linear optical system toward the processing surface of the workpiece. And a second condensing optical system for condensing the laser beam.
【０００９】本発明によると、レーザー光源から発振さ
れた単一のレーザービームは、ビームスプリッタによっ
て２つのに分けられ、一方のレーザービームを第１の集
光光学系によってワークの加工面に集光して所定の加工
を行う一方、他方のレーザービームを非線形光学系を通
して波長変換し、これを第２の集光光学系によってワー
クの加工面に集光し、所定の加工を行う。According to the present invention, a single laser beam oscillated from a laser light source is divided into two by a beam splitter, and one of the laser beams is focused on a processing surface of a work by a first focusing optical system. While performing the predetermined processing, the other laser beam is wavelength-converted through the non-linear optical system, and this is condensed on the processing surface of the work by the second condensing optical system to perform the predetermined processing.
【００１０】[0010]
【発明の実施の形態】本発明の第１の形態によるレーザ
ー加工方法において、他方のレーザービームは、一方の
レーザービームの高次高調波であってもよく、この場
合、一方のレーザービームによってワークを加工した
後、他方のレーザービームによってワークを加工するこ
とが好ましい。DESCRIPTION OF THE PREFERRED EMBODIMENTS In the laser processing method according to the first aspect of the present invention, the other laser beam may be a higher harmonic of one laser beam. After processing, the workpiece is preferably processed by the other laser beam.
【００１１】また、単一のレーザービームは、赤外領域
のレーザービームであってもよく、この場合、波長変換
された他方のレーザービームは、可視領域または紫外領
域のレーザービームであってよい。Further, the single laser beam may be a laser beam in the infrared region, and in this case, the other laser beam whose wavelength has been converted may be a laser beam in the visible region or the ultraviolet region.
【００１２】本発明の第２の形態によるレーザー加工装
置において、レーザー光源が赤外領域のレーザービーム
を発振するものであってもよく、この場合、非線形光学
系は、赤外領域のレーザービームを可視領域または紫外
領域のレーザービームに変換するものであることが好ま
しい。In the laser processing apparatus according to the second aspect of the present invention, the laser light source may oscillate a laser beam in the infrared region, and in this case, the nonlinear optical system converts the laser beam in the infrared region. It is preferable that the laser beam is converted into a laser beam in a visible region or an ultraviolet region.
【００１３】[0013]
【実施例】本発明によるレーザー加工方法を実現し得る
本発明によるレーザー加工装置の一実施例について、図
１〜図３を参照しながら詳細に説明するが、本発明はこ
のような実施例に限らず、この明細書の特許請求の範囲
に記載された本発明の概念に包含されるべき他の技術に
も応用することができる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a laser processing apparatus according to the present invention capable of realizing the laser processing method according to the present invention will be described in detail with reference to FIGS. However, the present invention can be applied to other technologies that should be included in the concept of the present invention described in the claims of this specification.
【００１４】本実施例におけるレーザー加工装置の概念
を表す図１に示すように、本実施例におけるレーザー光
源１１は、ここから発振されるレーザービームＬが１.
０６４μｍの赤外領域の波長を持つ４０ワットの出力の
ＹＡＧレーザー発振器であり、図示しないコリメート光
学系により所定の径の平行光束に変換されている。この
レーザービームＬの光路の途中には、中央部が全反射面
となったビームスプリッタ１２が光路に対して４５度傾
斜して設けられ、このビームスプリッタ１２はレーザー
光源１１から出射したレーザービームＬの中央部分のみ
全反射し、残りはそのまま透過するようになっている。As shown in FIG. 1 showing the concept of the laser processing apparatus in this embodiment, a laser light source 11 in this embodiment has a laser beam L oscillating from the laser source.
This is a YAG laser oscillator having a wavelength in the infrared region of 064 μm and outputting 40 watts, and is converted into a parallel light beam having a predetermined diameter by a collimating optical system (not shown). In the middle of the optical path of the laser beam L, a beam splitter 12 whose central portion is a total reflection surface is provided at an angle of 45 degrees with respect to the optical path, and the beam splitter 12 emits the laser beam L emitted from the laser light source 11. Is totally reflected only at the central portion, and the rest is transmitted as it is.
【００１５】ビームスプリッタ１２の後方には、このビ
ームスプリッタ１２を透過したリング状断面のレーザー
ビームＬ1を全反射する全反射鏡１３がその光路に対し
て４５度傾斜して設けられており、さらに全反射鏡１３
の先には、リング状断面のレーザービームＬ1の光路を
開閉するためのシャッタ１４と、このシャッタを通過し
たリング状断面のレーザービームＬ1をワークであるプ
リント回路板Ｗに集光してそこにスルーホールＨ（図２
参照）を形成させるためのリング状の集光レンズ１５と
が配置されている。[0015] the rear of the beam splitter 12 is total reflection mirror 13 is provided to be inclined 45 degrees with respect to the optical path for totally reflecting the laser beam L 1 of a ring-shaped cross-section passing through the beam splitter 12, Furthermore, total reflection mirror 13
The Former, a shutter 14 for opening and closing the optical path of the laser beam L 1 of a ring-shaped cross section, by condensing a laser beam L 1 of a ring-shaped cross-section passing through the shutter on the printed circuit board W is a work There through hole H (Fig. 2
(See FIG. 2) is disposed.
【００１６】本実施例におけるプリント回路板Ｗは、６
０μmの膜厚の絶縁層ＷBの両面に１８μmの膜厚の銅箔
ＷCをコーティングしたフレキシブルプリント回路板で
あり、集光レンズ１５の光軸に対して垂直な面内を移動
可能な図示しないＸ−Ｙステージに保持され、所定個所
にスルーホールＨが形成される。The printed circuit board W in this embodiment has a size of 6
A flexible printed circuit board coated with copper foil W C of the film thickness of 18μm on both surfaces of 0μm thickness of the insulating layer W B, shown movable in a plane perpendicular to the optical axis of the condensing lens 15 The XY stage is held, and a through hole H is formed at a predetermined position.
【００１７】前記ビームスプリッタ１２によって全反射
した円形断面のレーザービームＬ2の光路の途中には、
この光路に対して４５度傾斜した全反射鏡１６が配置さ
れ、さらにこの全反射鏡１６の先には、当該全反射鏡１
６と平行な反射面を有する全反射鏡１７が集光レンズ１
５の光軸上に配置されている。この全反射鏡１７は、前
記シャッタ１４と集光レンズ１５との間のリング状断面
のレーザービームＬ1の光路に対して４５度傾斜した状
態となっており、リング状断面のレーザービームＬ1を
遮らないような寸法に設定されている。前記ビームスプ
リッタ１２と全反射鏡１６との間の円形断面のレーザー
ビームＬ2の光路の途中には、これを例えば３次高調波
である紫外領域の３５５μｍの波長に変換する非線形光
学系１８が介装されている。本実施例における非線形光
学系１８は、ＫＤＰ（リン酸二水素カリウム）を用いて
おり、レーザー光に対する高調波発生素子として周知の
ものであり、他の周知のものを採用することも当然可能
である。また、２つの全反射鏡１６,１７の間の円形断
面のレーザービームＬ2の光路の途中には、円形断面の
レーザービームＬ2の光路を開閉するためのシャッタ１
９が介装され、さらに全反射鏡１７の先にはこの全反射
鏡１７で全反射した円形断面のレーザービームＬ2をプ
リント回路板Ｗに集光し、リング状断面のレーザービー
ムＬ1によって形成されたスルーホールＨの仕上げ加工
を図３に示すように行うための集光レンズ２０が配置さ
れている。In the middle of the optical path of the laser beam L 2 having a circular cross section totally reflected by the beam splitter 12,
A total reflection mirror 16 inclined by 45 degrees with respect to this optical path is disposed, and further ahead of the total reflection mirror 16, the total reflection mirror 1 is disposed.
The total reflection mirror 17 having a reflection surface parallel to 6
5 are arranged on the optical axis. The total reflection mirror 17, the shutter 14 and the condenser lens 15 has a state inclined by 45 degrees with respect to the light path of the laser beam L 1 of a ring-shaped cross-section between the laser beam L 1 of a ring-shaped cross-section It is set to a size that does not block the light. In the middle of the optical path of the laser beam L 2 having a circular cross section between the beam splitter 12 and the total reflection mirror 16, there is provided a nonlinear optical system 18 for converting the laser beam L 2 into a wavelength of 355 μm in an ultraviolet region which is a third harmonic, for example. It is interposed. The nonlinear optical system 18 in the present embodiment uses KDP (potassium dihydrogen phosphate), is a well-known element for generating a harmonic with respect to a laser beam, and it is naturally possible to use another well-known element. is there. Further, in the middle of the circular cross-section the optical path of the laser beam L 2 of between two total reflecting mirrors 16 and 17, the shutter 1 for opening and closing the optical path of the laser beam L 2 having a circular section
9 is interposed, more ahead of the total reflection mirror 17 condenses the laser beam L 2 having a circular section which is totally reflected by the total reflection mirror 17 to the printed circuit board W, the laser beam L 1 of a ring-shaped cross-section A condensing lens 20 for performing finishing processing of the formed through hole H as shown in FIG. 3 is arranged.
【００１８】実際の作業に際しては、プリント回路板Ｗ
を位置決めし、シャッタ１４を開くと共にシャッタ１９
を閉じ、リング状断面のレーザービームＬ1をプリント
回路板Ｗの所定位置に例えば３０ショットパルス照射し
て図２に示すようなスルーホールＨを穿設する。次いで
シャッタ１４,１９の開閉状態を切り換え、円形断面の
レーザービームＬ2を用いて先の加工位置と同じ位置に
例えば３１ショットパルス照射し、図３に示すようにス
ルーホールＨの内壁の凹凸や炭化物を除去して仕上げ加
工を行い、内径が１００μmのスルーホールＨを形成し
た。In actual operation, the printed circuit board W
And the shutter 14 is opened and the shutter 19 is opened.
Closed, bored a through hole H as shown in FIG. 2 in a predetermined position, for example, 30-shot pulse irradiation of the laser beam L 1 to the printed circuit board W of the ring-shaped cross-section. Then switch the open and closed states of the shutter 14 and 19, the previous working position the same located in example 31 shot pulse irradiation and using a laser beam L 2 having a circular section, Ya irregularities of the inner wall of the through hole H as shown in FIG. 3 Finish processing was performed by removing carbides, and a through hole H having an inner diameter of 100 μm was formed.
【００１９】このように、実施例では円形断面のレーザ
ービームＬ2でスルーホールＨの内壁の仕上げ加工を行
うようにしたが、リング状断面のレーザービームＬ1の
光路の途中に非線形光学系１８を配置し、円形断面のレ
ーザービームＬ2によってプリント回路板Ｗの所定位置
にスルーホールＨを形成し、これに続いてリング状断面
のレーザービームＬ1によりスルーホールＨの仕上げ加
工を行うようにしてもよい。また、ワークやワークに対
する加工の形態によっては２つのレーザービームＬ1,Ｌ
2を同時にワークに照射することも可能である。[0019] Thus, in the example it was to perform finish machining of the inner wall of the through hole H at the laser beam L 2 having a circular cross section, a non-linear optical system in the optical path of the laser beam L 1 of a ring-shaped cross-section 18 And a through hole H is formed at a predetermined position on the printed circuit board W by the laser beam L 2 having a circular cross section, and then the through hole H is finished by the laser beam L 1 having a ring cross section. You may. Further, depending on the type of work and the form of processing on the work, the two laser beams L 1 and L
It is also possible to irradiate 2 at the same time on the work.
【００２０】[0020]
【発明の効果】本発明によると、単一のレーザービーム
を２つに分け、一方のレーザービームをそのままワーク
の加工領域に集光して第１の加工を行い、他方のレーザ
ービームを波長変換してワークの加工領域に集光して第
２の加工を行うようにしたので、高価なレーザー発振器
を２種類用意する必要がなくなり、設備コストや設置ス
ペースを削減することが可能となり、装置のコンパクト
化を企図することができる。According to the present invention, a single laser beam is divided into two, one laser beam is condensed as it is on a processing area of a work to perform first processing, and the other laser beam is converted into a wavelength. In this case, the second processing is performed by condensing the laser beam on the processing area of the work, so that it is not necessary to prepare two types of expensive laser oscillators, and it is possible to reduce the equipment cost and the installation space, and Compactness can be contemplated.
【図１】本発明によるレーザー加工装置の一実施例の概
略構造を表す概念図である。FIG. 1 is a conceptual diagram showing a schematic structure of an embodiment of a laser processing apparatus according to the present invention.
【図２】両面銅張り板のプリント基板をＹＡＧレーザの
基本波でプリント基板に穴明け加工した時の加工図であ
る。FIG. 2 is a processing diagram when a double-sided copper-clad printed circuit board is punched in a printed circuit board with a fundamental wave of a YAG laser.
【図３】ＹＡＧレーザの基本波でプリント基板に穴明け
加工後、ＹＡＧレーザの第３高調波で加工した時の加工
図である。FIG. 3 is a processing diagram when processing is performed with a third harmonic of a YAG laser after drilling a printed circuit board with a fundamental wave of a YAG laser.
１１ レーザー光源 １２ ビームスプリッタ １３ 全反射鏡 １４ シャッタ １５ 集光レンズ １６,１７ 全反射鏡 １８ 非線形光学系 １９ シャッタ ２０ 集光レンズ Ｌ レーザービーム Ｌ1 リング状断面のレーザービーム Ｌ2 円形断面のレーザービーム Ｈ スルーホール Ｗ プリント回路板 ＷB 絶縁層 ＷC 銅箔DESCRIPTION OF SYMBOLS 11 Laser light source 12 Beam splitter 13 Total reflection mirror 14 Shutter 15 Condensing lens 16, 17 Total reflection mirror 18 Nonlinear optical system 19 Shutter 20 Condensing lens L Laser beam L 1 Ring-shaped laser beam L 2 Circular laser beam H Through hole W Printed circuit board W B Insulation layer W C Copper foil
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） // Ｂ２３Ｋ 101:42 Ｂ２３Ｋ 101:42 Ｆターム(参考） 2K002 AA04 AB12 CA04 HA20 4E068 CA04 CD03 CD05 CD10 5F072 AB01 KK12 MM07 MM08 MM09 QQ02 RR01 RR05 YY06 Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (reference) // B23K 101: 42 B23K 101: 42 F term (reference) 2K002 AA04 AB12 CA04 HA20 4E068 CA04 CD03 CD05 CD10 5F072 AB01 KK12 MM07 MM08 MM09 QQ02 RR01 RR05 YY06
Claims (8)
テップと、 一方のレーザービームをそのままワークの加工領域に集
光するステップと、 他方のレーザービームを波長変換して前記ワークの加工
領域に集光するステップとを具えたことを特徴とするレ
ーザー加工方法。1. A step of dividing a single laser beam into two, a step of condensing one laser beam as it is on a processing area of a work, and a step of converting the wavelength of the other laser beam into a processing area of the work. Condensing light.
ービームの高次高調波であることを特徴とする請求項１
に記載のレーザー加工方法。2. The laser beam according to claim 1, wherein the other laser beam is a higher order harmonic of the one laser beam.
The laser processing method according to the above.
加工した後、他方のレーザービームによってワークを加
工することを特徴とする請求項２に記載のレーザー加工
方法。3. The laser processing method according to claim 2, wherein after processing the workpiece by one laser beam, the workpiece is processed by the other laser beam.
のレーザービームであることを特徴とする請求項２また
は請求項３に記載のレーザー加工方法。4. The laser processing method according to claim 2, wherein the single laser beam is a laser beam in an infrared region.
ムは、可視領域または紫外領域のレーザービームである
ことを特徴とする請求項４に記載のレーザー加工方法。5. The laser processing method according to claim 4, wherein the wavelength-converted other laser beam is a laser beam in a visible region or an ultraviolet region.
ー光源と、 このレーザー光源から発振したレーザービームを２つの
レーザービームに分けるビームスプリッタと、 一方のレーザービームをそのままワークの加工面に向け
て集光させる第１の集光光学系と、 他方のレーザービームを波長変換する非線形光学系と、 この非線形光学系によって波長変換されたレーザービー
ムを前記ワークの加工面に向けて集光させる第２の集光
光学系とを具えたことを特徴とするレーザー加工装置。6. A laser light source which oscillates a single laser beam, a beam splitter which divides the laser beam oscillated from the laser light source into two laser beams, and one of the laser beams is directly directed toward a work surface of a workpiece. A first condensing optical system for emitting light, a non-linear optical system for wavelength-converting the other laser beam, and a second condensing optical system for converging the laser beam wavelength-converted by the non-linear optical system toward the processing surface of the workpiece. A laser processing device comprising a condensing optical system.
ービームを発振することを特徴とする請求項６に記載の
レーザー加工装置。7. The laser processing apparatus according to claim 6, wherein the laser light source oscillates a laser beam in an infrared region.
ービームを可視領域または紫外領域のレーザービームに
変換することを特徴とする請求項７に記載のレーザー加
工装置。8. The laser processing apparatus according to claim 7, wherein the nonlinear optical system converts a laser beam in an infrared region into a laser beam in a visible region or an ultraviolet region.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35238499A JP2001170788A (en) | 1999-12-10 | 1999-12-10 | Method of laser machining and device therfor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35238499A JP2001170788A (en) | 1999-12-10 | 1999-12-10 | Method of laser machining and device therfor |
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| Publication Number | Publication Date |
|---|---|
| JP2001170788A true JP2001170788A (en) | 2001-06-26 |
Family
ID=18423714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35238499A Pending JP2001170788A (en) | 1999-12-10 | 1999-12-10 | Method of laser machining and device therfor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001170788A (en) |
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| US7425471B2 (en) | 2004-06-18 | 2008-09-16 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset |
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| US7989731B2 (en) * | 2003-07-22 | 2011-08-02 | Carl Zeiss Meditec Ag | Method for processing materials with laser pulses having a large spectral bandwidth |
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| US7245412B2 (en) | 2001-02-16 | 2007-07-17 | Electro Scientific Industries, Inc. | On-the-fly laser beam path error correction for specimen target location processing |
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| US7687740B2 (en) | 2004-06-18 | 2010-03-30 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows |
| US7923306B2 (en) | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
| US7633034B2 (en) | 2004-06-18 | 2009-12-15 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure |
| US7629234B2 (en) | 2004-06-18 | 2009-12-08 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling |
| US7435927B2 (en) | 2004-06-18 | 2008-10-14 | Electron Scientific Industries, Inc. | Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset |
| US8383982B2 (en) | 2004-06-18 | 2013-02-26 | Electro Scientific Industries, Inc. | Methods and systems for semiconductor structure processing using multiple laser beam spots |
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