JPH0537516Y2 - - Google Patents

Info

Publication number
JPH0537516Y2
JPH0537516Y2 JP1987121739U JP12173987U JPH0537516Y2 JP H0537516 Y2 JPH0537516 Y2 JP H0537516Y2 JP 1987121739 U JP1987121739 U JP 1987121739U JP 12173987 U JP12173987 U JP 12173987U JP H0537516 Y2 JPH0537516 Y2 JP H0537516Y2
Authority
JP
Japan
Prior art keywords
electromagnetic wave
package
conductive paste
circuit element
wave shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987121739U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6426899U (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987121739U priority Critical patent/JPH0537516Y2/ja
Publication of JPS6426899U publication Critical patent/JPS6426899U/ja
Application granted granted Critical
Publication of JPH0537516Y2 publication Critical patent/JPH0537516Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
JP1987121739U 1987-08-07 1987-08-07 Expired - Lifetime JPH0537516Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987121739U JPH0537516Y2 (cs) 1987-08-07 1987-08-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987121739U JPH0537516Y2 (cs) 1987-08-07 1987-08-07

Publications (2)

Publication Number Publication Date
JPS6426899U JPS6426899U (cs) 1989-02-15
JPH0537516Y2 true JPH0537516Y2 (cs) 1993-09-22

Family

ID=31369027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987121739U Expired - Lifetime JPH0537516Y2 (cs) 1987-08-07 1987-08-07

Country Status (1)

Country Link
JP (1) JPH0537516Y2 (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2981755B2 (ja) * 1990-04-24 1999-11-22 富士重工業株式会社 舵角信号の処理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5734354A (en) * 1980-08-08 1982-02-24 Mitsubishi Electric Corp Packaging method of electronic parts
JPS5858342U (ja) * 1981-10-14 1983-04-20 株式会社リコー 混成集積回路
JPS60163751U (ja) * 1984-04-04 1985-10-30 スタンレー電気株式会社 半導体装置

Also Published As

Publication number Publication date
JPS6426899U (cs) 1989-02-15

Similar Documents

Publication Publication Date Title
US4391742A (en) Paste composition for the production of electrically conductive and solderable structures
US5045236A (en) Copper conductive composition
JPS62293608A (ja) 固体電解コンデンサの製造方法
KR19980081191A (ko) 도전성 페이스트 및 그 제조방법과 그것을 이용한 프린트 배선기판
JPH0537516Y2 (cs)
US2311776A (en) Method of making soldering devices
WO2019057450A1 (de) Verfahren zur herstellung einer endoberfläche und leiterplatte
JP3273015B2 (ja) 導電性ペーストの製造方法
JPH0373503A (ja) 回路形成方法
CN107295759B (zh) 一种焊接屏蔽模具制造方法、焊接屏蔽模具及焊接结构
JPH06164185A (ja) ハイブリッドｉｃ
JPH0878278A (ja) 電子部品の製造方法
JP3079396B2 (ja) ハイブリッドｉｃ
JP2963518B2 (ja) 導電性ペースト組成物
JP3243655B2 (ja) ハイブリッドｉｃ
GB1574438A (en) Printed circuits
JPH069446Y2 (ja) チツプ抵抗器
JP2526194B2 (ja) ハイブリッドｉｃ
JPS62130595A (ja) 電気回路装置の製造方法
JPS58154292A (ja) 導体路形成方法
JP3083146B2 (ja) 導電性ペースト組成物
JPH0311904Y2 (cs)
JPH0812904A (ja) 電磁波吸収ペーストおよびそのペーストで処理された電子部品
JPH0410754B2 (cs)
JP3520457B2 (ja) 錫被覆金属板及びその製造法