JPH0536294Y2 - - Google Patents
Info
- Publication number
- JPH0536294Y2 JPH0536294Y2 JP7981287U JP7981287U JPH0536294Y2 JP H0536294 Y2 JPH0536294 Y2 JP H0536294Y2 JP 7981287 U JP7981287 U JP 7981287U JP 7981287 U JP7981287 U JP 7981287U JP H0536294 Y2 JPH0536294 Y2 JP H0536294Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- enamel
- lower edge
- punched plate
- punched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 41
- 210000003298 dental enamel Anatomy 0.000 claims description 25
- 239000007788 liquid Substances 0.000 description 17
- 239000000126 substance Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7981287U JPH0536294Y2 (enrdf_load_stackoverflow) | 1987-05-28 | 1987-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7981287U JPH0536294Y2 (enrdf_load_stackoverflow) | 1987-05-28 | 1987-05-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63188974U JPS63188974U (enrdf_load_stackoverflow) | 1988-12-05 |
| JPH0536294Y2 true JPH0536294Y2 (enrdf_load_stackoverflow) | 1993-09-14 |
Family
ID=30930031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7981287U Expired - Lifetime JPH0536294Y2 (enrdf_load_stackoverflow) | 1987-05-28 | 1987-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536294Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4803002B2 (ja) * | 2006-11-27 | 2011-10-26 | パナソニック電工株式会社 | 金属プリント基板 |
-
1987
- 1987-05-28 JP JP7981287U patent/JPH0536294Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63188974U (enrdf_load_stackoverflow) | 1988-12-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE479520T1 (de) | Flussmittelfreies hartlöten | |
| JPS6112094A (ja) | フレキシブル回路基板の製造法 | |
| JPH0680605B2 (ja) | 電子部品チップ保持治具および電子部品チップのメタライズ面への金属コーティング方法 | |
| JPH0536294Y2 (enrdf_load_stackoverflow) | ||
| US4801947A (en) | Electrodeposition-produced orifice plate of amorphous metal | |
| EP0249834A2 (de) | Herstellung von Feinstrukturen für die Halbleiterkontaktierung | |
| JPH1112781A (ja) | 部分メッキ工法および装置 | |
| DE10258094B4 (de) | Verfahren zur Ausbildung von 3-D Strukturen auf Wafern | |
| JPH0613521A (ja) | 半導体装置 | |
| DE4130121C2 (de) | Verfahren zum Herstellen von Leiterplatten, bei denen die Bauelementanschlußflächen mit lötfähigen Metallschichten versehen sind | |
| JPS63168075A (ja) | スル−ホ−ル印刷配線板の製造方法 | |
| JPS5814625Y2 (ja) | 半田ディップ時のスル−ホ−ルマスク | |
| JP3087497U (ja) | プリント配線板印刷用メタルマスク版 | |
| JPH0634964U (ja) | クリームはんだ印刷用メタルマスク | |
| JPH0144217Y2 (enrdf_load_stackoverflow) | ||
| ATE371266T1 (de) | Verbesserung der qualität einer in einem plattierungsbad abgeschiedenen metallhaltigen schicht | |
| JPH0846113A (ja) | 部分メッキされた半導体用リードフレームの形成方法 | |
| KR100781152B1 (ko) | 리드프레임 도금 장치 및 이를 이용한 도금 방법 | |
| JPH0543898Y2 (enrdf_load_stackoverflow) | ||
| JP2517469B2 (ja) | 半田付方法 | |
| JPH0612623Y2 (ja) | チツプジヤンパ | |
| DE1614583C3 (de) | Verfahren zum Herstellen einer Kontaktmetallschicht für eine mit mindestens einem pn-übergang versehene Halbleiteranordnung | |
| JPH0511661Y2 (enrdf_load_stackoverflow) | ||
| JPS61124600A (ja) | フレ−ムパタ−ンの形成方法 | |
| JPS6364919B2 (enrdf_load_stackoverflow) |