JPS6364919B2 - - Google Patents

Info

Publication number
JPS6364919B2
JPS6364919B2 JP56159085A JP15908581A JPS6364919B2 JP S6364919 B2 JPS6364919 B2 JP S6364919B2 JP 56159085 A JP56159085 A JP 56159085A JP 15908581 A JP15908581 A JP 15908581A JP S6364919 B2 JPS6364919 B2 JP S6364919B2
Authority
JP
Japan
Prior art keywords
enamel
substrate
support frame
frit
firing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56159085A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5860597A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15908581A priority Critical patent/JPS5860597A/ja
Publication of JPS5860597A publication Critical patent/JPS5860597A/ja
Publication of JPS6364919B2 publication Critical patent/JPS6364919B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
JP15908581A 1981-10-06 1981-10-06 ほうろう基板の製造方法 Granted JPS5860597A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15908581A JPS5860597A (ja) 1981-10-06 1981-10-06 ほうろう基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15908581A JPS5860597A (ja) 1981-10-06 1981-10-06 ほうろう基板の製造方法

Publications (2)

Publication Number Publication Date
JPS5860597A JPS5860597A (ja) 1983-04-11
JPS6364919B2 true JPS6364919B2 (enrdf_load_stackoverflow) 1988-12-14

Family

ID=15685896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15908581A Granted JPS5860597A (ja) 1981-10-06 1981-10-06 ほうろう基板の製造方法

Country Status (1)

Country Link
JP (1) JPS5860597A (enrdf_load_stackoverflow)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5625261Y2 (enrdf_load_stackoverflow) * 1976-11-22 1981-06-15
JPS5810391Y2 (ja) * 1977-08-30 1983-02-25 日本電気ホームエレクトロニクス株式会社 ラグ端子付プリント基板
JPS54129749U (enrdf_load_stackoverflow) * 1978-03-02 1979-09-08
JPS58305Y2 (ja) * 1978-06-09 1983-01-06 日本電信電話株式会社 金属芯入り印刷配線板用基板
JPS5742182Y2 (enrdf_load_stackoverflow) * 1978-06-09 1982-09-17
JPS5636198A (en) * 1979-09-03 1981-04-09 Hitachi Chemical Co Ltd Method of manufacturing metal coreefilled printed circuit board

Also Published As

Publication number Publication date
JPS5860597A (ja) 1983-04-11

Similar Documents

Publication Publication Date Title
US3052957A (en) Plated circuit process
DK1015130T3 (da) Elektroformningsfremgangsmåde til fremstilling af et rakelblad
US2909833A (en) Printed circuits and method of soldering the same
US4915286A (en) Method for the soldering of external connection wires to an electronic component
JPS6364919B2 (enrdf_load_stackoverflow)
US3152388A (en) Printed circuit processing
JPH02240281A (ja) ホーロー基板の製造方法
EP0835046B1 (en) Component mounting board, process for producing the board, and process for producing the module
JPS58118186A (ja) 結晶性ホ−ロ−基板
JPH0950901A (ja) チップ電子部品とその製造方法
US3666639A (en) Method for coating metals or insulating substrates having a vitreous binder
JPS6150365B2 (enrdf_load_stackoverflow)
JPH0127565Y2 (enrdf_load_stackoverflow)
JPS5927624Y2 (ja) プリント配線用絶縁基板
JPH05190302A (ja) チップ抵抗体及びその製造方法
JPS6035201Y2 (ja) キヤツプレス型チツプ抵抗器
JPH053157B2 (enrdf_load_stackoverflow)
JPS6210039B2 (enrdf_load_stackoverflow)
JPS60214596A (ja) 電気回路板の製造法
JPS63204696A (ja) 可撓性プリント基板への部品ハンダ付け実装法
JPS6240548Y2 (enrdf_load_stackoverflow)
JPS6031116B2 (ja) 電気配線回路基板およびその製造方法
JPS5911465Y2 (ja) 電子部品取付装置
JPH05308190A (ja) スルーホールメタルコア基板
JPS61121389A (ja) セラミツク配線板