JPH0535588B2 - - Google Patents
Info
- Publication number
- JPH0535588B2 JPH0535588B2 JP60089639A JP8963985A JPH0535588B2 JP H0535588 B2 JPH0535588 B2 JP H0535588B2 JP 60089639 A JP60089639 A JP 60089639A JP 8963985 A JP8963985 A JP 8963985A JP H0535588 B2 JPH0535588 B2 JP H0535588B2
- Authority
- JP
- Japan
- Prior art keywords
- connection
- circuit board
- wiring pattern
- flexible circuit
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8963985A JPS61248495A (ja) | 1985-04-25 | 1985-04-25 | 可撓性回路基板の接続構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8963985A JPS61248495A (ja) | 1985-04-25 | 1985-04-25 | 可撓性回路基板の接続構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61248495A JPS61248495A (ja) | 1986-11-05 |
| JPH0535588B2 true JPH0535588B2 (de) | 1993-05-26 |
Family
ID=13976341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8963985A Granted JPS61248495A (ja) | 1985-04-25 | 1985-04-25 | 可撓性回路基板の接続構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61248495A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8173909B2 (en) * | 2006-10-25 | 2012-05-08 | Nitto Denko Corporation | Method for mating flexure to flex-print circuit and flexure therefor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51140174A (en) * | 1975-05-28 | 1976-12-02 | Sharp Kk | Method of connecting flexible substrate and other devices |
| JPS5719777A (en) * | 1980-07-11 | 1982-02-02 | Canon Kk | Electronic language learning machine |
| JPS57128995A (en) * | 1981-02-02 | 1982-08-10 | Sumitomo Electric Industries | Method of bonding hard printed board to flexible printed board |
| JPS57197778A (en) * | 1981-05-29 | 1982-12-04 | Tokyo Shibaura Electric Co | Method of bonding flexible tape with solder and flexible tape used for same method |
| JPS58107696A (ja) * | 1981-12-21 | 1983-06-27 | セイコーインスツルメンツ株式会社 | フレキシブル基板の接続方法 |
| JPS5932151U (ja) * | 1982-08-25 | 1984-02-28 | 日本ラインツ株式会社 | シリンダヘツドガスケツト |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55111379U (de) * | 1979-01-29 | 1980-08-05 | ||
| JPS5764187U (de) * | 1980-10-06 | 1982-04-16 |
-
1985
- 1985-04-25 JP JP8963985A patent/JPS61248495A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51140174A (en) * | 1975-05-28 | 1976-12-02 | Sharp Kk | Method of connecting flexible substrate and other devices |
| JPS5719777A (en) * | 1980-07-11 | 1982-02-02 | Canon Kk | Electronic language learning machine |
| JPS57128995A (en) * | 1981-02-02 | 1982-08-10 | Sumitomo Electric Industries | Method of bonding hard printed board to flexible printed board |
| JPS57197778A (en) * | 1981-05-29 | 1982-12-04 | Tokyo Shibaura Electric Co | Method of bonding flexible tape with solder and flexible tape used for same method |
| JPS58107696A (ja) * | 1981-12-21 | 1983-06-27 | セイコーインスツルメンツ株式会社 | フレキシブル基板の接続方法 |
| JPS5932151U (ja) * | 1982-08-25 | 1984-02-28 | 日本ラインツ株式会社 | シリンダヘツドガスケツト |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61248495A (ja) | 1986-11-05 |
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