JPH0534829B2 - - Google Patents

Info

Publication number
JPH0534829B2
JPH0534829B2 JP58176605A JP17660583A JPH0534829B2 JP H0534829 B2 JPH0534829 B2 JP H0534829B2 JP 58176605 A JP58176605 A JP 58176605A JP 17660583 A JP17660583 A JP 17660583A JP H0534829 B2 JPH0534829 B2 JP H0534829B2
Authority
JP
Japan
Prior art keywords
rectifier
solder
metal plate
protrusions
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58176605A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6066847A (ja
Inventor
Tadashi Nosaka
Mitsutoshi Horibe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP58176605A priority Critical patent/JPS6066847A/ja
Publication of JPS6066847A publication Critical patent/JPS6066847A/ja
Publication of JPH0534829B2 publication Critical patent/JPH0534829B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58176605A 1983-09-24 1983-09-24 半導体整流装置 Granted JPS6066847A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58176605A JPS6066847A (ja) 1983-09-24 1983-09-24 半導体整流装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58176605A JPS6066847A (ja) 1983-09-24 1983-09-24 半導体整流装置

Publications (2)

Publication Number Publication Date
JPS6066847A JPS6066847A (ja) 1985-04-17
JPH0534829B2 true JPH0534829B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-05-25

Family

ID=16016485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58176605A Granted JPS6066847A (ja) 1983-09-24 1983-09-24 半導体整流装置

Country Status (1)

Country Link
JP (1) JPS6066847A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0345641U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1989-09-08 1991-04-26

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5361970A (en) * 1976-11-16 1978-06-02 Fuji Electric Co Ltd Semiconductor element
JPS55130135A (en) * 1979-03-30 1980-10-08 Fujitsu Ltd Semiconductor device
JPS5756218A (en) * 1980-09-18 1982-04-03 Toyota Motor Corp Manufacture of polyurethane resin molding

Also Published As

Publication number Publication date
JPS6066847A (ja) 1985-04-17

Similar Documents

Publication Publication Date Title
US7319051B2 (en) Thermally enhanced metal capped BGA package
JP2003264265A (ja) 電力用半導体装置
JPH09275170A (ja) 半導体装置
JP2001284525A (ja) 半導体チップおよび半導体装置
JP3094768B2 (ja) 半導体装置
JPH11214612A (ja) パワー半導体モジュール
JP2828358B2 (ja) 半導体放熱構造
JPH0357251A (ja) 半導体装置
JPH0534829B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2000307058A (ja) パワー半導体モジュール
JPH11111897A (ja) マルチチップ型半導体装置
JPH06334091A (ja) 半導体装置
JPH08186199A (ja) 樹脂封止型半導体装置
JP4396366B2 (ja) 半導体装置
JPH1065072A (ja) 放熱電極構造
JPS627145A (ja) 電力半導体装置
JPS5832423A (ja) 半導体装置
JPH05160304A (ja) 半導体装置
JPS64814B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2619155B2 (ja) 混成集積回路装置
WO2021240944A1 (ja) 半導体装置
TWI237361B (en) Chip package structure
JP2868868B2 (ja) 半導体装置
JP2023131815A (ja) 半導体装置
JPH0395959A (ja) リードフレーム