JPH0533822B2 - - Google Patents

Info

Publication number
JPH0533822B2
JPH0533822B2 JP63132973A JP13297388A JPH0533822B2 JP H0533822 B2 JPH0533822 B2 JP H0533822B2 JP 63132973 A JP63132973 A JP 63132973A JP 13297388 A JP13297388 A JP 13297388A JP H0533822 B2 JPH0533822 B2 JP H0533822B2
Authority
JP
Japan
Prior art keywords
electrode
bonding
recognition pattern
recognition
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63132973A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01302824A (ja
Inventor
Koji Kikuchi
Kazuo Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP63132973A priority Critical patent/JPH01302824A/ja
Publication of JPH01302824A publication Critical patent/JPH01302824A/ja
Publication of JPH0533822B2 publication Critical patent/JPH0533822B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
JP63132973A 1988-05-31 1988-05-31 半導体装置 Granted JPH01302824A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63132973A JPH01302824A (ja) 1988-05-31 1988-05-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63132973A JPH01302824A (ja) 1988-05-31 1988-05-31 半導体装置

Publications (2)

Publication Number Publication Date
JPH01302824A JPH01302824A (ja) 1989-12-06
JPH0533822B2 true JPH0533822B2 (enExample) 1993-05-20

Family

ID=15093821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63132973A Granted JPH01302824A (ja) 1988-05-31 1988-05-31 半導体装置

Country Status (1)

Country Link
JP (1) JPH01302824A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316735B1 (en) 1996-11-08 2001-11-13 Ricoh Company, Ltd. Semiconductor chip mounting board and a semiconductor device using same board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52115177A (en) * 1976-03-24 1977-09-27 Hitachi Ltd Semiconductor device
JPS58152432A (ja) * 1982-03-05 1983-09-10 早瀬　政志 糸巻き付き移動ウキ

Also Published As

Publication number Publication date
JPH01302824A (ja) 1989-12-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees