JPH0533818B2 - - Google Patents

Info

Publication number
JPH0533818B2
JPH0533818B2 JP62078809A JP7880987A JPH0533818B2 JP H0533818 B2 JPH0533818 B2 JP H0533818B2 JP 62078809 A JP62078809 A JP 62078809A JP 7880987 A JP7880987 A JP 7880987A JP H0533818 B2 JPH0533818 B2 JP H0533818B2
Authority
JP
Japan
Prior art keywords
etching
end point
value
time
order differential
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62078809A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63244847A (ja
Inventor
Masahito Tashiro
Isao Asaishi
Yutaka Nogami
Tsutomu Tsukada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP62078809A priority Critical patent/JPS63244847A/ja
Publication of JPS63244847A publication Critical patent/JPS63244847A/ja
Publication of JPH0533818B2 publication Critical patent/JPH0533818B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
JP62078809A 1987-03-31 1987-03-31 ドライエッチング終点検出方法 Granted JPS63244847A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62078809A JPS63244847A (ja) 1987-03-31 1987-03-31 ドライエッチング終点検出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62078809A JPS63244847A (ja) 1987-03-31 1987-03-31 ドライエッチング終点検出方法

Publications (2)

Publication Number Publication Date
JPS63244847A JPS63244847A (ja) 1988-10-12
JPH0533818B2 true JPH0533818B2 (enExample) 1993-05-20

Family

ID=13672170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62078809A Granted JPS63244847A (ja) 1987-03-31 1987-03-31 ドライエッチング終点検出方法

Country Status (1)

Country Link
JP (1) JPS63244847A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997002593A1 (en) * 1995-06-30 1997-01-23 Lam Research Corporation An improved method and apparatus for detecting optimal endpoints in plasma etch processes

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5160402A (en) * 1990-05-24 1992-11-03 Applied Materials, Inc. Multi-channel plasma discharge endpoint detection method
JP3015540B2 (ja) * 1991-09-26 2000-03-06 株式会社東芝 半導体装置の製造方法
JPH07122148B2 (ja) * 1991-08-09 1995-12-25 株式会社芦田 電極のエッチング状態検出方法とその装置
US5308414A (en) * 1992-12-23 1994-05-03 International Business Machines Corporation Method and apparatus for optical emission end point detection in plasma etching processes
US5348614A (en) * 1993-06-22 1994-09-20 Lsi Logic Corporation Process for dynamic control of the concentration of one or more reactants in a plasma-enhanced process for formation of integrated circuit structures
FR2719120B1 (fr) * 1994-04-22 1996-05-31 Innovatique Sa Procédé et dispositif pour la détermination et le contrôle de la composition du mélange gazeux réactif agissant sur un substrat au cours d'un traitement physico-chimique sous atmosphère rarefiée.
US6903826B2 (en) 2001-09-06 2005-06-07 Hitachi, Ltd. Method and apparatus for determining endpoint of semiconductor element fabricating process
JP4496498B2 (ja) * 2006-10-20 2010-07-07 株式会社豊田中央研究所 表面前処理方法及び表面前処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6153728A (ja) * 1984-08-24 1986-03-17 Hitachi Ltd エツチング終点判定方法
JPS6293943A (ja) * 1985-10-21 1987-04-30 Hitachi Ltd 終点検出方法および装置
JPS6393115A (ja) * 1986-10-08 1988-04-23 Hitachi Ltd 終点判定方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997002593A1 (en) * 1995-06-30 1997-01-23 Lam Research Corporation An improved method and apparatus for detecting optimal endpoints in plasma etch processes

Also Published As

Publication number Publication date
JPS63244847A (ja) 1988-10-12

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