JPH05335787A - Tray for electronic component, tray for electronic component with adhesive section attached, and electronic component mounter - Google Patents

Abstract

PURPOSE:To eliminate the deviation in position, the damage and the deformation of a component by forming a tongue section at a central part of each of the plurality of supporting sections on which the electronic components are to be mounted separately by cutting out from the other section a part which is extended from one side of a part which is located under the electronic component to a partition at the other side of the part and which is narrower than a body of the electronic component. CONSTITUTION:A tray for electronic components 1 is manufactured by injection molding of plastic. On the tray 1, partitions 2 are formed crosswise to make supporting sections 4 on which electronic components 3 are to be mounted separately. A part which is extended from one side of a body supporting section 6 to a partition 2 at the other side of the section and which is narrower than the body 5 is cut out from the other part by a U-shaped groove 9 or two streaks of grooves 10 to form a tongue section 11 which is connected at one side to the other part of the supporting section 4. On the upper face of the tongue section 11, an adhesive section 12 to which the body 5 of the electronic component 3 is to be adhered is installed. The electronic component 3 is adhered to the supporting section 4 of the tray 1 by means of the adhesive section 12, so the electronic component 3 never deviates in position.

Description

Detailed Description of the Invention

[0001]

The present invention relates to, for example, QFP and SOP.
Such as surface mount type electronic parts, electronic part trays for packaging and transporting electronic parts such as chip type electronic parts, electronic part trays with adhesive parts and electronic parts taken out from these trays and mounted on printed wiring boards Regarding electronic component mounter.

[0002]

2. Description of the Related Art In recent years, the circuit density of a printed wiring board has been remarkably increased, and the circuit density of the printed wiring board is DIP by using a surface mount type component capable of fine pitch and double-sided mounting. (Dual Online
Package), SIP (Single Online Package), PG
Compared with the case of using an insert mounting type component such as A (Pin Grid Array), the density is becoming higher.

Further, in parallel with the increase in the component mounting density as described above, the fineness and fine pitch of the wiring formed on the printed wiring board have been remarkably advanced.
At present, a circuit pattern forming technique and an electronic component manufacturing technique have been developed aiming at a minimum pattern pitch of about 0.3 mm.

By the way, surface mount components are roughly classified into QF.
P (Quad Flat-Leaded Package), SOP (Small
Flat pack type (Outline Package) and L
CC (Leadless Chip Carrier), PLCC (Plasti)
Although it is classified as a chip carrier type such as c Leaded Chip Carrier), it is necessary to prevent damage to these electronic components when transporting these components or automatically mounting them on a printed wiring board.

Particularly, in a flat pack type electronic component such as QFP or SOP in which a large number of fine leads are juxtaposed and projected on the lateral side of the body of the electronic component at extremely minute intervals, not only lead damage but also lead Care must be taken not to cause deformation and breakage of the.

For this reason, in the past, for example, the actual development of Sho 58-
As disclosed in Japanese Patent No. 85397, a tape-like holding structure having a hole into which a body of an electronic component is fitted is used, or as disclosed in Japanese Utility Model Laid-Open No. 61-53992, A tape-shaped holding structure in which the body is adhered with an adhesive is used, or the body of an electronic component is adhered by a double-sided adhesive layer as disclosed in Japanese Patent Publication No. 57-15777 or Japanese Utility Model Publication No. 57-69297. It also uses a tape-shaped support structure.

However, in a tape-shaped holding structure having a hole through which the body of the electronic component is fitted, the electronic component may escape from the hole due to vibration during transportation.

Further, in the conventional example in which an electronic component is temporarily fixed to a tape-shaped support structure with an adhesive material or a double-sided adhesive layer,
Since the tape is in the form of a flat tape, it is not possible to sufficiently prevent other objects from coming into contact with or colliding with the leads of the electronic component during transportation.

Therefore, for example, Japanese Utility Model Publication No. 2-15492, Japanese Utility Model Publication No. 2-93257, or Japanese Utility Model Publication No. 2-1.
As disclosed in Japanese Patent No. 5492, a stepped cavity is formed in a tape in accordance with the size and shape of an electronic component, and the lead of the electronic component is housed in the cavity to prevent damage or deformation thereof. A carrier for electronic parts has been proposed which prevents the electronic parts and temporarily fixes the electronic parts inserted in the cavity with an adhesive layer or an adhesive layer.

This type of tape is called an embossed tape and is excellent in that it can protect the leads of electronic parts from contact and collision with other objects, but since it contains a large cavity, it can be wound onto a reel properly. In addition, it is necessary to form a knockout hole on the bottom surface of the cavity to take out the electronic component from the cavity, and to provide a device for causing the knockout pin to project from the hole to release the adhesion between the tape and the electronic component.

In addition, in this device, in order not to destroy the air tweezers for taking out the electronic parts from the cavity, the electronic parts are lifted up from the lower side before the electronic parts are adsorbed by the air tweezers to temporarily fix the electronic parts. When the temporary fixing is released, the tape is largely elastically deformed by the push-up force of the knockout pin when the temporary fixing is released, and when the temporary fixing is released, the tape is elastically restored to the electronic component by the reaction. Suddenly jumps up from the bottom of the cavity and floats up, causing the position of the electronic components to shift significantly.

For this reason, the electronic component may not be adsorbed by the air tweezers, or the lead of the electronic component may contact the side surface of the cavity or the like to be deformed or broken.

Recently, in order to eliminate the need for winding on a reel, a tray for electronic parts made of plastic is provided in which partitions are provided in the vertical and horizontal directions to divide a plurality of supporting parts on which electronic parts are individually placed. Is proposed.

This electronic component tray has a smaller number of electronic components that can be supported on one tray as compared with the embossed tape, but has the advantage of being stackable and capable of relatively multiple and stable transportation. It seems that it will spread.

[0015]

In this electronic component tray, the position of the electronic component may be greatly displaced due to the vibration during transportation or the vibration on the transfer line, or the lead of the electronic component may be bent or broken by hitting a partition or the like. In order to solve the above problem, electronic components are temporarily fixed to each supporting portion of the tray by adhesion or adhesion as in the case of using the embossed tape.

Therefore, when the electronic parts are taken out from the tray, as in the case of using the embossed tape,
By lifting the electronic component with a knockout pin from the lower part of the tray, a means for releasing the temporary fixing is required, and when the temporary fixing is released, the electronic component jumps up from the tray due to elastic deformation and elastic restoration of the tray. However, there are still problems such as the fact that it may float up to a large extent, and the position may be greatly displaced, and that the positional displacement may make it impossible to take it out, and lead may be damaged or deformed.

The present invention has been completed in view of the above technical problems, and the positional deviation of the components during transportation, during transportation on the transportation line, and during component removal can be achieved simply by adding a simple structure to the electronic component mounter. For electronic parts, it is possible to surely prevent damage or deformation of leads, correct even if the position of parts is misaligned, and collect expensive QFP and SOP from the assembled defective board. It is an object of the present invention to provide a tray, a tray for electronic components with an adhesive portion, and an electronic component mounter.

[0018]

In order to achieve the above-mentioned object, the tray for electronic parts of the present invention is provided with partitions vertically and horizontally to divide a plurality of supporting parts on which electronic parts are individually placed. In the tray for electronic parts, a part narrower than the body of the electronic part from one side part of the central part of each supporting part located on the lower side of the electronic part to the partition on the other side from the other part It is characterized in that the tongue piece is formed by cutting.

The electronic component tray of the present invention will be described in more detail as follows. The electronic component tray of the present invention may be a simple soft tray or a solid hard tray, but the hard tray is suitable for QFPs, SOPs, etc. where the lead spacing is small and the number of leads is large.

The material of the tray for electronic parts is not particularly limited, and synthetic resin, metal, metal as a base material, the surface of which is coated with a synthetic resin or a coating film is formed, etc. There are various types, but from the viewpoint of economy, productivity, portability (lightness), etc., the one made of synthetic resin is most preferable. This synthetic resin includes both thermosetting resin and thermoplastic resin.

In the present invention, in this kind of electronic component tray, a plurality of supporting portions on which electronic components are individually placed are separately provided by partitioning vertically and horizontally.

The size and shape of each of the supporting portions are not particularly limited, but it is desirable that the size and shape include a plane projection of the electronic component placed thereon.

The groove for forming the tongue portion in the present invention is, in short, the electronic component extending from one side portion of the central portion of each supporting portion located below the body of the electronic component to the other partition. It suffices if it is formed so as to divide a portion narrower than the body of the above-mentioned one side width so as to be continuous with the other portion of the tray.

That is, when another supporting portion is connected to the other side of the supporting portion, for example, it extends from one side edge of the central portion of the body supporting portion to a position beyond the partition on the other side.
Straight grooves of the strip, two straight grooves extending from one side edge of the central portion of the body support portion to a position immediately before or beyond the partition on the other side, and these straight grooves on one side of the partition Alternatively, it is composed of a U-shaped groove, a semi-circular groove, a V-shaped groove, or a U-shaped groove connected on the other side.

When another support portion is not continuous to the other side of the support portion, for example, it extends from one side edge portion of the central portion of the body support portion to the end edge of the tray beyond the partition on the other side. It consists of two straight grooves.

This groove may be formed by a method such as punching after the tray is injection-molded. However, in order to ensure the dimensional accuracy and not to increase the manufacturing process and the manufacturing cost, the groove is formed during the injection molding. It is preferably formed.

A portion of the central portion of each of the supporting portions located below the body of the electronic component has the same height as the surrounding portion,
That is, the support portion may be formed to be flush. However, when the portion of the central portion of each support portion located below the body of the electronic component is formed higher than the surrounding portion by a certain amount or more to release the adhesion between the electronic component and the tongue portion, It is preferable that the body of the electronic component is supported so that the lower end of the electronic component is lifted from the support portion, the lead is prevented from being elastically deformed by being received by the support portion, and the electronic component is prevented from jumping up due to the springback action of the lead.

Further, according to the present invention, by providing the convex portion in which the lower portion of the body of the electronic component is fitted in the central portion of each of the supporting portions and the portion located below the body of the electronic component, It is desirable that the lower part of the body of the electronic component be fitted in and positioned, or that the lead of the electronic component be housed to prevent damage, deformation and the like.

Further, in the tray for electronic parts with an adhesive part of the present invention, in order to achieve the above object, an adhesive part for adhering the body of the electronic part is formed on the tongue part in the electronic part mounter described above. It is characterized by being

In the present invention, in this case, since the electronic component is adhered to the support portion via the adhesive portion, it is not necessary to provide a means for positioning the electronic component, but the electronic component can be positioned within the support portion. In order to enable easy and accurate operation, a ridge in which the lower part of the body of the electronic component is fitted is formed around the portion located below the body of the electronic component in the central portion of each support portion. Preferably.

The adhesive section may be constructed so that the body of the electronic component can be temporarily fixed to the tongue section with an adhesive force of a predetermined value or more. For example, an adhesive directly coated on the tongue section or an adhesive It can be composed of a double-sided adhesive tape comprising a substrate and an adhesive layer laminated on both sides thereof.

Further, these adhesive parts are not particularly limited as long as they have an adhesive force to such an extent that the electronic parts are not peeled or displaced during transportation or handling.

The pressure-sensitive adhesive used in the present invention may be a thermosetting pressure-sensitive adhesive or a thermoplastic pressure-sensitive adhesive, but the QF which is more expensive than the assembled defective substrate is particularly preferable.
A thermoplastic adhesive is desirable so that P and SOP can be recovered.

Examples of thermosetting adhesives include urea adhesives, melamine adhesives, phenolic adhesives, resorcinol adhesives, epoxy adhesives, polyester adhesives, polyurethane adhesives, polyaromatics. Tick-based adhesives and the like are mentioned as examples.

As the thermoplastic adhesive, for example, vinyl acetate adhesive, polyvinyl alcohol adhesive,
Polyvinyl acetal adhesive, vinyl chloride adhesive,
Acrylic adhesive, polyamide adhesive, polyethylene adhesive, cellulose adhesive, chloroprene adhesive, nitrile rubber adhesive, styrene rubber adhesive, polysulfide adhesive, butyl rubber adhesive, silicone rubber adhesive An example thereof is an adhesive.

By the way, in the present invention, when the adhesive portion on the electronic component side is transferably adhered to the electronic component to be used for temporarily fixing the electronic component to the plastic wiring board, a heat-resistant adhesive is used. Preferably.

The base material of the double-sided adhesive tape is not particularly limited, and an inorganic or organic material generally used as a base material of the double-sided adhesive tape can be used. However, when the base material is adhesively transferred to the electronic component together with the adhesive and used for temporary fixing of the electronic component in the later soldering process, in order to prevent the electronic component from falling off or moving, a certain amount of It is preferable to use a material having heat resistance, for example, heat resistance that can withstand a temperature of 230 to 250 ° C. for several seconds to ten and several seconds.

Examples of the organic material having such heat resistance include cellulose acetate, cellulose triacetate, fluorine resin, polycarbonate, aromatic polyamide, polysulfone, polyester, polyvinyl alcohol, polyimide, aramid resin, polyphenylene oxide, polyphenylene sulfide, Polyamide imide, bismaleimide triazine, epoxy resin,
Examples thereof include polyamide bismaleimide, polyacetal, polyether ether ketone, polyether sulfone, polyarylate, and polyoxybenzoyl, but it is preferable to use polyimide or aramid resin from the viewpoint of electrical characteristics and heat resistance.

Examples of such heat-resistant inorganic material include rock wool, non-woven fabric or woven fabric made of glass fiber, carbon fiber or the like. Of these, those made of glass fiber Is preferable from the viewpoint of electrical characteristics and heat resistance.

The thickness of the heat resistant substrate is 6 to 300 μm.
The thickness is preferably m, particularly about 10 to 100 μm, and further preferably 12 to 50 μm. If the thickness of the base material exceeds 300 μm, the leads of the electronic components mounted on the printed wiring board may rise from the surface conductor pattern of the printed wiring board and impair the reliability of soldering. If the thickness of the base material is less than 6 μm, the strength of the base material is insufficient and the base material may be broken during handling or the handleability may be deteriorated, which is not preferable.

In the present invention, the adhesive portion adheres to the body of the electronic component with an adhesive force weaker than the adhesive force to the tray, or in the double-sided adhesive tape, the adhesive layer on the electronic component side is the body of the electronic component. What is adhered to the base material with a weaker adhesive strength than the base material is desirable because the electronic parts can be easily peeled from the tray and easily attached to the printed wiring board.

The thickness of the adhesive portion is not particularly limited, but when the adhesive portion is transferred to an electronic component,
In order to prevent the leads of the electronic component from rising above the surface of the printed wiring board when the electronic component is temporarily fixed on the printed wiring board, a certain level or less, that is, a height difference between the lower surface of the body of the electronic component and the lower surface of the lead. Is preferred.

That is, in the present invention, it is desirable that the adhesive portion is provided with a certain thickness or less, or in the double-sided adhesive tape, the adhesive layer on the electronic component side is provided with a certain thickness or less.

In the adhesive part-equipped electronic component tray of the present invention, by pushing down the tongue tip of the tongue piece portion of the tray, the distance between the tongue piece portion and the electronic component is widened so that the distance between the tongue piece portion and the electronic component is increased. However, if the adhesive action of the adhesive portion is suddenly released in the state where the leads are in contact with the support surface of the tray, the reaction thereof causes, for example, a springback phenomenon of the leads of the electronic component to occur. May jump up from the tray, causing misalignment of electronic components, damage to leads, deformation of leads, and the like.

In order to solve this problem, it is necessary to release the adhesive action of the adhesive portion in a non-reactive manner. As a concrete method, the leads are lifted from the support surface of the tray as described above, In addition to the method of supporting the electronic component on the support surface to prevent the springback of the lead from occurring, the force required to start the release of the adhesive action of the adhesive portion is reduced to prevent the springback of the support surface. Methods and methods using these methods in combination are conceivable.

As described above, in order to reduce the force required to start the release of the adhesive action, for example, the distance between the tongue portion and the electronic component is widened first, so that the release of the adhesive action starts first on the tongue side. It is desirable that the taper be formed in a small amount or in a tapered shape because the adhesive force at the portion at the beginning of peeling is weak and peeling is easy.

The shape of the adhesive portion is not particularly limited, but specific examples thereof include a circle, an ellipse, and a rhombus.

In order to reuse the electronic component tray, it is preferable to release the adhesive action of the adhesive portion within the range where the tongue piece is elastically deformed.

Further, in the present invention, in order to facilitate the peeling of the electronic component, a release material is partially formed on the upper surface of the adhesive portion, or the surface of the adhesive portion is roughened to reduce the adhesive area. It is desirable to reduce it.

In the present invention, of course, in facilitating the peeling of the electronic component as described above, the adhesive force between the electronic component and the adhesive portion is designed within a range such that the electronic component does not peel or shift during transportation. Needless to say.

Further, in the electronic component mounter of the present invention, the electronic components are sucked from the electronic component tray provided with the vertical and horizontal partitions to divide the plurality of support portions on which the electronic components are individually placed. In order to achieve the above object, in an electronic component mounter equipped with air tweezers to be taken out, in order to achieve the above object, the body of the electronic component ranging from one side portion of the central portion of each support body located below the electronic component to the other side partition A tongue portion is formed by cutting a portion narrower than that of the tray. Adhesion releasing means for pushing down the tongue tip portion of the tongue portion that is continuous with the other portion of the support surface at the one side below the other portion of the tray is provided. It is characterized by being provided.

In the electronic component mounter of the present invention,
Although not particularly limited, it is preferable to support the adhesion releasing means on the air tweezers so that the driving mechanism of the air tweezers also serves as the driving mechanism of the adhesion releasing means to simplify the configuration.

In this case, the adhesion releasing means is provided with a pressing member which is supported by the air tweezers so as to be able to move up and down, and descending drive means for lowering the pressing member until the lower end thereof is positioned lower than the lower end of the air tweezers. Be done. In this case, it is not preferable to fix the pressing member that pushes down the tongue portion to the air tweezers, because the pressing member interferes when the electronic component is mounted on the printed wiring board.

The structure of the lowering drive means is not particularly limited as long as it is configured to lower the pressing member until the lower end thereof is positioned lower than the lower end of the air tweezers. For example, a pressing member for urging the pressing member downwardly. It can be composed of a drive member supported by a spring and an air tweezer so as to be able to move up and down, and received by a body of an electronic component placed on a tray or an arm, and a link mechanism for interlockingly connecting a pressing member to the drive member.

However, in order to securely prevent the displacement of the electronic parts and the deformation or breakage of the leads by releasing the adhesive parts of the adhesive parts after the electronic parts are sucked by the air tweezers, the descending drive means is supported by the air tweezers. Was
It is advantageous to use a vacuum cylinder having a vertical axis for lowering the pressing member when the internal pressure of the suction path of the air tweezers is reduced below a certain negative pressure.

The structure of the air tweezers of the electronic component mounter of the present invention may be any structure suitable for adsorbing the body of the electronic component. For example, if the air tweezers used in the conventional electronic component mounter are used. Good.

[0057]

The electronic component tray of the present invention has the above-mentioned structure, and is a tray for electronic components in which a plurality of supporting portions on which electronic components are individually placed are provided by partitioning vertically and horizontally. The tongue portion is formed by cutting the narrower part of the body of the electronic component, which extends from one side of the part located under the electronic part in the central part of each support part to the other partition, from the other part. Form a sticky part on this tongue part,
Since the electronic component is temporarily fixed to the support surface by using this adhesive portion, it is possible to prevent the electronic component from jumping up from the support surface due to vibration during transportation.

Further, in order to take out the electronic component, instead of the knockout hole, two parallel grooves or a U-shaped groove for dividing the tongue piece from the other part should be formed. It does not complicate the configuration substantially,
The number of manufacturing processes does not increase.

Moreover, the mounter may be provided with a releasing means which has a simple structure and can be easily added to the existing mounter, as will be described later.

Further, when the electronic component is taken out, the tongue tip portion of the tongue piece portion is pushed down to bend or bend the tongue tip portion, whereby the adhesive action of the adhesive portion can be released in order from the tongue side, and the adhesive action is released. Therefore, the spring back action of the tray and the lead to the above is eliminated to prevent the electronic component from jumping up from the tray.

Further, in the electronic component tray of the present invention, since the electronic component is temporarily fixed to the supporting surface by using the adhesive portion, the electronic component is prevented from jumping up from the supporting surface due to vibration during transportation.

Further, in order to take out the electronic component, it is only necessary to form two parallel grooves or a U-shaped groove for dividing the tongue portion from the other portion, instead of the knockout hole. However, the structure is not substantially complicated, and the number of manufacturing steps does not increase. Moreover, the mounter may be provided with a releasing means that has a simple structure and can be easily added to the existing mounter, as will be described later.

Further, when the electronic component is taken out, the tongue tip portion of the tongue piece portion is pushed down to bend or bend the tongue piece portion, whereby the adhesive action of the adhesive portion can be released in order from the tongue tip side, and the adhesive action is released. It is possible to prevent the electronic parts from jumping up from the tray by eliminating the springback action of the tray and the lead with respect to.

In the electronic component mounter of the present invention,
The electronic component is placed on the electronic component tray of the present invention and is adhered by the adhesive portion, and the tongue of the tongue portion of the tray is bent or bent downward to adhere the electronic component to the tongue side. Since it is sequentially released from the above, the force required to release the adhesive action becomes small, the components are prevented from rising from the supporting surface due to the springback action of the tray and the lead, and the electronic components jump up from the tray by the reaction of the release of the adhesive. The displacement is prevented.

Incidentally, the electronic parts adsorbed by the air tweezers before and after the release of the adhesion to the tongue piece are lifted above the tray together with the air tweezers,
It is moved to a predetermined position above the printed wiring board, and is further lowered and mounted on the printed wiring board.

[0066]

EXAMPLES The present invention will now be described in detail based on examples, but the present invention is not limited thereto. An electronic component tray, an electronic component tray with an adhesive portion, and an electronic component mounter according to an embodiment of the present invention will be specifically described in order with reference to the drawings.

As shown in the plan view of FIG. 1, an electronic component tray 1 according to an embodiment of the present invention is made by injection-molding plastic, and a partition 2 is provided vertically and horizontally to form an electronic component (here In this case, the support portions 4 on which the QFPs 3 are individually placed are separately provided.

The type of plastic constituting the tray 1 is not particularly limited, and both thermoplastic resin and thermosetting resin can be used.

The thermoplastic resin is not particularly limited, but is, for example, polyethylene, polypropylene, polystyrene, synthetic rubber, polyvinyl acetate, polyvinyl alcohol, polyvinyl acetal, polyacetal, polyphenylene oxide, modified polyphenylene oxide, polymethacryl. Acid ester, polyacrylic acid derivative, polyacrylic acid amide, polyether, polyester, polycarbonate, cellulosic resin, polyacrylonitrile, nylon and polyamideimide, polyvinyl chloride, polyvinylidene chloride, polyfluoroethylene,
Examples thereof include thiocol, polysulfone, polyphenylene sulfide, thermoplastic polyurethane resin and the like.

The thermosetting resin is not particularly limited, and examples thereof include polyimide resin, phenol resin, epoxy resin, unsaturated polyester, alkyd resin, urea resin, melamine resin, thermosetting polyurethane, Examples thereof include bismaleimide / triazine, silicon resin, and ionomer.

In this case, it is made of polyethylene.

Further, although a simple soft tray or a solid hard tray may be used, here, a hard tray is used in correspondence with a QFP having a small number of leads and a large number of leads.

The size and shape of each of the support portions 4 is not particularly limited, but it is desirable that the size and shape include a plane projection of the electronic component 3 placed thereon.

In this case, as shown in the sectional view of FIG. 2, the body supporting portion 6 located below the body 5 of the electronic component 3 in the central portion of each supporting portion 4 is more electronic than the surrounding portion 7. A ridge 8 which is formed higher than the height difference between the lower surface of the body 5 of the component 3 and the lower surface of the lead, and in which the lower portion of the body 5 of the electronic component 3 is fitted along the boundary with the surrounding portion 7. Equipped with.

In this case, as shown in FIG. 1, one side portion of the body support portion 6 (a portion of the electronic component 3 extending from the right side portion to the other side partition 2 in the figure, which is narrower than the body 5). Is cut from the other portion by U-shaped or two grooves 9 and 10 to form a tongue piece portion 11 continuous to the other portion of the support portion 4 at the one side portion, and the tongue piece portion 11 has an upper surface. An adhesive section 12 for adhering the body 5 of the electronic component 3 is provided.

The grooves 9 and 10 for separating the tongue portions 11 from other portions are, in short, the partitions 2 from one side of the body supporting portion 6 of the electronic component 3 to the other side at the central portion of each supporting portion 4. It suffices if the portion of the electronic component 3 that is narrower than the body 5 is cut so as to be continuous with the other portion of the tray 1 at one side thereof.

That is, when another support portion 4 is connected to the other side of the support portion 4, it extends, for example, from one side portion of the central portion of the body support portion 6 to a position beyond the partition 2 on the other side. Two linear grooves 9a and 9b and these linear grooves 9
It is composed of a U-shaped groove 9 consisting of a straight groove 9c connecting the a and 9b on the other side of the partition 2.

When another supporting surface 4 is not continuous to the other side of the supporting surface 4, for example, the tray 1 is passed from one end of the center portion of the body supporting portion 6 to the other side partition 2.
It is composed of two linear grooves 10 extending to the edge of the.

The grooves 9 and 10 may be formed by, for example, punching after injection molding, but here, in order to secure the dimensional accuracy and the like, and not to increase the number of manufacturing steps and the manufacturing cost, the injection molding is performed. Sometimes formed.

The adhesive portion 12 may be composed of only an adhesive that is directly applied to the tongue portion 11 or a double-sided adhesive tape that is directly attached to the tongue portion 11. Then, in order to facilitate the transfer of the adhesive portion 12 to the electronic component 3 and to easily control the thickness of the adhesive portion 12 transferred to the electronic component, for example, as shown in the schematic view of FIG. And a double-sided adhesive tape composed of the adhesive layers 12b attached to both surfaces thereof.

The material of the base material 12a is not particularly limited, and an inorganic or organic material that is generally used as a base material for a double-sided adhesive material can be used. In particular, the base material 12a together with the adhesive layer 12b are used for electronic parts. In order to temporarily transfer electronically adhere to No. 3 and use it for temporary fixing of electronic parts in a later soldering process, heat resistance above a certain level, for example, 230 to 250
A material having heat resistance that can withstand a temperature of ° C for several seconds to several tens of seconds is used.

As the organic material having such heat resistance, for example, cellulose acetate, cellulose triacetate, fluorine resin, polycarbonate, aromatic polyamide, polysulfone, polyester, polyvinyl alcohol, polyimide, aramid resin, polyphenylene oxide, polyphenylene sulfide, Polyamide imide, bismaleimide triazine, epoxy resin,
Examples thereof include polyamide bismaleimide, polyacetal, polyether ether ketone, polyether sulfone, polyarylate, polyoxybenzoyl, and the like, and polyphenylene sulfide and polyimide are used from the viewpoint of electrical characteristics and heat resistance.

Examples of such heat-resistant inorganic materials include rock wool, glass fibers, non-woven fabrics or woven fabrics made of carbon fibers, and the like. Of these, those made of glass fibers are used. Is preferable from the viewpoint of electrical characteristics and heat resistance.

In this embodiment, the substrate 12a is made of polyphenylene sulfide (PPS) film.

Adhesive layer 12b used in the adhesive section 12
May be a thermosetting material or a thermoplastic material, but in this embodiment, the electronic component 3 is transferably adhered to temporarily fix the electronic component in a later soldering step. In order to utilize, the silicone-based adhesive layer 12b is used.

In the present invention, the adhesive portion 12 adheres to the body of the electronic component 3 with an adhesive force weaker than the adhesive force to the tray 1, or in the double-sided adhesive tape, the adhesive layer 12b on the electronic component 3 side. Is the base material 1 for the body of the electronic component 3.
It is desirable that the adhesive force is weaker than the adhesive force to 2a because the electronic component 3 can be easily peeled from the tray 1 and can be easily attached to the printed wiring board.

Further, in the present invention, in order to facilitate the peeling of the electronic component 3, as shown in the schematic view of FIG. 3, for example, the adhesive portion 13 has a base material 13a and an adhesive layer formed on both surfaces thereof. A double-sided adhesive tape consisting of 13b and 13c, wherein a release material 13d is formed on the surface of the adhesive layer 13b on the electronic component 3 side.
Although it is partially formed, or it is not shown, it is desirable to reduce the adhesive area by roughening the surface of the adhesive portion.

In this case, a polyethylene terephthalate film (hereinafter abbreviated as PET film) is used as the base material 13.

By the way, in the present invention, instead of forming the adhesive portions 12 and 13 with the double-sided adhesive tape as described above, the adhesive may be directly applied to the surface of the tongue piece portion 11.

In the present invention, of course, in facilitating the peeling of the electronic component 3 as described above, the adhesive force between the electronic component 3 and the adhesive portions 12 and 13 may be peeled off during transportation or the like.
It goes without saying that it is designed so that it will not shift.

On the other hand, this electronic component tray 1 with an adhesive portion
In contrast to the case described above, the case where the adhesive parts 12 and 13 are transferred to the electronic component 3 and mounted on a printed wiring board or the like using the adhesive parts 12 and 13 is also preferably used. At this time, in order to prevent occurrence of solder adhesion or insufficient adhesion amount, the lower surface of the lead is prevented from rising from the surface pattern of the printed wiring board by the adhesive portion 12 when the electronic component 3 is mounted on the printed wiring board. There is a need.

Therefore, in this case, the adhesive portion 12,
The thickness of 13 is preferably equal to or less than the height difference between the lower surface of the body 5 and the lower surface of the lead.
In this embodiment, the thickness of the base materials 12a and 13a is 25 μm, and the total thickness of the adhesive portions 12 and 13 is about 50 μm.
The thickness is set to .mu.m to prevent the lead of the electronic component 3 from rising and the intrusion of the adhesive layers 12b and 13b between the lead and the printed wiring board. In this case, the adhesive layer 12
Heat-resistant materials are used for b and 13b.

Then, as shown in FIG. 5, in the electronic component 3, the peeling film on the surface of the adhesive portion 12 is peeled off, and then the lower portion of the body 5 is fitted into the ridge 8 and is pressed downward. Stick to 12.

In this tray 1, since the lower part of the body 5 of the electronic component 3 is fitted in the ridge 8, the electronic component 3 can be accurately positioned, and the electronic component 3 is later removed from the tray 1. When taken out by the electronic component mounter, the air tweezers 15 of the electronic component mounter can be accurately aligned with the electronic component 3 and taken out.

Further, since the electronic component 3 is adhered to the tray 1 by the adhesive portion 12, the electronic component 3 can be reliably provided with a predetermined size even if a shock is given to the tray 1 during transportation or while being carried on a conveyor line. It is possible to prevent the electronic component 3 from being jumped up from the support surface 4 and displaced, and the leads of the electronic component 3 from colliding with or contacting another object to be deformed or broken.

Furthermore, as shown in FIG. 7 from the free state shown in FIG. 6, the tongue tip of the tongue piece 11, that is, the partition 2 on the other side.
When the tongue piece portion 11 is pushed down, the tongue piece portion 11 bends downward, both side portions of the body 5 of the electronic component 3 are received by the both side portions of the tongue piece portion 11 of the body support portion 6, and the tongue piece portion 11 is further bent. Then, as shown in FIG. 8 and FIG.
And the adhesive portion 12 are peeled off in order from the tongue side.

The force for starting the peeling of the tray 1 and the adhesive portion 12 may be a weak force sufficient to peel the minute portion of the tongue side end over the entire width of the adhesive portion 12. Further, after that, the force for advancing the peeling between the adhesive portion 12 and the tray 1 is also sufficient as a weak force.

Therefore, both side portions of the body supporting portion 6 are not strongly pulled down through the body 5 of the electronic component 3, so that the both side portions of the body supporting portion 6 are separated from each other by the tongue piece portion 11.
There is no possibility that the electronic component 3 is bent by the force of peeling it off from the electronic component 3 and the adhesive portion 12 and jumps up from the tray 1 due to the springback action, resulting in displacement, lead deformation, damage, and the like.

In this way, when releasing the adhesion from the tongue portion 11 of the electronic component 3 and the adhesive portion 12, the electronic component 3
Of the electronic component 3 is prevented from jumping out of the tray 1, and the displacement of the electronic component 3 and the deformation and damage of the leads are prevented. Therefore, when the electronic component 3 is taken out from the tray 1 by the electronic component mounter, the electronic component 3 is mounted on the electronic component mounter. The air tweezers 15 can be more accurately aligned and taken out, and the spring back action of the support portion 4 of the tray 1 causes the electronic component 3 to jump up from the tray 1, misalignment, deformation of leads, damage, etc. There is no fear of causing

Furthermore, the body supporting portion 6 is made higher than the peripheral portion thereof so that the lead of the electronic component 3 is lifted from the surface of the supporting portion 4 when the body 5 is received by the body supporting portion 6. When the electronic component 3 is received by the support portion 4, there is no fear that the lead of the electronic component 3 bends and springs back, and the springback action of the lead causes the electronic component 3 to jump up from the tray 1, misalignment or deformation of the lead. There is no risk of damage.

In this way, when releasing the adhesion of the electronic component 3 and the adhesive portion 12 from the tongue portion 11, the electronic component 3
Of the electronic component 3 is prevented from jumping out of the tray 1, and the displacement of the electronic component 3 and the deformation and damage of the leads are prevented. Therefore, when the electronic component 3 is taken out from the tray 1 by the electronic component mounter, the electronic component 3 is mounted on the electronic component mounter. The air tweezers 15 can be more accurately aligned and taken out.

In the present invention, the adhesive portion 12 is the electronic component 3
In the case where the electronic component 3 is transferred to the body 5 of the electronic component 3 when taken out from the tray 1, the adhesive portion 12 can be used as an adhesive portion for temporarily fixing the electronic component 3 to the printed wiring board.

In addition, since the adhesive portion 12 is composed of the adhesive tape on both sides, it becomes easier to manage the thickness, installation area, distribution state, etc. of the adhesive as compared with the case where the adhesive is directly applied. Further, since the electronic component 3 can be temporarily fixed without being thermally cured even after being mounted on the printed wiring board 17, it becomes easy to collect the electronic component from the defective printed wiring board.

However, it does not prevent that the electronic component 3 is mounted on the printed wiring board 17, temporarily fixed and then cured to heat-fix the adhesive layer 12b.

In the above-described embodiment, FIG. 12 to FIG.
As shown in, the tongue portion 11 is divided into U-shapes, but the direction of the division of the tongue portion 11 is 90 °, 180 °.
Alternatively, it is possible to set the directions different from each other by 270 °, and as shown in, for example, FIGS. It is possible.

Further, as shown in FIGS. 15 and 16, it does not prevent extension of one end of each of the grooves 9 and 10 to one side of the body supporting portion 6, and further, for example, as shown in FIG. It is also possible to make the forming direction of the tongue piece 11 different for each support portion 4.

Further, in the above-described embodiment, as shown in the plan view of FIG. 12, the tape-shaped adhesive portion 12 is cut into a predetermined length to form a substantially rectangular shape (here, a square), and The tongue piece 11 is attached so that the edge thereof is substantially parallel to the tongue tip edge of the tongue piece 11. As shown in the plan view of FIG. 13, the cutting line or the adhesive portion 12 is a parallelogram (diamond shape). Alternatively, it may be trapezoidal) and attached to the tongue piece portion 11, or as shown in FIG.
It is also possible to attach the tongue piece 11 to the tongue piece 11 so that the adhesive portion 12 is thin and pointed on the tip side of the tongue piece 11.

In this way, when the adhesive portion 12 is attached to the tongue piece portion 11 so that the tip of the tongue piece portion 11 is thin and sharp, the force required when the tray 1 and the adhesive portion 12 start to separate is further increased. The electronic component 3 can be weakened and spring-backed by the body support portion 6 or the lead of the electronic component 3
It is possible to more surely prevent the positional deviation, the deformation and damage of the lead.

Furthermore, in the above embodiment, the adhesive portion 12
Although the pressure-sensitive adhesive layers 12b on both sides are coated on both sides of the substrate 12a, they may be partially coated at appropriate intervals as shown in FIG. 14, for example. In this case, when the electronic component 3 is adhered to the adhesive portion 12,
Alternatively, it is possible to prevent air from being trapped between the electronic component 3 and the adhesive portion 12 or between the adhesive portion 12 and the printed wiring board when the electronic component 3 taken out from the tray 1 is adhered to the printed wiring board. At the same time, air between the electronic component 3 and the adhesive portion 12 or between the adhesive portion 12 and the printed wiring board is easily released to the surroundings through the space between the adhesive layers 12b, so that the air bubbles are generated in the soldering step. It is possible to prevent the expansion of the electronic component 3 and the occurrence of defects such as solder non-adhesion.

Next, an electronic component mounter for taking out the electronic component 3 from the tray 1 and mounting it on the printed wiring board will be described.

As shown in FIGS. 6 to 11, an electronic component mounter according to an embodiment of the present invention includes air tweezers 15 for adsorbing the body 5 of the electronic component 3 from the upper side, and tack release means 16 supported by the air tweezers 15. With.

The adhesion releasing means 16 is provided with a vertical pin 16a supported by the air tweezers 15 so as to be movable up and down within a predetermined range, and a pressing spring 16b for urging the pin 16a downward.

The pin 16a is located above the partition 2 on the other side of the supporting portion 4 on which the electronic component 3 is placed when the air tweezers 15 is located on the center of the body 5 of the electronic component 3. The lower end of the air tweezers 15 is arranged so as to protrude downward from the lower end of the air tweezers 15 by the spring 16b and its own weight.

According to this electronic component mounter, when the air tweezers 15 are positioned on the center of the body 5 of the electronic component 3 and then lowered straight downward, the pins 16a are first placed on the partition 2 as shown in FIG. Then, the tongue piece 11 is bent as shown in FIG.
After the body 5 is received by the body supporting portion 6, the tongue piece portion 11 is further greatly curved as shown in order in FIGS. 8 and 9, and the adhesive portion 12 and the tray 1 are peeled off in order from the tongue side,
The adhesion between the electronic component 3 and the tongue piece 11 is released.

As described above, when the adhesion between the electronic component 3 and the tongue portion 11 is started, the force for pulling the electronic component 3 downward is extremely weak, and the electronic component 3 and the tongue portion 11 are significantly weakened.
Similarly, the force for pulling the electronic component 3 downward while the release of the adhesiveness between the electronic component 3 and the electronic component 3 is remarkably weak.
The lead of the electronic component 3 is hardly elastically deformed, and when the release of the adhesive is completed, the supporting portion 4 of the tray 1 and the electronic component 3 are prevented from springing back and the electronic component 3 jumps up in a reactive manner. Positional deviation of the electronic component 3 and deformation or breakage of the leads are prevented.

Further, since the displacement of the electronic component 3 is prevented, the air tweezers 15 can accurately align and adsorb the electronic component 3, and the electronic component 3 can be located at a predetermined position on the printed wiring board. Can be accurately aligned and mounted.

Then, as shown in FIG. 10, the air tweezers 15 carry the electronic component 3 above a predetermined position on the printed wiring board 17, and descend at the position directly below to place the electronic component 3 on the printed wiring board. Mounted on 17.
At this time, as shown in FIG. 11, the body 5 of the electronic component 3 is
The body 5 is adhered to the printed wiring board 17 via the adhesive section 12 by pressing the lead with the air tweezers 15 to such an extent that the lead is elastically deformed only slightly.

The electronic component 3 is connected to the printed wiring board 17
When it is adhered to the printed wiring board 17, the lower end of the pin 16a is received by the printed wiring board 17, and the force acting on the printed wiring board 17 is absorbed by the pressing spring 16b being shortened.

As shown in FIGS. 17 to 19, in the electronic component mounter according to another embodiment of the present invention, the tack release means 116 is a pin 116a supported by the air tweezers 15 so as to be able to move up and down, and the air tweezers 15. After the lower end of the pin contacts the body 5 of the electronic component 3, the pin 11
6a, and descending drive means 116b for descending.

The descending drive means 116b is a bracket 116c which is supported by the air tweezers 15 so as to be able to move up and down.
And the tray 1 (or the body 5 of the electronic component 3 placed on the tray 1) supported by the bracket 116c so as to be vertically movable.
The drive member 116d received by the bracket 11 and the bracket 11
A link mechanism 116e that is swingably supported by 6c and that interlockingly connects the pressing member 116a to the drive member 116d.

In the descending drive means 116, as shown in FIG.
As shown in FIG. 7, the lower end of the pin 116a is received by the partition 2 of the tray 1 before the lower end of the air tweezers 15 contacts the body 5 of the electronic component 3, but as shown in FIG. The lower end of the pin 116a is stopped at the position of the upper surface of the partition 2 by the elasticity of the tongue portion 11 until it is received by the partition 2 on one side of the support portion 4. After this, as shown in FIG. 19, air tweezers 1
When 5 is lowered until the lower end thereof is received by the body 5 of the electronic component 3, the link mechanism 116e swings with the driving member 116d as a support, and the pin 116a is lowered at a speed twice the lowering speed of the air tweezers 15. To bend the tongue piece 11.

The other constructions, functions and effects of this embodiment are the same as those of the above-mentioned one embodiment, and therefore their explanations are omitted to avoid duplication.

As shown in FIGS. 20 to 22, in the electronic component mounter according to still another embodiment of the present invention, the adhesion releasing means 216 is supported by the air tweezers 15 and the internal pressure of the suction passage 18 of the air tweezers 15 is increased. Is equipped with a vertical vacuum cylinder 216b for lowering the pin 216a when the pressure is reduced below a certain negative pressure.

The vacuum cylinder 216b has a cylindrical body 216d supported at the lower end of the air tweezers 15 via an adapter 216c, a piston 216e inserted in the cylindrical body 216d so as to be able to move up and down, and a piston 216e urged upward. And a vacuum chamber 216g that is defined below the piston 216e in the cylindrical body 216d and is formed in the adapter 216c via a communication passage 216h and an extension suction passage 216i. 18
Be communicated to. Also, the pin 216a is the adapter 21.
It penetrates 6c and is connected with piston 216e in cylinder 216d.

The extension suction passage 216i is formed so as to penetrate the suction passage 18 of the air tweezers 15 coaxially therewith.

In this electronic component mounter, as shown in FIG.
As shown in 0, the pin 216a is biased upward by the return spring 216f until the air tweezers 15 approaches the upper surface of the body 5 of the electronic component 3. After this, when the lower end of the adapter 216c abuts on the upper surface of the body 5 of the electronic component 3 and the internal pressure of the suction passage 18 of the air tweezers 15 is reduced to a certain negative pressure or less, a vacuum is generated as shown in FIGS. The vacuum in chamber 216g pulls piston 216e and pin 216a down against return spring 216f, causing tongue 11 to bend.

Therefore, in this embodiment, after the electronic component 3 is adsorbed by the air tweezers 15, the tongue portion 11 is curved to release the adhesion between the electronic component 3 and the tongue portion 11, so that the electronic component 3 It is possible to more reliably prevent the displacement of the electronic components, the deformation of the leads, the breakage of the leads, and the like when taking out the.

In this embodiment, when the electronic component 3 is mounted on the printed wiring board 17, the pin 216a and the piston 216e received on the upper surface of the printed wiring board 17 are the adapter 216c, the cylinder 216d and the air tweezers 15. As it descends, it is pushed into the cylindrical body 216d by the printed wiring board 17.

The other constructions, functions and effects of this embodiment are the same as those of the above-mentioned embodiments, and therefore their explanations are omitted to avoid duplication.

Incidentally, in each of the above-mentioned embodiments, the adhesion releasing means 1
Although 6, 116, 216 are supported by the air tweezers 15, it is not essential for the electronic component mounter of the present invention to support the tack release support 16, 116, 216 by the air tweezers 15, and the tack releasing means 16・ 1
The parts 16 and 216 may be supported by a portion of the electronic component mounter other than the air tweezers 15.

Next, a surface mounting method for electronic components will be specifically described with reference to the drawings. In this method, a plurality of electronic components 3 are placed on a tray 1 provided with partitions 2 vertically and horizontally, and the electronic components 3 are mounted on the tray 1 by air tweezers 15.
Is picked up and mounted on the printed wiring board 17.

In each of the supporting portions 4 partitioned by the partition 2 of the tray 1, the electronic parts 3 individually mounted thereon are placed.
The body support portion 6 below the body 5 is set, and a ridge 8 into which the lower portion of the body 5 is fitted is formed around the body support portion 6 as necessary.

If necessary, the body supporting portion 6 is higher than the body supporting portion 6 and the peripheral portion 7 of the ridge 8 by at least the height difference between the lower surface of the body 5 of the electronic component 3 and the lower surface of the lead. I am doing it.

The portion extending from one side of the body supporting portion 6 to the other side of the partition is continuous with the other portion of the tray 1 on one side by the grooves 9 and 10, and is a strip narrower than the body of the electronic component. The tongue portion 11 is formed by the cut strip-shaped portion.

An adhesive portion 12 made of a double-sided adhesive tape is releasably attached to the upper surface of the tongue piece 11 in the body supporting portion 6.

The electronic component 3 is placed on each supporting portion 4 so that the body 5 of the electronic component 3 is fitted in the ridge 8 of each supporting portion 4 of the tray 1, and the electronic component 3 is placed under an appropriate pressure. By pressing the body 5, the body 5 of the electronic component 3 is attached to the adhesive portion 1.
Stick to 2.

The electronic component 3 thus supported on the tray 1 in the component factory is transported to the substrate factory together with the tray 1.
It can be put on the parts mounting line.

While the tray 1 is vibrated from the outside while being transported between the factories or being transported on the component mounting line, the electronic component 3 is adhered to the supporting portion 4 of the tray 1 by the adhesive portion 12, so that The component 3 does not jump up from the support portion 4 of the tray 1 or shift in position.

As shown in FIGS. 6 to 11, the component mounting line is provided with an electronic component mounter including air tweezers 15 and an adhesive releasing means 16, and the electronic component 3 is supported by the adhesive releasing means 16 in the supporting portion 4 thereof. Is removed from the tray 1, is taken out from the tray 1 by being sucked by the air tweezers 15, is carried above the predetermined position of the printed wiring board 17, and is then lowered to that position. By pressing 5 onto the printed wiring board 17 with an appropriate pressure, the electronic component 3 is adhered to a predetermined position on the printed wiring board 17 by the adhesive layer 14.

As shown in FIG. 6 to FIG. 9, the electronic components 3 from the tray 1 are lowered by pushing down the tongue tip of the tongue piece 11 by lowering the pin 16a of the adhesion releasing means 16 together with the air tweezers 15. The tongue side is peeled off in order.

The force for starting the peeling of the adhesive portion 12 from the tray 1 may be a weak force sufficient to peel the minute portion of the tongue side end over the entire width of the adhesive portion 12. Further, after that, the force for advancing the peeling between the adhesive portion 12 and the tray 1 is also sufficient as a weak force.

Therefore, since the two sides of the body supporting portion 6 are not strongly pulled down through the body 5 of the electronic component 3, the both sides of the body supporting portion 6 remove the tongue piece 11 from the electronic component 3. There is no possibility that the electronic component 3 jumps out of the tray 1 due to the springback action of the support portion 4 of the tray 1 due to the force of peeling and bending back, and there is no risk of displacement, lead deformation, or damage.

Furthermore, the body supporting portion 6 is made higher than the peripheral portion thereof so that the leads of the electronic component 3 are lifted from the supporting portion 4 when the body 5 is received by the body supporting portion 6. When the component 3 is received by the support portion 4, there is no possibility that the lead of the electronic component 3 bends and springs back, and the electronic component 3 jumps up from the tray 1 due to the springback action of the lead, resulting in misalignment, deformation of the lead, damage, etc. There is no fear of causing

In this way, when releasing the adhesive from the tongue piece 11 of the electronic component 3 and the adhesive portion 12, the electronic component 3 is prevented from jumping up from the tray 1, and the position of the electronic component 3 is displaced and the leads are deformed or damaged. Since the electronic parts 3 are taken out from the tray 1 by the electronic parts mounter, the air tweezers 15 of the electronic parts mounter can be more accurately aligned with the electronic parts 3 and taken out. It is possible to further improve the positional accuracy of the electronic component 3 when the electronic component 3 is mounted on the printed wiring board 17.

[0145]

As described above, the tray for electronic parts of the present invention has the above-described structure, and partitions are provided in the vertical and horizontal directions to divide a plurality of supporting parts on which electronic parts are individually placed. In the tray for electronic parts provided, a part narrower than the body of the electronic part from one side part of the central part of each supporting part located under the electronic part to the other partition Tongue part is formed by cutting it from the tongue part, and an adhesive part is formed on this tongue part, and the electronic part is temporarily fixed to the tray by this adhesive part, so it is being transported from the electronic parts factory to the electronic parts mounting line. It is possible to prevent the electronic components from jumping up from the tray due to the vibration applied to the tray on the electronic component mounting line, and to prevent the electronic components from being displaced due to the jumping up, and to adhere the electronic components to a predetermined position. Than it is.

Further, when the electronic component is peeled from the supporting portion of the tray in order to take it out from the tray of the electronic component, the tongue side of the tongue piece is pushed down to bend or bend the tongue portion, so that the adhesive action of the adhesive portion is achieved. Since they are released in order from the tongue side, the adhesion can be released with a force that does not elastically deform the tray or the leads of the electronic component. Therefore, when the adhesive is released, the leads of the tray and the electronic component are elastically restored and the electronic component does not lift up from the tray, and the adhesive can be released while the electronic component is supported on the tray. It is possible to prevent misalignment of the lead, deformation of the lead, and damage.

In the tray for electronic components with an adhesive portion of the present invention, particularly when the portion of the central portion of each supporting portion located below the body of the electronic component is formed higher than the surrounding portion by a certain amount or more, It is possible to prevent the lead of the electronic component from being pressed or contacted with the support portion when the adhesive action of the adhesive portion is released, and it is possible to prevent the lead from being elastically deformed. Therefore,
When the adhesive action of the adhesive portion is released, it is possible to reliably prevent the electronic components from jumping up from the tray due to the elastic restoring force of the leads, and it is possible to reliably prevent the displacement of the electronic components and the deformation or breakage of the leads. ..

Further, in the tray for electronic parts with an adhesive part of the present invention, a ridge in which the lower part of the body is fitted around the part located below the body of the electronic part, especially in the central part of each support part. If the electronic parts are provided, the electronic parts can be surely positioned and placed on each support part, and the positional deviation of the electronic parts due to the vibration during the transportation from the factory to the electronic part mounting line or on the transfer line, the lead The deformation and breakage can be prevented more reliably.

In the tray for electronic parts with an adhesive portion of the present invention, the adhesive portion may be composed of an adhesive agent directly coated on the tongue portion, but a base material and an adhesive layer attached to both surfaces thereof are used. In the case of the double-sided adhesive tape consisting of, the adhesive part can be accurately adhered to the support part of the tray in a predetermined distribution state, so that electronic parts jump up from the tray,
There is no risk of misalignment, lead deformation, or damage.

In this way, when releasing the adhesive from the tongue piece of the electronic component, the electronic component is prevented from jumping up from the tray, and the displacement of the electronic component, the deformation of the leads, the damage, etc. are prevented. When you take out the electronic parts from the tray with the electronic parts mounter, you can more accurately align the air tweezers of the electronic parts mounter with the electronic parts and take them out. After that, the electronic parts when you mount the electronic parts on the printed wiring board It is extremely useful because it is easy to further improve the positional accuracy of the.

Further, in the tray of the present invention, when the adhesive portion adheres with a weaker adhesive force than the adhesive force of the body of the electronic component to the tray, or the base of the adhesive portion of the double-sided adhesive tape on the electronic component side. When the adhesive layer adheres to the body of the electronic component with an adhesive force that is weaker than the adhesive force to the base material, the effect that the electronic component can be easily peeled off and temporary fixing to the printed wiring board can be achieved extremely easily. To have.

On the other hand, in the tray of the present invention, in the case where the adhesive portion adheres with a stronger adhesive force than the adhesive force of the body of the electronic component to the tray, or the base of the adhesive portion of the double-sided adhesive tape on the electronic component side. When the adhesive layer adheres to the body of the electronic component with a stronger adhesive force than the adhesive force to the base material, when releasing the adhesive action of the adhesive part, the adhesive layer on the electronic part side of the adhesive part or the base material Since it can be transferred to an electronic component and used for temporary fixing to a printed wiring board by utilizing this adhesive layer, there is an effect that the work can be done extremely easily. In this case, it is necessary to use a heat-resistant adhesive section (including the base material).

In this case, by setting the thickness of the adhesive portion or the thickness of the adhesive on the electronic component side of the base material to a certain thickness or less, the leads of the electronic component temporarily fixed to the printed wiring board are printed wiring. It is possible to prevent floating from the board and penetration of the adhesive of the adhesive portion between the lead and the printed wiring board, and it is possible to prevent occurrence of solder sticking due to floating of the lead and interposition of the adhesive.

Furthermore, in the tray for electronic parts with an adhesive portion of the present invention, particularly when the adhesive portion is provided on the tongue tip side of the tongue portion in a small amount or in a thin shape, the adhesive action of the adhesive portion is released with an extremely weak force. It is possible to more reliably prevent the displacement of the electronic component, the deformation of the lead, and the breakage of the lead when releasing the adhesion.

According to the electronic component mounter of the present invention, the tongue tip of the tongue piece of the tray of the present invention can be pushed down by the adhesive release means to bend or bend the tongue piece, whereby the adhesive action of the adhesive section can be achieved. It can be released in order from the side. Therefore, in order to release the adhesive action of the adhesive portion, it is possible to prevent a strong force such as the elastic deformation of the leads of the tray or the electronic component from acting, and the leads of the tray or the electronic component are elastically restored by the reaction to restore the electronic components. Parts are prevented from jumping out of the tray. As a result, there is an effect that it is possible to prevent the displacement of the electronic component, the deformation of the lead, and the breakage of the lead when the adhesive action of the adhesive portion is released.

In the electronic component mounter of the present invention, particularly when the adhesion releasing means is supported by the air tweezers, the driving device for moving the air tweezers can be used also as the driving device for the adhesion releasing means, and the structure can be simplified. This is advantageous because it is easy to control the operation timing of the air tweezers and the tack release means by their mechanical positional relationship.

Further, in the electronic component mounter of the present invention, particularly, the adhesion releasing means lowers the pressing member supported by the air tweezers so that it can be moved up and down, and the lower end of the pressing member is positioned lower than the lower end of the air tweezers. In the case of including the descending drive means, the energy source for driving the pressing member is not consumed, the configuration is simple, the cost can be easily implemented, and the existing electronic component mounter can be implemented. Can be easily and inexpensively modified.

Further, in the electronic component mounter of the present invention, the adhesion releasing means is mounted on the tray or the tray, which is supported by the pressing member supported by the air tweezers so as to be able to move up and down and is supported by the air tweezers so as to be able to move up and down. When the lowering drive device is provided with a drive member that is received by the body of the electronic component and a link mechanism that interlocks and connects the pressing member to the drive member, an energy source may be consumed to drive the pressing member. In addition, the structure is simple, the cost can be easily implemented, and the existing electronic component mounter can be easily and inexpensively modified.

Furthermore, in the electronic component mounter of the present invention, the adhesion releasing means is supported by the pressing member which is supported by the air tweezers so as to be able to move up and down, and by the air tweezers, and the internal pressure of the suction path of the air tweezers is constant. When configured with a descending drive means including a vacuum cylinder on the vertical axis that lowers the pressing member when the pressure is reduced to below the pressure,
After the electronic parts are adsorbed by the air tweezers and held in the positioning state, the adhesion releasing means is activated to release the adhesion between the electronic parts and the tongue portion. The positional deviation can be reliably prevented, and the electronic component cannot be taken out due to the positional deviation, and the leads can be securely prevented from being deformed or damaged.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component tray of the present invention.

FIG. 2 is a cross-sectional view of a main part of the tray for electronic components with an adhesive portion of the present invention.

FIG. 3 is a schematic view showing a cross section of an adhesive portion suitably used in the present invention.

FIG. 4 is a schematic diagram showing a cross section of another example of an adhesive section that is preferably used in the present invention.

FIG. 5 is a main part perspective view showing a main part of the tray for electronic components with an adhesive part of the present invention.

FIG. 6 is a schematic diagram showing a process of taking out an electronic component from the electronic component tray of the present invention with the electronic component mounter of the present invention, in which a pin of the electronic component mounter is in contact with a tongue tip portion of a tongue piece portion. Is.

FIG. 7 shows a process of taking out an electronic component from the electronic component tray of the present invention using the electronic component mounter of the present invention, in which the pin of the electronic component mounter presses the tongue tip of the tongue piece to start peeling of the electronic component. It is a schematic diagram which shows.

FIG. 8 shows a process of taking out an electronic component from the electronic component tray of the present invention using the electronic component mounter of the present invention, in which the pin of the electronic component mounter presses the tip of the tongue portion of the tongue portion to separate the electronic component. It is a schematic diagram which shows the following.

FIG. 9 shows an electronic component taking-out step from the electronic component tray of the present invention with the electronic component mounter of the present invention, in which the pin of the electronic component mounter presses the tip of the tongue portion of the tongue to complete the peeling of the electronic component. It is a schematic diagram which shows.

FIG. 10 is a schematic view showing a step of mounting an electronic component on a printed wiring board after taking out the electronic component from the electronic component tray of the present invention with the electronic component mounter of the present invention.

FIG. 11 is a schematic view showing a state in which the electronic component is taken out from the electronic component tray of the present invention by the electronic component mounter of the present invention and then the electronic component is mounted on a printed wiring board.

FIG. 12 is a plan view of relevant parts showing an embodiment of the tray for electronic components having an adhesive portion of the present invention.

FIG. 13 is a main part plan view showing another embodiment of the electronic component tray with the adhesive portion of the present invention.

FIG. 14 is a plan view of an essential part showing still another embodiment of the tray for electronic parts with an adhesive part of the present invention.

FIG. 15 is a plan view of an essential part showing still another embodiment of the electronic component tray with the adhesive portion of the present invention.

FIG. 16 is a plan view of an essential part showing still another embodiment of the tray for electronic parts with an adhesive portion of the present invention.

FIG. 17 shows another electronic component mounter of the present invention showing an electronic component take-out step from the electronic component tray with an adhesive portion of the present invention, in which the pin of the electronic component mounter presses the tip of the tongue portion of the tongue piece to remove the electronic component. It is a schematic diagram which shows the peeling start.

FIG. 18 shows another electronic component mounter of the present invention showing an electronic component removing step from the tray for electronic components with an adhesive portion of the present invention, in which a pin of the electronic component mounter presses the tip of the tongue portion of the tongue piece to remove the electronic component. It is a schematic diagram which shows the peeling process.

FIG. 19 shows another electronic component mounter of the present invention showing an electronic component taking-out step from the electronic component tray with an adhesive portion of the present invention, in which a pin of the electronic component mounter presses the tip of the tongue portion of the tongue piece to remove the electronic component. It is a schematic diagram which shows the end of peeling.

FIG. 20 is a view showing still another electronic component mounter of the present invention showing an electronic component removing step from the electronic component tray with an adhesive portion of the present invention, in which the pins of the electronic component mounter are about to press the tongue tip portion of the tongue piece portion. It is a schematic diagram which shows.

FIG. 21 is a view showing a process of taking out an electronic component from the tray for electronic components having an adhesive portion of the present invention by still another electronic component mounter of the present invention, showing a state in which a pin of the electronic component mounter abuts a tongue tip portion of a tongue piece portion. It is a schematic diagram which shows.

FIG. 22 shows another electronic component mounter of the present invention showing an electronic component removing process from the tray for electronic components with an adhesive portion of the present invention, in which the pin of the electronic component mounter presses the tip of the tongue portion of the tongue piece to remove the electronic component. It is a schematic diagram which shows the end of peeling.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tray 2 Partition 3 Electronic component 4 Support part 5 Body 6 Body support part 7 Surrounding part of body support part 8 Convex strip 9 Groove 10 Groove 11 Tongue part 12 Adhesive part 12a Base material 12b Adhesive layer 15 Air tweezers 16 Adhesion release Means 16a Pin 16b Pressing spring 17 Printed circuit board 18 Suction path 116 Adhesion release means 116a Pin 116b Down drive means 116d Drive member 116e Link mechanism 216 Adhesion release means 216a Pin 216b Vacuum cylinder

Claims (20)

[Claims] 1. A tray for electronic parts, in which a plurality of supporting parts on which electronic parts are individually mounted are provided by partitioning vertically and horizontally, and in a tray for electronic parts, the central part of each supporting part is located below the electronic part. A tray for electronic parts, characterized in that a tongue part is formed by cutting a part narrower than a body of an electronic part extending from one side part to a partition part on the other side from the other part to form a tongue piece part. 2. The electronic component tray according to claim 1, wherein a portion of the central portion of each support portion, which is located on the lower side of the body of the electronic component, is formed higher than a peripheral portion thereof by a certain amount or more. 3. The electronic device according to claim 1, further comprising a ridge in which a lower portion of the body of the electronic component is fitted in a central portion of each support portion and a portion located below the body of the electronic component. Parts tray. 4. An electronic component with an adhesive portion, wherein an adhesive portion for adhering a body of the electronic component is formed on a tongue portion of the electronic component tray according to claim 1. Tray. 5. The tray for electronic parts with an adhesive portion according to claim 4, wherein the adhesive portion is formed by directly applying an adhesive on the tongue piece portion. 6. The tray for electronic parts with an adhesive part according to claim 4, wherein the adhesive part is composed of a double-sided adhesive tape comprising a base material and an adhesive layer laminated on both surfaces thereof. 7. The tray for electronic components with an adhesive portion according to claim 6, wherein the adhesive portion adheres to the body of the electronic component with an adhesive force weaker than the adhesive force to the tray. 8. The tray for electronic parts with an adhesive part according to claim 4, wherein the adhesive part is provided with a certain thickness or less. 9. The double-sided adhesive tape according to claim 6, wherein the adhesive layer on the electronic component side adheres to the body of the electronic component with an adhesive force weaker than the adhesive force to the substrate. Electronic component tray. 10. The tray for electronic components with an adhesive portion according to claim 9, wherein the adhesive layer on the electronic component side is provided with a certain thickness or less in the double-sided adhesive tape. 11. The tray for electronic parts with an adhesive part according to claim 4, wherein the adhesive part is formed in a tapered shape at the tongue portion. 12. The tray for electronic parts with an adhesive part according to claim 11, wherein the adhesive part is formed in a circular shape, an elliptical shape or a rhombus shape. 13. The tray for electronic parts with an adhesive part according to claim 4, wherein a release material is partially formed on the upper surface of the adhesive part. 14. The tray for electronic parts according to claim 4, wherein the upper surface of the adhesive portion is formed into a rough surface. 15. An electronic component mounter comprising air tweezers for adsorbing and picking up electronic components from an electronic component tray provided by partitioning a plurality of supporting portions on which electronic components are individually placed by partitioning vertically and horizontally. , The tongue piece is divided from the other part to a part narrower than the body of the electronic part that extends from one side part of the part located under the electronic part in the central part of each supporting part to the partition on the other side. Formed,
An electronic component mounter, comprising: an adhesive releasing means for pushing down a tongue tip portion of a tongue piece portion continuous to the other portion of the support portion at the one side portion lower than the other portion of the tray. 16. The electronic component mounter according to claim 15, wherein the adhesive release means is supported by air tweezers. 17. The adhesion releasing means comprises a pressing member supported by the air tweezers so as to be able to move up and down, and descending drive means for lowering the pressing member until the lower end of the pressing member is positioned lower than the lower end of the air tweezers. 15 or 1
The electronic component mounter according to 6. 18. The electronic component mounter according to claim 17, wherein the lowering drive means is constituted by a pressing spring for urging the pressing member downwardly. 19. A drive member, which is supported by air tweezers so as to be able to move up and down, and which is received by a tray or a body of an electronic component placed on it, and a link mechanism for interlockingly connecting a pressing member to the drive member. The electronic component mounter according to claim 17, further comprising: 20. The lowering drive means comprises a vacuum cylinder of a vertical axis, which is supported by the air tweezers and lowers the pressing member when the internal pressure of the suction passage of the air tweezers is reduced below a certain load. Electronic component mounter.