CN112967956A - Chip packaging structure, chip transferring method and display device - Google Patents
Chip packaging structure, chip transferring method and display device Download PDFInfo
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- CN112967956A CN112967956A CN202110158667.4A CN202110158667A CN112967956A CN 112967956 A CN112967956 A CN 112967956A CN 202110158667 A CN202110158667 A CN 202110158667A CN 112967956 A CN112967956 A CN 112967956A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Abstract
The invention provides a chip packaging structure, a chip transferring method and a display device, wherein the chip packaging structure comprises a carrier tape main body and a plurality of chips arranged at preset intervals; an adhesive layer is arranged on the first surface of the carrier tape main body, one side of the chip comprises an electrode, and the side opposite to the electrode is adhered to the carrier tape main body through the adhesive layer; the chip transfer method comprises the steps that a target carrier plate is arranged below a chip packaging structure, and one side, provided with a chip, of the chip packaging structure is placed towards the target carrier plate; aligning a chip to be transferred to a target area on a target carrier plate; applying pressure close to the target carrier plate to the chip packaging structure to deform the carrier tape main body until the chip to be transferred contacts the target carrier plate; and enabling the chip to fall off from the carrier tape main body so as to transfer the chip to be transferred to the target carrier board. By changing the packaging mode of the chip, the chip can be efficiently transferred in certain processes.
Description
Technical Field
The invention relates to the field of display devices, in particular to a chip packaging structure, a chip transferring method and a display device.
Background
The traditional LED (Light Emitting Diode) chip transfer is limited by the caliber of a suction nozzle, the LED chip with the size smaller than 150 mu m is difficult to transfer, and the traditional LED chip transfer method has the flow of chip film expansion, the LED chip is pushed away from the chip film by an equipment ejector pin, the LED chip is sucked by the equipment suction nozzle, and the LED chip is transferred by an equipment swing arm, so that the method has the problems of multiple transfer steps, low efficiency, high requirement on accessories, serious accessory loss, uneven film expansion of the LED chip, low LED chip transfer yield, hidden damage to the LED chip and the like; in the current bulk transfer technology, chips also need to be arranged in advance, that is, before bulk transfer, chips need to be transferred to a transfer carrier plate step by using a single chip as a unit through the LED chip transfer method, and a single chip transfer process is still performed before bulk transfer, which is not efficient, and cannot avoid the LED chip transfer method flow and the defects existing in the flow, and is difficult to implement.
Disclosure of Invention
The invention provides a chip packaging structure, a chip transfer method and a display device, and mainly solves the technical problems that: the traditional chip is carried on a blue film, and manual film expansion is needed in the chip transfer process, so that the efficiency is low.
In order to solve the technical problem, the invention provides a chip packaging structure, which comprises a carrier tape main body and a plurality of chips arranged at preset intervals; an adhesive layer is arranged on the first surface of the carrier tape main body, one side of the chip comprises an electrode, and one side opposite to the electrode is adhered to the carrier tape main body through the adhesive layer.
Optionally, the chip packaging structure is provided with one side of the chip further comprises a protective film, and the protective film at least covers the chip on the chip packaging structure.
Optionally, the adhesive layer comprises a pyrolytic glue or a pyrolytic glue;
if the adhesion layer comprises the photolysis adhesive, the carrier tape main body is made of a light-transmitting material;
if the adhesive layer comprises a thermal release glue, the carrier tape body is not thermally insulated.
In another aspect, the present invention further provides a chip transfer method, including:
a target carrier plate is arranged below the chip packaging structure, one side of the chip packaging structure, which is provided with the chip, is placed towards the target carrier plate, and the chip packaging structure is the chip packaging structure;
aligning a chip to be transferred to a target area on the target carrier plate;
applying pressure close to the target carrier plate to the chip packaging structure to enable the carrier tape main body to deform until the chip to be transferred contacts the target carrier plate;
and enabling the chip to fall off from the carrier tape main body so as to transfer the chip to be transferred to the target carrier board.
Optionally, a protective film is disposed on the chip packaging structure, and the applying a pressure close to the target carrier to the chip packaging structure deforms the carrier tape main body until the chip to be transferred contacts the target carrier, further includes:
and removing the protective film.
Optionally, applying a pressure to the chip packaging structure to approach the target carrier to deform the carrier tape body until the chip to be transferred contacts the target carrier includes:
and pressing down the carrier tape main body through a push rod, wherein the area pressed down by the push rod at least comprises an area corresponding to the chip to be transferred on the carrier tape main body.
Optionally, the adhesive layer of the chip packaging structure includes a pyrolytic glue or a pyrolytic glue, and the bottom of the push rod can be heated and/or can emit light;
the detaching the chip from the chip packaging structure comprises:
and heating the bottom of the push rod to a target temperature or enabling the bottom of the push rod to emit target light and transmit light to irradiate the adhesive layer through the carrier tape main body so as to debond the adhesive layer.
Optionally, the chips on the chip packaging structure are arranged along the length direction of the chip packaging structure, and the width of the push rod in the length direction of the carrier tape main body is not greater than the distance between two adjacent chips on the chip packaging structure.
Optionally, after the chip to be transferred is transferred onto the target carrier, the method further includes:
moving the chip packaging structure to align a next batch of chips to be transferred on the chip packaging structure with a corresponding target area on the target carrier plate;
and transferring the next batch of chips to be transferred to the target carrier plate.
In another aspect, the present invention further provides a display device, which includes a circuit board and a chip, wherein the chip is transferred onto the circuit board by the chip transfer method as described above.
Advantageous effects
The invention relates to a chip packaging structure, a chip transferring method and a display device, wherein the chip packaging structure comprises a carrier tape main body and a plurality of chips; the first face of carrier band main part is provided with the adhesion layer, and one side of chip includes the electrode, and the adhesion layer adhesion is passed through to one side relative with the electrode on the carrier band main part, when using this chip packaging structure to carry out the chip and shift, need not to carry out artifical membrane that expands, through the change to chip packaging mode for can shift the chip at certain in-process high-efficiently. According to the chip transfer method, the chip packaging structure is placed above the target carrier plate in a mode that the chip faces the target carrier plate, the chip is directly pressed to the target carrier plate for transfer, a transfer head is not needed for picking up and swinging arm transfer of the chip, the efficiency is improved in a multiplied mode, the yield is high, operation such as film expanding and film replacing is not needed in the transfer process due to the chip packaging structure, and the chip can be transferred efficiently. The chips of the display device are transferred by the chip transfer method, the manufacturing process is efficient, and the yield is high.
Drawings
Fig. 1 is a first structural schematic diagram of a chip packaging structure according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a chip package structure according to a first embodiment of the present invention;
fig. 3 is a first schematic structural diagram of a chip packaging structure provided with a protective film according to a first embodiment of the present invention;
fig. 4 is a second schematic structural view illustrating a chip packaging structure provided with a protective film according to a first embodiment of the present invention;
fig. 5 is a third schematic structural view illustrating a chip packaging structure provided with a protective film according to a first embodiment of the present invention;
fig. 6 is a schematic flowchart of a conventional chip transfer method according to an embodiment of the present invention;
fig. 7a is a first schematic diagram illustrating a transfer process of a conventional chip transfer method according to a first embodiment of the present invention;
fig. 7b is a schematic diagram illustrating a transfer process of a conventional chip transfer method according to a first embodiment of the present invention;
fig. 7c is a schematic diagram illustrating a third transferring process of a conventional chip transferring method according to a first embodiment of the present invention;
fig. 8 is a schematic flowchart of a chip transfer method according to an embodiment of the present invention;
fig. 9 is a schematic view illustrating a target carrier disposed under a chip package structure according to a first embodiment of the present invention;
FIG. 10 is a schematic diagram of a circuit board with solder pads and solder according to an embodiment of the present invention;
fig. 11 is a schematic diagram illustrating a carrier tape body being deformed by applying a pressure to a chip package structure approaching a target carrier according to a first embodiment of the present invention;
FIG. 12 is a schematic view of a chip package structure pressed down by a push rod according to an embodiment of the present invention;
fig. 13 is a schematic view illustrating the push rod being lifted after the chip is detached from the carrier tape main body according to the first embodiment of the present invention;
FIG. 14 is a schematic view of a putter with a putter head at the bottom of the putter in accordance with one embodiment of the present invention;
FIG. 15 is a schematic diagram of a chip spacing and a width of a push rod according to an embodiment of the present invention;
wherein, 1 is a carrier tape main body; 2 is a chip; 21 is an electrode; 3 is an adhesive layer; 4 is a protective film; 5 is a separator; 6 is a target carrier plate; 61 is a bonding pad; 62 is solder; 70 is a blue film; 71 is a thimble; 72 is a suction nozzle; 8 is a push rod; and 81 is a push rod head.
Detailed Description
In order that the contents of the present invention will be more readily understood, the present invention will now be described in further detail with reference to the accompanying drawings by way of specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The first embodiment is as follows:
in order to solve the problems that the traditional chip is borne on a blue film, the manual film expanding is needed in the chip transferring process, the efficiency is low and the like, the embodiment provides a chip packaging structure. Referring to fig. 1, the chip package structure includes a carrier tape body 1 and a chip 2; the material of the carrier tape body 1 may include, but is not limited to, silica gel, plastic, etc., and in some scenarios, an antistatic material may be selected for better protecting the chip 2. Be provided with adhesion layer 3 on the one side of carrier band main part 1, this layer adhesion layer 3's effect is adhesion chip 2, sets up chip 2 to carrier band main part 1 through adhesion layer 3 in this embodiment, and it is more convenient to compare in the tradition through form on carrier band main part 1 with chip 2 size, shape assorted recess with the mode of holding chip 2, and easily preparation. Meanwhile, because the adhesion layer 3 adheres to the chip 2, the chip 2 of the chip packaging structure of the embodiment is not easy to fall off from the carrier tape main body 1, and can be adapted to more use scenes.
In this embodiment, the chip includes electrodes, the electrodes of the chip are disposed on the same side, and the side opposite to the electrodes is adhered to the carrier tape main body through the adhesion layer, so as to be disposed on the carrier tape main body. The chip of the present embodiment includes, but is not limited to, an LED chip or other chips. Taking the LED chip as an example, two poles of the LED chip are far away from the carrier tape body, and the side of the LED chip far away from the electrodes is usually a substrate, the substrate of the LED chip is adhered to the carrier tape body. As an example, referring to fig. 2, when the chip 2 is disposed on the carrier tape body 1, two electrodes 21 thereof are arranged along the width direction of the carrier tape body 1. In practical application, the placing direction of the chip on the carrier tape main body can be changed according to requirements.
In the carrier tape main body of this embodiment, a plurality of chips are provided at predetermined intervals. It can be understood that the chip packaging structure of the present embodiment can store the chip, and in some scenarios, the chip packaging structure can also be beneficial to provide the chip and transfer the chip to the target carrier.
In some embodiments, referring to fig. 3, in order to protect the chip 2 on the carrier tape body 1 and provide better storage effect, a protective film 4 is further included on a side of the chip packaging structure where the chip 2 is disposed, and the protective film 4 at least covers the chip 2 on the chip packaging structure. The protective film can be an electrostatic film and covers the chip in an electrostatic adsorption mode. Of course, in order to avoid as much as possible the influence of static electricity that may be given to the chip under some conditions, a protective film may be provided using an adhesive layer. Referring to fig. 4, the protective film 4 may be in contact with the adhesive layer 3 at the intervals between the chips 2, and stably disposed on the chip packaging structure through the adhesive layer 3 to protect the chips 2. Referring to fig. 5, a chip packaging structure is further illustrated, in which there are spacers 5 between the arranged chips 2, the spacers 5 may be a structure in which the carrier tape main body 1 is integrated, the end surfaces of the spacers 5 are coated with an adhesive material, the protective film 4 is in contact with the spacers 5, and the chips 2 are covered with the adhesive material on the end surfaces of the spacers 5.
In some embodiments, in order to facilitate the removal of the chip or the detachment of the chip from the carrier tape body, the adhesive layer includes a photoresist or a pyrolytic glue, and the photoresist is weakened or loses its adhesiveness when irradiated with a target light or when the pyrolytic glue reaches a certain temperature. If the adhesive layer comprises the photoresist, the carrier tape main body is made of a light-transmitting material, and when the adhesive layer needs to lose viscosity, target light rays are used for irradiating the adhesive layer adhered with the chip through the carrier tape main body to lose the viscosity. If the adhesive layer includes a thermal release adhesive, the carrier tape body is not thermally insulated, and the adhesive layer in this portion loses its adhesiveness by heating the carrier tape body at the position where the chip is adhered.
In some embodiments, the carrier tape body may further include a transfer hole for transferring, and the movement of the chip packaging structure is achieved through the transfer hole. In some specific implementation processes, the positions of the conveying holes can be beside each chip, the interval between the two conveying holes is consistent with the interval between the chips, and the positions of the chips are accurately controlled by controlling the positions of the conveying holes. Of course, the transfer may be achieved by rotation of the roller without using the transfer hole.
The embodiment also provides a chip transfer method, and the chip transfer method can use the chip packaging structure to carry out chip transfer. In order to better understand the chip transferring method of the present embodiment, a simple description will be made below on a conventional chip transferring method, please refer to fig. 6, fig. 7a, fig. 7b and fig. 7c, in the conventional chip transferring method, a chip is disposed on a chip film (usually a blue film), and is disposed on a device by way of film expanding and manual loading, and the conventional chip transferring method includes:
s101, manually loading the incoming material chip expansion chip film to equipment;
s102, the ejector pin device adsorbs the chip film, the ejector pin device pushes up the ejector pin, and the chip film is punctured to enable the chip to fall off the chip film;
referring to fig. 7a, in the conventional chip transfer method, the electrodes of the chip 2 are disposed on the surface of the chip film 70, and the side of the chip 2 on which the electrodes are disposed is lifted by the ejector pins 71.
S103, driving a suction nozzle device to descend to the surface of the chip by the swing arm, and sucking the chip by the suction nozzle through air suction;
referring again to fig. 7a, the suction nozzle 72 is specifically contacted to the surface of the substrate side of the chip 2 to suck the chip 2.
S104, driving a suction nozzle to rise by a swing arm, and sucking the chip to move by the suction nozzle;
referring to fig. 7b, the chip 2 is carried off the chip film 70 by the suction nozzle 72.
S105, swinging the swing arm to drive the chip to the target carrier plate, descending the swing arm to press the chip to the target carrier plate;
s106, stopping air suction of the suction nozzle, lifting the swing arm, and leaving the chip separated from the suction nozzle on the target carrier plate.
Referring to fig. 7c, the suction nozzle 72 stops sucking after moving the chip 2 to the position corresponding to the target carrier 6, the chip 2 is separated from the suction nozzle 72, and then the swing arm (not shown) is lifted, and the suction nozzle 72 can continue sucking other chips.
It can be understood that the conventional chip transfer method requires the expansion of the chip film and frequent replacement, and the swing arm and the suction nozzle are inefficient.
Referring to fig. 8, the chip transferring method of the present embodiment includes:
s201, arranging a target carrier plate below a chip packaging structure, wherein one side of the chip packaging structure, which is provided with a chip, is placed towards the target carrier plate;
it should be noted that the chip packaging structure is the above chip packaging structure of the present embodiment. The target carrier may be a circuit board, or may be another carrier temporarily carrying chips. As shown in fig. 9, the target carrier 6 can be placed horizontally, and in practical applications, it can be placed on a table top, the chip package structure is disposed above the target carrier 6, and the chip 2 faces downward. It should be noted that the up and down directions referred to in the present embodiment, i.e., the directions shown in the drawings, are the directions of gravity.
S202, aligning a chip to be transferred to a target area on a target carrier plate;
the target area referred to here is the area where the chip to be transferred needs to be placed on the target carrier. The chip to be transferred can be aligned with the target area by moving the chip packaging structure and/or the target carrier, i.e. both can be in the same vertical line.
For example, in a specific example, referring to fig. 10, the target carrier 6 is a circuit board on which pads 61 for soldering the chip are disposed, so that two electrodes 21 of the chip are aligned with positive and negative pads on the circuit board, respectively. It will be appreciated that the circuit board may be provided with solder 62 on the pads 61 in advance, and that the chip 2 may be transferred to the circuit board 6 and then soldered or the like in a subsequent production step. The welding can be carried out once after all the chips on the circuit board are placed, and the welding can also be carried out in batches.
S203, applying pressure close to the target carrier plate to the chip packaging structure to enable the carrier belt main body to deform until the chip to be transferred contacts the target carrier plate;
it can be understood that the carrier tape body used in the chip packaging structure of the present embodiment is flexible to some extent, and can deform to some extent without breaking. As shown in fig. 11, a downward external force is applied to the area where the chip 2 is disposed on the carrier tape body 1, so that the carrier tape body 1 deforms and drives the chip 2 to be transferred to approach the target carrier board 6. It can be seen that, in the chip transfer method of this embodiment, the distance between the target carrier and the chip should not be set too far, and it should be considered that the chip can be in contact with the target carrier within the controllable deformation range of the carrier tape main body, and in practical application, the appropriate set distance between the target carrier and the chip can be tested through practical tests.
As shown in fig. 12, in some embodiments, the step S103 may be specifically implemented by a push rod 8, the push rod 8 is disposed above the chip packaging structure, and the push rod 8 may be controlled to move up and down, or may also move in a horizontal direction to adjust the position for better alignment or to adapt to more transfer scenarios. The push rod is positioned above the chip to be transferred, the push rod can be fixedly arranged in the horizontal direction, the chip packaging structure and the target carrier plate move to the position corresponding to the lower part of the push rod, or the position of the push rod can be adjusted by the push rod. As shown in fig. 12, the push rod 8 is controlled to move downward, the push rod 8 contacts a surface of the carrier tape main body 1 where no chip 2 is disposed, the push rod 8 presses the carrier tape main body 1 downward to deform the carrier tape main body toward the target carrier board 6, and the chip 2 to be transferred is also driven to move toward the target carrier board 6 until contacting the target carrier board 6.
The pushrod may be of a variety of shapes and the base may be flat, rounded, or sharp, including but not limited to. The bottom of the push rod in this embodiment is the side of the push rod contacting with the chip packaging structure. It is understood that, in this embodiment, the chips pushed by the push rod can be transferred onto the target carrier, when the push rod pushes only a single chip, one chip can be transferred onto the target carrier at a time, and when the push rod can cover multiple chips, for example, the bottom of the push rod is planar and has a larger area or is provided with multiple push rods, at least two chips can be pressed down to contact with the target carrier at the same time for transfer. In the embodiment where the push rod simultaneously drives at least two chips to be transferred, the chips may be pre-arranged on the carrier tape main body, so that the chips can simultaneously align with the target areas corresponding to the chips on the target carrier board.
Since the distance between the target carrier and the chip is usually set to be constant in practical applications, the moving distance of the push rod can be preset, and when the push rod moves downwards by the preset distance, the chip contacts with the target carrier, where the contact also includes contact between the chip and the solder material on the target carrier. Or the movement of the push rod can be stopped when the target carrier plate is pressed to a certain pressure. Or other methods which can judge that the chip to be transferred contacts the target carrier plate are adopted to control the time when the push rod stops moving.
S204, the chip is made to fall off from the carrier tape main body so as to transfer the chip to be transferred to the target carrier board.
When the chip falls off from the carrier tape main body, the chip can be kept on the target carrier board due to gravity, so that the chip is transferred to the target carrier board. It can be understood that, in the chip transfer method in this embodiment, before the chip is separated from the carrier tape main body, the chip is aligned to the corresponding region on the target carrier board, and the chip contacts the target carrier board, and at this time, the position of the chip is already at the target position of the current transfer. Therefore, after the chip falls off from the carrier tape main body, the chip can be directly stopped at a required position without picking up the chip by a suction nozzle or transferring the chip by swinging arms, and the situations of tombstoning, dislocation and the like are basically avoided. Therefore, compared with the traditional chip transfer method, the chip transfer method of the embodiment has the advantages that the efficiency is improved in multiples, and the yield is higher. As shown in fig. 13, after the push rod 8 is lifted, the chip 2 remains on the target carrier 6 due to gravity.
In the embodiment, a new chip packaging structure is adopted, the chips are packaged in a carrier tape mode and are directly used for transferring, and the problems of chip identification error transfer failure, transfer position offset and the like caused by uneven chip film expansion in the traditional transferring process can be avoided. And, the length of chip packaging structure is controllable and can be accomodate, and the quantity of chip depends on the length of chip packaging structure, can use longer chip packaging structure under some circumstances, and the quantity of chip no longer is restricted by the size of chip membrane, is favorable to avoiding frequently loading the material, and loads and conveys through the form of carrier band, and degree of automation is high. Compared with the existing chip loading belt, the chip is accommodated in the groove of the loading belt in the traditional chip transferring process, a suction nozzle is needed to suck the chip, and an adhesion layer cannot be arranged in the loading belt in order to ensure that the chip is easy to suck; and the chip packaging structure of this embodiment sets up adhesion layer adhesion chip on the carrier band main part for the chip can not drop when the chip packaging structure is invertd, has not only promoted the stability when the chip is packed, also makes the chip packaging structure of this embodiment can be applied to in more chip transfer scenes under some circumstances.
It will be appreciated that in some embodiments, the chip packaging structure further comprises a protective film, and therefore further comprises a step of removing the protective film before pressing the chip down to the target carrier.
In one example, the chip is pushed down by a thimble or a push rod with a sharp bottom, so that the chip is separated from the chip packaging structure. Since the surface of the chip on which the electrodes are disposed faces the circuit board in this embodiment, after the carrier tape main body is pierced by the thimble or the push rod, the thimble or the push rod only contacts the substrate side of the chip, and the hardness of the substrate side is usually better than that of the electrode side. It can be seen that compared with the conventional chip transfer method, the chip transfer method of the present embodiment can reduce the damage to the chip when the chip is lifted.
In some embodiments, the adhesive layer of the chip packaging structure comprises a pyrolytic or pyrolytic glue, and the bottom of the push rod is heatable and/or illuminable. In such an embodiment, the chip can be detached from the chip package structure by debonding the adhesive layer without damaging the carrier tape main body. As an example, referring to fig. 14, the bottom of the pusher 8 includes a pusher head 81, the pusher head 81 may be a flat surface and may be heated, the pusher head 81 may not puncture the carrier tape body 1 when the chip packaging structure is pressed down, after the pusher 8 presses the chip 2 down to the target carrier 6, the pusher head 81 is controlled to be heated, the thermal decomposition glue adhering to the chip 2 to be transferred is heated and then is de-adhered, and the chip is detached from the carrier tape body. The push rod can be controlled to rise, deformation of the carrier tape is reduced due to rising of the push rod, and the chip is remained on the target carrier board due to the action of gravity. Similarly, if the adhesion layer is photolysis glue, the push rod head capable of emitting light for debonding the photolysis glue can be adopted as the push rod. In some embodiments, the putter head of the putter may be replaced or both light and heat emitting putter heads may be used, adapting chip packaging structures using different types of adhesive layers.
In some embodiments, the chips on the chip packaging structure are arranged along the length direction, and may be arranged in a single row or multiple rows. In order to realize more accurate transfer, the interval between the chips can be set to be larger, so that only a single row of chips are pressed down onto a target carrier plate in the process of pressing down the push rod once; it should be noted that the single row of chips referred to in this embodiment is a series of chips in the length direction of the chip packaging structure, and the single row of chips referred to in this embodiment is a series of chips in the width direction of the chip packaging structure. Specifically, for example, referring to fig. 15, in the embodiment, an interval L1 between the chips 2 in the length direction of the chip package structure may be set to be greater than a width L2 of the push rod in the length direction of the carrier tape, and if the chips 2 are arranged in a single row, the push rod 8 only pushes one chip 2 down onto the target carrier board. In the traditional chip transfer process, because the size of the chip is small, the size of the thimble required by the thimble needs to be small, the requirement on the thimble is high, the loss is large, and the thimble is easy to push and deflect. Meanwhile, when a chip is picked up by a suction nozzle or other devices, the requirements on the size and precision of the pickup device such as the suction nozzle are extremely high, and the situations of askew suction, missed suction, no chip suction and the like exist. Through the embodiment, as long as the distance between the two chips arranged on the carrier tape main body is larger than the width of the push rod in the length direction of the carrier tape main body, the push rod can push the single-row chips to be transferred in the width direction to the target carrier plate, and if only a single row of chips to be transferred is arranged on the chip packaging structure, the single chip to be transferred can be accurately transferred. Even an extremely small chip such as a nano-scale Micro LED chip can be transferred, the requirements on the precision and the size of accessories such as a push rod are low, the loss is small, and the transfer failure is not easy to occur in the transfer process. The problem that the accessories are limited by the size of the chip in the chip transferring process is solved to a certain extent. It can be understood that, in the case that there are a plurality of rows of chips on the chip packaging structure, further setting the chip pitch L3 in the width direction of the chip packaging structure to be greater than the width L4 of the push rod in the length direction of the carrier tape, can also realize accurate transfer of a single chip to be transferred under the conditions of low requirements on the precision and size of accessories such as the push rod and small loss.
After transferring the current chip to be transferred to the target carrier, the chip packaging structure is moved, i.e. the upper batch of chips to be transferred on the chip packaging structure are aligned with the target area on the target carrier, and the next batch of chips to be transferred is transferred to the target carrier. The transferring method may be the same as the above-mentioned transferring method, that is, the chip to be transferred is pressed down to the target carrier and the chip is dropped off from the chip packaging structure, which is not described herein again. And repeating the steps until all the chips needing to be transferred are transferred. In the transferring process, the chip packaging structure can be transferred by a transfer device, for example, in some examples, a tape coiling device such as a roller can also drive the chip packaging structure to move and simultaneously collect the carrier tape body after the chip is transferred for recycling, and the carrier tape body which is not damaged can be used for packaging the chip again to form the chip packaging structure.
The chip packaging structure of this embodiment, simple structure can with be applied to the transfer of chip in order to provide the chip, when using this chip packaging structure to carry out the chip and shift, need not to carry out artifical membrane that expands, makes at some in-process through the change to chip packaging mode, can realize the chip transfer high-efficiently. Meanwhile, in the chip transfer method of the embodiment, the chip packaging structure is arranged above the target carrier plate, one side with the chip is placed towards the target carrier plate, and the chip to be transferred is directly contacted with the target carrier plate by pressing down the chip packaging structure, so that the chip is directly left in the target area of the target carrier plate after falling off from the carrier belt main body, the actions of picking up the chip, swinging the arm and the like are not needed, the transfer efficiency is improved in multiples, and the yield is high.
Example two:
the present embodiment provides a display device, which includes a circuit board and a chip, the chip includes but is not limited to an LED chip, and the chip is transferred to the circuit board by the chip transfer method exemplified in the first embodiment. It can be understood that the chip is transferred to the circuit board by the chip transfer method illustrated in the first embodiment, so that the display device of the embodiment is manufactured efficiently and has high yield.
The display device provided in the present embodiment can be applied to various light emitting fields, for example, it can be applied to various display fields (which may be display panels of terminals such as televisions, displays, mobile phones, and the like). The applications described above are only a few applications exemplified by the present embodiment, and it should be understood that the applications of the display device in the present embodiment are not limited to the fields exemplified above.
It should be noted that the number, shape, and relationship of sizes of the elements in the drawings are not to indicate the actual condition of the elements unless otherwise specified, but are merely schematic diagrams for easy understanding. While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A chip packaging structure is characterized in that the chip packaging structure comprises a carrier tape main body and a plurality of chips arranged at preset intervals; an adhesive layer is arranged on the first surface of the carrier tape main body, one side of the chip comprises an electrode, and one side opposite to the electrode is adhered to the carrier tape main body through the adhesive layer.
2. The chip packaging structure of claim 1, wherein a side of the chip packaging structure on which the chip is disposed further comprises a protective film, the protective film covering at least the chip on the chip packaging structure.
3. The chip packaging structure according to any one of claims 1-2, wherein the adhesive layer comprises a photo-or thermo-decomposition glue;
if the adhesion layer comprises the photolysis adhesive, the carrier tape main body is made of a light-transmitting material;
if the adhesive layer comprises a thermal release glue, the carrier tape body is not thermally insulated.
4. A chip transfer method, comprising:
arranging a target carrier plate below the chip packaging structure, wherein the side, provided with the chips, of the chip packaging structure is placed towards the target carrier plate, and the chip packaging structure is the chip packaging structure as claimed in any one of claims 1 to 3;
aligning a chip to be transferred to a target area on the target carrier plate;
applying pressure close to the target carrier plate to the chip packaging structure to enable the carrier tape main body to deform until the chip to be transferred contacts the target carrier plate;
and enabling the chip to fall off from the carrier tape main body so as to transfer the chip to be transferred to the target carrier board.
5. The chip transfer method according to claim 4, wherein a protective film is disposed on the chip packaging structure, and the applying of the pressure to the chip packaging structure to approach the target carrier deforms the carrier tape body until the chip to be transferred contacts the target carrier, further comprises:
and removing the protective film.
6. The chip transfer method according to claim 4, wherein applying pressure to the chip packaging structure to approach the target carrier to deform the carrier tape body until the chip to be transferred contacts the target carrier comprises:
and pressing down the carrier tape main body through a push rod, wherein the area pressed down by the push rod at least comprises an area corresponding to the chip to be transferred on the carrier tape main body.
7. The chip transfer method according to claim 6, wherein the adhesive layer of the chip packaging structure comprises a pyrolytic glue or a pyrolytic glue, and the bottom of the push rod is heatable and/or illuminable;
the detaching the chip from the chip packaging structure comprises:
and heating the bottom of the push rod to a target temperature or enabling the bottom of the push rod to emit target light and transmit light to irradiate the adhesive layer through the carrier tape main body so as to debond the adhesive layer.
8. The chip transfer method according to claim 6, wherein the chips on the chip packaging structure are arranged along a length direction of the chip packaging structure, and a width of the push rod in the length direction of the carrier tape main body is not greater than a pitch between two adjacent chips on the chip packaging structure.
9. The chip transfer method according to any of claims 4 to 8, wherein after transferring the chip to be transferred onto the target carrier, further comprising:
moving the chip packaging structure to align a next batch of chips to be transferred on the chip packaging structure with a corresponding target area on the target carrier plate;
and transferring the next batch of chips to be transferred to the target carrier plate.
10. A display device, characterized in that the display device comprises a circuit board and a chip, and the chip is transferred onto the circuit board by the chip transfer method according to any one of claims 4 to 9.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110158667.4A CN112967956A (en) | 2021-02-05 | 2021-02-05 | Chip packaging structure, chip transferring method and display device |
| US18/027,223 US20230411574A1 (en) | 2020-09-21 | 2021-09-18 | Substrate, led light source assembly and manufacturing methods therefor |
| PCT/CN2021/119458 WO2022057937A1 (en) | 2020-09-21 | 2021-09-18 | Substrate, and led light source assembly and manufacturing method therefor |
| EP21868759.8A EP4216275A1 (en) | 2020-09-21 | 2021-09-18 | Substrate, and led light source assembly and manufacturing method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110158667.4A CN112967956A (en) | 2021-02-05 | 2021-02-05 | Chip packaging structure, chip transferring method and display device |
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| CN112967956A true CN112967956A (en) | 2021-06-15 |
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