JP2013163525A - Embossed carrier tape, and component storage body - Google Patents

Embossed carrier tape, and component storage body Download PDF

Info

Publication number
JP2013163525A
JP2013163525A JP2012025989A JP2012025989A JP2013163525A JP 2013163525 A JP2013163525 A JP 2013163525A JP 2012025989 A JP2012025989 A JP 2012025989A JP 2012025989 A JP2012025989 A JP 2012025989A JP 2013163525 A JP2013163525 A JP 2013163525A
Authority
JP
Japan
Prior art keywords
component
adhesive
carrier tape
embossed carrier
component storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012025989A
Other languages
Japanese (ja)
Inventor
Kiyofumi Tanaka
清文 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP2012025989A priority Critical patent/JP2013163525A/en
Publication of JP2013163525A publication Critical patent/JP2013163525A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Packaging Frangible Articles (AREA)
  • Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an embossed carrier tape which is superior in holding property even when storing a damageable component, is capable of easily picking up the component without using an exclusive tool, and is superior in productivity, and also to provide a component storage body in which the component is stored in the embossed carrier tape.SOLUTION: There is provided an embossed carrier tape 1 in which a back surface 13a of an adhesive part 13 comprising an adhesive material which fixes a component 20 by adhesion and has flexibility is arranged by being bonded to a bottom 11a of a concave component storage part 11, and one or more convex parts C are formed on the surface 13b of the adhesive part 13. There is also provided a component storage body 100 in which the component 20 is stored in the component storage part 11 of the embossed carrier tape 1.

Description

本発明は、エンボスキャリアテープ、および部品収納体に関する。   The present invention relates to an embossed carrier tape and a component housing.

従来、半導体チップや電子部品（例えばセラミックコンデンサ、チップ抵抗、コイル等）などの部品は、紙製のキャリアテープやプラスチック製のエンボスキャリアテープ等のキャリアテープの部品収納部に収納される。そして、キャリアテープの表面から部品が飛び出さないように部品収納部をカバーテープで封止してから、各種サイズのリールに巻き取られる。さらに、通常は湿気の影響を受けにくくする目的で乾燥剤を入れたポリエチレン製の袋などに収容し、袋の口を溶着シールした後、段ボール箱等に梱包した状態で目的地へ搬送される。
目的地へ搬送された部品は、実装機により基板等の所定の位置に載置される。具体的には、部品がキャリアテープの部品収納部に収納され、部品収納部をカバーテープで封止された部品収納体を実装機のカセットにかけ、カバーテープを剥離しながらバキュームピンセットなどを用いて部品を一つずつピックアップし、基板等に載置する。 2. Description of the Related Art Conventionally, components such as semiconductor chips and electronic components (for example, ceramic capacitors, chip resistors, coils, etc.) are stored in a component storage portion of a carrier tape such as a paper carrier tape or a plastic embossed carrier tape. Then, the component storage portion is sealed with a cover tape so that the component does not protrude from the surface of the carrier tape, and then wound around a reel of various sizes. Furthermore, it is usually stored in a polyethylene bag containing a desiccant for the purpose of making it less susceptible to moisture, and the bag mouth is welded and sealed before being transported to the destination in a state of being packed in a cardboard box or the like. .
The component conveyed to the destination is placed at a predetermined position such as a substrate by the mounting machine. Specifically, the components are stored in the component storage portion of the carrier tape, and the component storage body in which the component storage portion is sealed with the cover tape is placed on the cassette of the mounting machine, and the cover tape is peeled off and vacuum tweezers are used. Pick up the components one by one and place them on the board.

近年、半導体チップの厚さが薄くなるなど、部品の微小化が進行している。薄い半導体チップは、搬送中の振動や衝撃で割れやすい。また、チップ同士が積層された三次元積層チップや、三次元的な形状を設けたＭＥＭＳと呼ばれる電子部品なども、搬送中の振動や衝撃により壊れやすい。そのため、薄くて割れやすい半導体チップや壊れやすい電子部品などをキャリアテープで搬送し、実装することは容易ではなかった。   In recent years, the miniaturization of components has progressed, such as the thickness of semiconductor chips becoming thinner. Thin semiconductor chips are easily broken by vibration and shock during transportation. In addition, a three-dimensional laminated chip in which chips are laminated, an electronic component called MEMS having a three-dimensional shape, and the like are easily broken by vibration and impact during transportation. For this reason, it is not easy to transport and mount a thin and fragile semiconductor chip or a fragile electronic component with a carrier tape.

そこで、振動や衝撃により壊れやすい部品を収納する保持具として、２インチ、３インチ、４インチなどの外形を有するトレイの表面に、部品を載置可能な粘着フィルムが接着された粘着トレイが用いられている。このような粘着トレイとしては、例えば減圧孔が穿孔されたトレイの表面に、シリコーンゲルからなる粘着フィルムがメッシュ状の網体を介して接着された粘着トレイが知られている。この粘着トレイによれば、部品は粘着フィルムに粘着固定されるので、搬送中の部品の破損を防止できる。また、部品を実装する際は、減圧孔より網体を通じて減圧することで、粘着フィルムが網体に追従して凹凸に変形し、その結果、部品との接触面積が小さくなり、部品を容易にピックアップできるようになる。   Therefore, an adhesive tray in which an adhesive film on which a part can be placed is bonded to the surface of a tray having an outer shape such as 2 inches, 3 inches, or 4 inches is used as a holder for storing parts that are easily broken by vibration or impact. It has been. As such an adhesive tray, for example, an adhesive tray is known in which an adhesive film made of silicone gel is bonded to a surface of a tray having a reduced-pressure hole formed through a mesh-like net. According to this adhesive tray, the parts are adhesively fixed to the adhesive film, so that damage to the parts being conveyed can be prevented. Also, when mounting parts, the pressure-sensitive adhesive film is decompressed through the mesh body through the decompression hole, so that the adhesive film follows the mesh body and deforms into irregularities. As a result, the contact area with the parts becomes small, making the parts easy You can pick up.

しかしながら、シリコーンゲルからなる粘着フィルムは、低分子シロキサンを多く含み、粘着トレイから部品をピックアップする際に低分子シロキサンが部品に移行することがあった。低分子シロキサンが移行した部品を基板上に載置した後でハンダ付けを行うと、低分子シロキサンがハンダの濡れ性に影響を与えることとなり、部品を基板に確実に接続することが困難となる。   However, the pressure-sensitive adhesive film made of silicone gel contains a large amount of low-molecular siloxane, and the low-molecular siloxane sometimes migrates to the part when the part is picked up from the pressure-sensitive adhesive tray. If soldering is performed after placing a component with low-molecular-weight siloxane on the substrate, the low-molecular-weight siloxane will affect the wettability of the solder, making it difficult to reliably connect the component to the substrate. .

そこで、この問題を解決する粘着トレイとして、例えば特許文献１には、ポリウレタン、ポリプロピレン、アクリル系樹脂などからなるエラストマーを材料とした粘着層が、保持板に着脱自在に積層された部品保持具が提案されている（例えば特許文献１参照）。この部品保持具によれば、シリコーンゲルに代わる材料からなる粘着層を備えているので、部品への低分子シロキサンの移行を解消でき、ハンダ付けを行ってもハンダの濡れ性に影響を与えることがない。   Therefore, as an adhesive tray for solving this problem, for example, Patent Document 1 discloses a component holder in which an adhesive layer made of an elastomer made of polyurethane, polypropylene, acrylic resin, or the like is detachably stacked on a holding plate. It has been proposed (see, for example, Patent Document 1). According to this component holder, since it has an adhesive layer made of a material that replaces silicone gel, the migration of low molecular siloxane to the component can be eliminated, and solder wettability will be affected even if soldering is performed. There is no.

ところで、部品を基板などに実装する実装機としては、部品がキャリアテープと粘着トレイのいずれに収納されていても対応できるように、キャリアテープと粘着トレイの両方を導入できる実装機が用いられているが、キャリアテープのみに対応した実装機も数多く販売、使用されている。   By the way, as a mounting machine for mounting a component on a substrate or the like, a mounting machine that can introduce both a carrier tape and an adhesive tray is used so that the component can be accommodated in either a carrier tape or an adhesive tray. However, many mounting machines that only support carrier tapes are also sold and used.

そのため、キャリアテープの外形を有し、かつ粘着トレイのように部品を粘着固定できるキャリアテープが求められており、例えば図１９に示すような部品収納部１１の底部１１ａにフィルム状の粘着部１３が接着部１４により接着して設けられたエンボスキャリアテープ４や、図２０に示すような所定の間隔で収納孔５１が形成された基材シート１０の裏面に、テープ本体５２と粘着部１３とで構成された粘着テープ５３を貼り付け、収納孔５１から粘着テープ５３の粘着部１３を露出させたキャリアテープ５が提案されている（例えば特許文献２参照）。   Therefore, a carrier tape having an outer shape of a carrier tape and capable of adhesively fixing components like an adhesive tray is required. For example, a film-like adhesive portion 13 is formed on a bottom portion 11a of a component storage portion 11 as shown in FIG. On the back surface of the embossed carrier tape 4 provided by being bonded by the bonding portion 14 or the base sheet 10 in which the storage holes 51 are formed at predetermined intervals as shown in FIG. A carrier tape 5 is proposed in which the adhesive tape 53 configured by the above is attached and the adhesive portion 13 of the adhesive tape 53 is exposed from the storage hole 51 (see, for example, Patent Document 2).

しかしながら、図１９、２０に記載のキャリアテープは、粘着トレイと同様に部品が粘着部に粘着固定されているので保持性に優れる一方で、部品が粘着部から剥がれにくく、無理に剥がそうとすれば部品が破損することがあった。
そこで、部品を容易にピックアップできるキャリアテープとして、例えば部品収納部に部品を押し上げて剥離するためのピン挿入用孔を設けた電子部品用搬送体（例えば特許文献３参照）、粘着部を電子部品面に対して不均一な接着力の分布で形成させた電子部品用搬送体（例えば特許文献４参照）、収納孔から粘着テープの粘着部を露出させ、かつ収納孔のテープ幅方向の両側縁に内側に向けて突出する張り出し部を設け、該張り出し部により粘着テープを収納孔の上面にまで押し上げて支持する電子部品の搬送帯（例えば特許文献５参照）などが提案されている。 However, the carrier tape described in FIGS. 19 and 20 is excellent in holding property because the components are adhesively fixed to the adhesive portion in the same manner as the adhesive tray. On the other hand, the components are difficult to peel off from the adhesive portion. Parts could be damaged.
Therefore, as a carrier tape that can easily pick up a component, for example, an electronic component carrier (see, for example, Patent Document 3) provided with a pin insertion hole for pushing up and peeling the component in the component storage portion, and the adhesive portion as an electronic component. Electronic component carrier (see, for example, Patent Document 4) formed with non-uniform adhesive force distribution on the surface, the adhesive portion of the adhesive tape exposed from the storage hole, and both side edges of the storage hole in the tape width direction There has been proposed an electronic component transport band (see, for example, Patent Document 5) that is provided with a protruding portion that protrudes inwardly and supports the adhesive tape by pushing it up to the upper surface of the storage hole.

特開２００９−２３７２５号公報JP 2009-23725 A 特許第２５３２４４８号公報Japanese Patent No. 2532448 実開平５−４２１８７号公報Japanese Utility Model Publication No. 5-42187 実開平２−１１４６６７号公報Japanese Utility Model Publication No. 2-114667 特許第２８８７１１０号公報Japanese Patent No. 2887110

しかしながら、特許文献３に記載の電子部品用搬送体は、部品をピックアップする際にピン等の専用の治具を用いなければならない。
特許文献４に記載の電子部品用搬送体は、粘着部の粘着力分布が不均一になるように粘着材料を設計する必要があった。
特許文献５に電子部品の搬送帯は、収納孔に張り出し部を設ける必要があるため、搬送帯の成形が複雑となる。
このように、粘着部を備えた従来のキャリアテープは、部品をピックアップするのが困難であり、ピックアップするためにはピンなどの専用の治具が必要であった。また、粘着剤の設計や複雑な成形は、キャリアテープの生産性の低下につながる。 However, the electronic component carrier described in Patent Document 3 must use a dedicated jig such as a pin when picking up the component.
In the electronic component carrier described in Patent Document 4, it is necessary to design the adhesive material so that the adhesive force distribution of the adhesive portion is non-uniform.
According to Patent Document 5, since the conveyance band for electronic components needs to be provided with a protruding portion in the storage hole, the formation of the conveyance band becomes complicated.
As described above, the conventional carrier tape provided with the adhesive portion has difficulty in picking up the components, and a dedicated jig such as a pin is required to pick up the parts. In addition, the design and complicated molding of the adhesive lead to a decrease in the productivity of the carrier tape.

本発明は上記事情を鑑みてなされたもので、破損しやすい部品を収納する場合でも保持性に優れ、かつ専用の治具を用いることなく部品を容易にピックアップでき、生産性に優れたエンボスキャリアテープ、および該エンボスキャリアテープに部品が収納された部品収納体の提供を目的とする。   The present invention has been made in view of the above circumstances, and is an embossed carrier that has excellent retainability even when storing parts that are easily damaged, and that can easily pick up parts without using a dedicated jig, and has excellent productivity. An object is to provide a tape and a component storage body in which components are stored in the embossed carrier tape.

本発明は、以下の態様を有する。
［１］部品を収納するための凹状の部品収納部が形成されたエンボスキャリアテープにおいて、部品を粘着固定する、可撓性を有する粘着材料からなる粘着部の裏面が、前記部品収納部の底部に接着して設けられ、前記粘着部の表面に１つ以上の凸部が形成されていることを特徴とするエンボスキャリアテープ。
［２］前記部品収納部の底部の内面に凹み部が形成され、フィルム状の前記粘着部が部品収納部の底部の内面形状に追従するように、粘着部の裏面が凹み部に接着していることを特徴とする［１］に記載のエンボスキャリアテープ。
［３］前記粘着部の表面の少なくとも一部がブラスト処理され、１つ以上の凸部が形成されていることを特徴とする［１］に記載のエンボスキャリアテープ。
［４］前記粘着部の裏面が部品収納部の底部に部分接着し、その接着領域において粘着部の表面がブラスト処理されていることを特徴とする［３］に記載のエンボスキャリアテープ。
［５］［１］〜［４］のいずれか一項に記載のエンボスキャリアテープの部品収納部に部品が収納された部品収納体であって、前記部品と粘着部との間に隙間が形成されていることを特徴とする部品収納体。
［６］前記部品が収納された部品収納部がカバーテープで封止されたことを特徴とする［５］に記載の部品収納体。 The present invention has the following aspects.
[1] In an embossed carrier tape in which a concave component storage portion for storing components is formed, the back surface of the adhesive portion made of a flexible adhesive material that adheres and fixes the components is the bottom of the component storage portion. An embossed carrier tape, wherein the embossed carrier tape is provided by adhering to a surface of the adhesive portion, wherein one or more convex portions are formed on the surface of the adhesive portion.
[2] A concave portion is formed on the inner surface of the bottom portion of the component storage portion, and the back surface of the adhesive portion is bonded to the concave portion so that the film-like adhesive portion follows the inner shape of the bottom portion of the component storage portion. The embossed carrier tape according to [1], wherein
[3] The embossed carrier tape according to [1], wherein at least a part of the surface of the adhesive portion is blasted to form one or more convex portions.
[4] The embossed carrier tape according to [3], wherein a back surface of the adhesive portion is partially bonded to a bottom portion of the component storage portion, and a surface of the adhesive portion is blasted in the bonding region.
[5] A component storage body in which a component is stored in the component storage portion of the embossed carrier tape according to any one of [1] to [4], wherein a gap is formed between the component and the adhesive portion. A parts container characterized by being made.
[6] The component storage unit according to [5], wherein the component storage unit in which the component is stored is sealed with a cover tape.

本発明によれば、破損しやすい部品を収納する場合でも保持性に優れ、かつ専用の治具を用いることなく部品を容易にピックアップでき、生産性に優れたエンボスキャリアテープ、および該エンボスキャリアテープに部品が収納された部品収納体を提供できる。   According to the present invention, an embossed carrier tape excellent in productivity and capable of easily picking up components without using a dedicated jig even when storing easily damaged components, and the embossed carrier tape A component storage body in which components are stored can be provided.

本発明の第１実施形態のエンボスキャリアテープの部品収納部の底部の内面形状の一例を示す斜視図である。It is a perspective view which shows an example of the inner surface shape of the bottom part of the components accommodating part of the embossed carrier tape of 1st Embodiment of this invention. 本発明の第１実施形態のエンボスキャリアテープの一例を示す斜視図である。It is a perspective view which shows an example of the embossed carrier tape of 1st Embodiment of this invention. 図２に示すエンボスキャリアテープに部品が収納された部品収納体を幅方向に切断した断面図である。It is sectional drawing which cut | disconnected the component storage body in which components were accommodated in the embossed carrier tape shown in FIG. 2 in the width direction. 部品が粘着部から剥がれる様子を示す断面図である。It is sectional drawing which shows a mode that components peel from an adhesion part. （ａ）は、第１実施形態のエンボスキャリアテープの他の例を示す断面図であり、（ｂ）は、第１実施形態の部品収納体の他の例を示す断面図である。(A) is sectional drawing which shows the other example of the embossed carrier tape of 1st Embodiment, (b) is sectional drawing which shows the other example of the components storage body of 1st Embodiment. （ａ）は、第１実施形態のエンボスキャリアテープの他の例を示す断面図であり、（ｂ）は、第１実施形態の部品収納体の他の例を示す断面図である。(A) is sectional drawing which shows the other example of the embossed carrier tape of 1st Embodiment, (b) is sectional drawing which shows the other example of the components storage body of 1st Embodiment. （ａ）は、第１実施形態のエンボスキャリアテープの他の例を示す断面図であり、（ｂ）は、第１実施形態の部品収納体の他の例を示す断面図である。(A) is sectional drawing which shows the other example of the embossed carrier tape of 1st Embodiment, (b) is sectional drawing which shows the other example of the components storage body of 1st Embodiment. （ａ）は、第１実施形態のエンボスキャリアテープの他の例を示す断面図であり、（ｂ）は、第１実施形態の部品収納体の他の例を示す断面図である。(A) is sectional drawing which shows the other example of the embossed carrier tape of 1st Embodiment, (b) is sectional drawing which shows the other example of the components storage body of 1st Embodiment. （ａ）は、第１実施形態のエンボスキャリアテープの他の例を示す断面図であり、（ｂ）は、第１実施形態の部品収納体の他の例を示す断面図である。(A) is sectional drawing which shows the other example of the embossed carrier tape of 1st Embodiment, (b) is sectional drawing which shows the other example of the components storage body of 1st Embodiment. 第１実施形態の部品収納体がリールに巻き取られた状態の一例を示す斜視図である。It is a perspective view which shows an example of the state by which the components storage body of 1st Embodiment was wound up by the reel. 本発明の第２実施形態のエンボスキャリアテープの一例を示す斜視図である。It is a perspective view which shows an example of the embossed carrier tape of 2nd Embodiment of this invention. 図１１に示すエンボスキャリアテープに部品が収納された部品収納体を幅方向に切断した断面図である。It is sectional drawing which cut | disconnected the component storage body in which components were accommodated in the embossed carrier tape shown in FIG. 11 in the width direction. （ａ）は、第２実施形態のエンボスキャリアテープの他の例を示す断面図であり、（ｂ）は、第２実施形態の部品収納体の他の例を示す断面図である。(A) is sectional drawing which shows the other example of the embossed carrier tape of 2nd Embodiment, (b) is sectional drawing which shows the other example of the components storage body of 2nd Embodiment. （ａ）は、第２実施形態のエンボスキャリアテープの他の例を示す断面図であり、（ｂ）は、第２実施形態の部品収納体の他の例を示す断面図である。(A) is sectional drawing which shows the other example of the embossed carrier tape of 2nd Embodiment, (b) is sectional drawing which shows the other example of the components storage body of 2nd Embodiment. （ａ）は、第２実施形態のエンボスキャリアテープの他の例を示す断面図であり、（ｂ）は、第２実施形態の部品収納体の他の例を示す断面図である。(A) is sectional drawing which shows the other example of the embossed carrier tape of 2nd Embodiment, (b) is sectional drawing which shows the other example of the components storage body of 2nd Embodiment. 本発明の第３実施形態のエンボスキャリアテープの一例を示す斜視図である。It is a perspective view which shows an example of the embossed carrier tape of 3rd Embodiment of this invention. 図１６に示すエンボスキャリアテープに部品が収納された部品収納体を幅方向に切断した断面図である。It is sectional drawing which cut | disconnected the component storage body in which components were accommodated in the embossing carrier tape shown in FIG. 16 in the width direction. 実施例１で得られたエンボスキャリアテープに部品が収納された部品収納体を示す平面図である。It is a top view which shows the components storage body in which components were accommodated in the embossed carrier tape obtained in Example 1. FIG. 従来のエンボスキャリアテープを幅方向に切断した断面図である。It is sectional drawing which cut | disconnected the conventional embossed carrier tape in the width direction. 従来のキャリアテープを幅方向に切断した断面図である。It is sectional drawing which cut | disconnected the conventional carrier tape in the width direction.

［第１実施形態］
＜エンボスキャリアテープ＞
本発明の第１実施形態のエンボスキャリアテープについて、図面を参照して説明する。図１は、本実施形態のエンボスキャリアテープの部品収納部の底部の内面形状を示す斜視図であり、図２は本実施形態のエンボスキャリアテープ１の斜視図であり、図３は図２に示すエンボスキャリアテープ１に部品２０が収納された部品収納体１００を幅方向に切断した断面図である。
なお、図１〜３、および後述する図４〜２０においては、説明の便宜上、寸法比などは実際のものと異なったものである。また、図３〜２０において、図１、２と同じ構成要素には同じ符号を付してその説明を省略する。 [First Embodiment]
<Embossed carrier tape>
The embossed carrier tape of 1st Embodiment of this invention is demonstrated with reference to drawings. FIG. 1 is a perspective view showing the inner shape of the bottom of the component storage portion of the embossed carrier tape of the present embodiment, FIG. 2 is a perspective view of the embossed carrier tape 1 of the present embodiment, and FIG. It is sectional drawing which cut | disconnected the component storage body 100 in which the components 20 were accommodated in the embossed carrier tape 1 to show in the width direction.
In FIGS. 1 to 3 and FIGS. 4 to 20 to be described later, the dimensional ratio and the like are different from the actual ones for convenience of explanation. Moreover, in FIGS. 3-20, the same code | symbol is attached | subjected to the same component as FIGS. 1, 2, and the description is abbreviate | omitted.

第１実施形態のエンボスキャリアテープは、図１、２に示すように、長尺な基材シート１０をエンボス加工して、凹状の部品収納部１１が一定間隔で形成されたものである。
また、エンボスキャリアテープ１には、幅方向の一方の端部側に、搬送用の送り孔１２が一定間隔で形成されている。 As shown in FIGS. 1 and 2, the embossed carrier tape of the first embodiment is obtained by embossing a long base sheet 10 to form concave component storage portions 11 at regular intervals.
Further, the embossed carrier tape 1 is formed with conveying feed holes 12 at regular intervals on one end side in the width direction.

基材シート１０の材質としては、ポリ塩化ビニル、ポリスチレン、ポリエステル、ポリプロピレン、ポリカーボネート、ポリエチレンテレフタレート、ポリアクリロニトリル、アクリロニトリル・ブタジエン・スチレン共重合体等が挙げられる。   Examples of the material of the base sheet 10 include polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyethylene terephthalate, polyacrylonitrile, acrylonitrile-butadiene-styrene copolymer, and the like.

この例の部品収納部１１は、開口部が平面視四角形の有底中空状の凹状とされている。また、部品収納部１１の底部１１ａの形状は平面視略四角形であり、底部１１ａの内面の周縁に凹み部Ｈが形成されている。さらに、底部１１ａの内面の縦横中央にも十字状の凹み部Ｈが形成されている。
凹み部Ｈの幅ｗは特に限定されないが、後述するフィルム状の粘着部を凹み部Ｈに接着させる場合には、粘着部を接着固定できる大きさであることが好ましく、概ね０．５〜２ｍｍが好ましい。また、凹み部Ｈの深さｈは、粘着部を部品収納部１１の底部１１ａに接着したときに、底部１１ａの内面形状に追従して粘着部の表面が凹凸状となれば特に限定されないが、概ね０．０５〜１ｍｍが好ましい。
なお、本発明では、底部１１ａの内面において凹み部Ｈ以外の部分を「突出部Ｐ」という。 The component storage portion 11 of this example has a bottomed hollow concave shape whose opening is square in plan view. Moreover, the shape of the bottom part 11a of the component storage part 11 is a substantially square shape in planar view, and the recessed part H is formed in the peripheral edge of the inner surface of the bottom part 11a. Furthermore, a cross-shaped dent H is also formed at the vertical and horizontal centers of the inner surface of the bottom 11a.
The width w of the recessed portion H is not particularly limited, but when a film-like adhesive portion described later is bonded to the recessed portion H, it is preferable that the adhesive portion can be adhered and fixed, and is generally 0.5 to 2 mm. Is preferred. Further, the depth h of the dent H is not particularly limited as long as the adhesive part adheres to the bottom part 11a of the component storage part 11 and the surface of the adhesive part becomes uneven following the shape of the inner surface of the bottom part 11a. In general, 0.05 to 1 mm is preferable.
In the present invention, a portion other than the recessed portion H on the inner surface of the bottom portion 11a is referred to as a “projecting portion P”.

さらに、図２に示すように、本実施形態におけるエンボスキャリアテープ１には、部品を粘着固定する、可撓性を有する粘着材料からなるフィルム状の粘着部１３の裏面１３ａが、接着剤からなる接着部１４を介して部品収納部１１の底部１１ａに部分接着して設けられている。具体的には、粘着部１３が部品収納部１１の底部１１ａの内面形状に追従するように、粘着部１３の裏面１３ａが接着部１４を介して底部１１ａに形成された凹み部Ｈに接着している。このように粘着部１３が部品収納部１１の底部１１ａの内面形状に追従するように接着することで、粘着部１３の表面１３ｂが平坦ではなく凹凸状となり、表面１３ｂに１つ以上の凸部Ｃが形成される。凸部Ｃの数は、凹み部Ｈの形状に応じて決まる。   Furthermore, as shown in FIG. 2, the back surface 13a of the film-like pressure-sensitive adhesive portion 13 made of a flexible pressure-sensitive adhesive material that adheres and fixes components to the embossed carrier tape 1 in the present embodiment is made of an adhesive. It is provided by being partially bonded to the bottom portion 11 a of the component storage portion 11 through the bonding portion 14. Specifically, the back surface 13a of the adhesive portion 13 adheres to the recess H formed in the bottom portion 11a via the adhesive portion 14 so that the adhesive portion 13 follows the inner surface shape of the bottom portion 11a of the component storage portion 11. ing. By adhering the adhesive part 13 so as to follow the inner surface shape of the bottom part 11a of the component storage part 11 in this way, the surface 13b of the adhesive part 13 is not flat but uneven, and one or more convex parts are formed on the surface 13b. C is formed. The number of the convex portions C is determined according to the shape of the concave portion H.

本発明のエンボスキャリアテープ１によれば、粘着部１３の表面１３ｂが凹凸状であり、表面１３ｂに１つ以上の凸部Ｃが形成されている。具体的には、図３に示すように、部品２０が粘着部１３の表面１３ｂに粘着固定された際に、粘着部１３の部品が接する部分の表面の少なくとも一部に凸部Ｃが形成されている。よって、凸部Ｃが形成された粘着部１３の表面１３ｂに部品２０を粘着固定すると、部品２０は凸部Ｃにて粘着部１３と接するため、粘着部１３との間に隙間Ｇが形成され、この隙間Ｇが部品２０をピックアップする際の剥離の起点となる。
すなわち、部品２０と粘着部１３との間に隙間Ｇが形成されていると、図４に示すように、部品２０を持ち上げたときに隙間Ｇを剥離の起点として部品２０が粘着部１３から剥がれていくとともに、可撓性を有する粘着材料からなる粘着部が伸びて変形する。その結果、隙間Ｇが徐々に大きくなっていくことで部品２０と粘着部１３の接触面積が小さくなり（図４（ａ）、（ｂ））、部品２０を容易にピックアップできる（図４（ｃ））。 According to the embossed carrier tape 1 of the present invention, the surface 13b of the adhesive portion 13 is uneven, and one or more convex portions C are formed on the surface 13b. Specifically, as shown in FIG. 3, when the component 20 is adhesively fixed to the surface 13 b of the adhesive portion 13, a convex portion C is formed on at least a part of the surface where the component of the adhesive portion 13 contacts. ing. Therefore, when the component 20 is adhesively fixed to the surface 13b of the adhesive portion 13 on which the convex portion C is formed, the component 20 contacts the adhesive portion 13 at the convex portion C, so that a gap G is formed between the adhesive portion 13 and the adhesive portion 13. The gap G becomes a starting point of peeling when the component 20 is picked up.
That is, when the gap G is formed between the component 20 and the adhesive portion 13, as shown in FIG. 4, when the component 20 is lifted, the component 20 is peeled from the adhesive portion 13 with the gap G as a starting point of peeling. At the same time, the adhesive portion made of a flexible adhesive material extends and deforms. As a result, as the gap G gradually increases, the contact area between the component 20 and the adhesive portion 13 is reduced (FIGS. 4A and 4B), and the component 20 can be easily picked up (FIG. 4C). )).

また、本実施形態のエンボスキャリアテープ１は、粘着部１３の裏面１３ａが部品収納部１１の底部１１ａの内面に形成された凹み部Ｈで、部品収納部１１の底部１１ａに接着している（以下、粘着部１３が接着部１４を介して部品収納部１１の底部１１ａに接着している領域を「接着領域Ｉ」という。）。すなわち、粘着部１３の裏面１３ａにおいて、部品収納部１１の底部１１ａに接着していない部分（以下、この領域を「非接着領域ＩＩ」という。）が形成されている。
よって、図４に示すように、部品２０は非接着領域ＩＩのみで粘着部１３と接しているため、部品２０を持ち上げたときに、非接着領域ＩＩの部分の粘着部１３も引っ張られやすい。さらに、接着領域Ｉの部分の粘着部１３は接着部１４によって部品収納部１１の底部１１ａに接着固定されているので、非接着領域ＩＩの部分の粘着部１３が伸びやすく、変形しやすい。従って、部品２０をより容易にピックアップできる。 Moreover, the embossed carrier tape 1 of this embodiment adhere | attaches the bottom part 11a of the component storage part 11 with the recessed part H in which the back surface 13a of the adhesion part 13 was formed in the inner surface of the bottom part 11a of the component storage part 11 ( Hereinafter, a region where the adhesive portion 13 is bonded to the bottom portion 11a of the component storage portion 11 via the bonding portion 14 is referred to as “bonding region I”). That is, on the back surface 13 a of the adhesive portion 13, a portion not bonded to the bottom portion 11 a of the component storage portion 11 (hereinafter, this region is referred to as “non-bonded region II”) is formed.
Therefore, as shown in FIG. 4, since the component 20 is in contact with the adhesive portion 13 only in the non-adhesive region II, the adhesive portion 13 in the non-adhesive region II is easily pulled when the component 20 is lifted. Furthermore, since the adhesive portion 13 in the adhesion region I is bonded and fixed to the bottom 11a of the component storage portion 11 by the adhesive portion 14, the adhesive portion 13 in the non-adhesion region II is easily stretched and easily deformed. Therefore, the component 20 can be picked up more easily.

粘着部１３を構成する粘着材料は、少なくとも室温（部品を実装する際の室内温度）において可撓性を有する材料である。このような粘着材料としては、例えばスチレン系、オレフィン系、ウレタン系、ポリエステル系、ポリアミド系等のエラストマーなどが挙げられる。   The pressure-sensitive adhesive material constituting the pressure-sensitive adhesive portion 13 is a material having flexibility at least at room temperature (the room temperature when components are mounted). Examples of such adhesive materials include styrene-based, olefin-based, urethane-based, polyester-based, and polyamide-based elastomers.

接着部１４を構成する接着剤としては、例えばシリコーン系、アクリル系、エチレンプロピレンゴム系、エポキシ系、ウレタン系、ポリイミド系、ポリエステル系等の接着剤が挙げられる。
粘着部１３の厚さｄ１３は特に限定されないが、２５〜２５０μｍであることが好ましい。 Examples of the adhesive constituting the adhesive portion 14 include silicone-based, acrylic-based, ethylene-propylene rubber-based, epoxy-based, urethane-based, polyimide-based, and polyester-based adhesives.
The thickness d 13 of the adhesive portion 13 is not particularly limited, but is preferably 25～250Myuemu.

エンボスキャリアテープ１は、例えば以下のようにして製造できる。
まず、部品収納部１１の底部１１ａが図１に示す形状となるような金型を用い、基材シート１０をエンボス加工して、底部１１ａの内面に凹み部Ｈが形成された部品収納部１１を形成する。エンボス加工の方法としては、例えばプレス成形法、圧空成形法、真空成形法、あるいはこれらを組みあわせた成形方法を適用できる。また、部品収納部１１の大きさについては特に制限されず、収納する部品に応じて適宜決定される。
ついで、基材シート１０の幅方向の一方の端部側に送り孔１２を形成する。送り孔１２の形成方法としては、公知の穿孔方法を適用できる。
ついで、部品収納部１１の底部１１ａの内面に形成された凹み部Ｈに接着剤を塗布し、別途作製した粘着材料からなるフィルム状の粘着部１３を、部品収納部１１の底部１１ａの内面形状に追従するように貼り付けて凹み部Ｈに粘着部１３を接着させ、エンボスキャリアテープ１を得る。
なお、送り孔１２は、エンボス加工と同時に成形してもよいし、エンボス加工の前に形成してもよいし、エンボス加工の後かつ粘着部１３の接着前に形成してもよし、粘着部１３の接着後に形成してもよい。また、接着剤からなる両面テープを凹み部Ｈに貼着してもよい。 The embossed carrier tape 1 can be manufactured as follows, for example.
First, by using a mold such that the bottom 11a of the component storage unit 11 has the shape shown in FIG. 1, the base sheet 10 is embossed, and the component storage unit 11 is formed with a recess H on the inner surface of the bottom 11a. Form. As the embossing method, for example, a press forming method, a pressure forming method, a vacuum forming method, or a forming method combining these can be applied. Further, the size of the component storage unit 11 is not particularly limited, and is appropriately determined according to the component to be stored.
Next, the feed hole 12 is formed on one end side in the width direction of the base sheet 10. As a method for forming the feed hole 12, a known drilling method can be applied.
Next, an adhesive is applied to the recessed portion H formed on the inner surface of the bottom portion 11a of the component storage portion 11, and the film-like adhesive portion 13 made of a separately prepared adhesive material is used as the inner shape of the bottom portion 11a of the component storage portion 11. The embossed carrier tape 1 is obtained by adhering the adhesive portion 13 to the recessed portion H.
The feed hole 12 may be formed at the same time as embossing, may be formed before embossing, or may be formed after embossing and before adhesion of the adhesive portion 13. You may form after 13 adhesion | attachment. Moreover, you may stick the double-sided tape which consists of an adhesive agent to the dent H.

以上説明した本発明のエンボスキャリアテープ１は、部品収納部１１の底部１１ａに粘着部１３が接着して設けられているので、部品２０を粘着部１３の表面１３ｂに粘着固定でき、破損しやすい部品を収納する場合でも保持性に優れる。   Since the embossed carrier tape 1 of the present invention described above is provided with the adhesive portion 13 adhered to the bottom 11a of the component storage portion 11, the component 20 can be adhesively fixed to the surface 13b of the adhesive portion 13 and easily damaged. Excellent retention even when storing parts.

ところで、例えば図１９に示すように、従来のエンボスキャリアテープ４は、表面１３ｂが平坦な粘着部１３が、部品収納部１１の底部１１ａに接着して設けられている。そのため、粘着部１３の表面１３ｂに部品２０を粘着固定しても、部品２０と粘着部１３との間に隙間が形成されない。
従って、部品２０を持ち上げても、剥離の起点がないため部品２０は粘着部１３から剥がれにくい。また、部品２０が剥がれていかないと粘着部１３は伸びて変形しにくく、部品収納部１１の底部１１ａに固定されたままの状態となる。よって、部品２０をピックアップするのが困難であり、ピンなどの専用の治具を用いてピックアップする必要があった。また、粘着材料の設計や複雑な形状の部品収納部１１の成形が必要となり、エンボスキャリアテープ４の生産性が低下しやすかった。 Incidentally, for example, as shown in FIG. 19, the conventional embossed carrier tape 4 is provided with an adhesive portion 13 having a flat surface 13 b bonded to the bottom portion 11 a of the component storage portion 11. Therefore, even if the component 20 is adhesively fixed to the surface 13 b of the adhesive portion 13, no gap is formed between the component 20 and the adhesive portion 13.
Therefore, even if the component 20 is lifted, the component 20 is not easily peeled off from the adhesive portion 13 because there is no starting point of peeling. Further, if the component 20 is not peeled off, the adhesive portion 13 is stretched and hardly deformed, and remains fixed to the bottom portion 11 a of the component storage portion 11. Therefore, it is difficult to pick up the component 20, and it is necessary to pick up using a dedicated jig such as a pin. In addition, the design of the adhesive material and the molding of the component housing part 11 having a complicated shape are required, and the productivity of the embossed carrier tape 4 is likely to be lowered.

また、例えば図２０に示すような、所定の間隔で収納孔５１が形成された基材シート１０の裏面に、テープ本体５２と粘着部１３とで構成された粘着テープ５３を貼り付け、収納孔５１から粘着テープ５３を露出させたキャリアテープ５についても、図１９に示すエンボスキャリアテープ４と同様に、部品２０と粘着部１３との間に隙間が形成されず、剥離の起点がない。よって、部品２０が粘着部１３から剥がれにくく、さらに粘着部１３は伸びて変形することなく、テープ本体５２に固定されたままの状態となるため、部品２０をピックアップするのが困難であった。そのため、テープ本体５２を伸び易い材料で成形する必要があるが、その場合は基材シート１０を巻回した際に、基材シート１０が裏側から押され、部品２０が剥がれて動いてしまうという問題があった。   Further, for example, as shown in FIG. 20, an adhesive tape 53 composed of a tape body 52 and an adhesive portion 13 is attached to the back surface of the base sheet 10 in which the accommodation holes 51 are formed at predetermined intervals. Similarly to the embossed carrier tape 4 shown in FIG. 19, the carrier tape 5 from which the adhesive tape 53 is exposed from 51 does not form a gap between the component 20 and the adhesive portion 13, and does not have a starting point of peeling. Therefore, the component 20 is not easily peeled off from the adhesive portion 13, and the adhesive portion 13 is not stretched and deformed and remains fixed to the tape body 52, so that it is difficult to pick up the component 20. Therefore, it is necessary to mold the tape body 52 with an easily stretchable material. In that case, when the base sheet 10 is wound, the base sheet 10 is pushed from the back side, and the component 20 is peeled off and moved. There was a problem.

しかし、本発明のエンボスキャリアテープ１であれば、粘着部１３の表面１３ｂが凹凸状であり、表面１３ｂに１つ以上の凸部Ｃが形成されている。よって、図４に示すように凸部Ｃが形成された粘着部１３の表面１３ｂに部品を粘着固定すると、部品２０と粘着部１３との間に、剥離の起点となる隙間Ｇが形成されるので、部品２０をピックアップしようと思えば、部品２０が粘着部１３から容易に剥がれる。
従って、本発明のエンボスキャリアテープ１は、ピンなどの専用の治具を用いなくても部品２０を容易にピックアップできる。また、本発明のエンボスキャリアテープ１は部品２０を容易にピックアップできるので、粘着部１３の粘着力分布が不均一になるように粘着材料を設計したり、部品収納部１１の形状を複雑に成形したりする必要がない。よって、生産性にも優れる。 However, if it is the embossed carrier tape 1 of this invention, the surface 13b of the adhesion part 13 is uneven | corrugated, and the 1 or more convex part C is formed in the surface 13b. Therefore, as shown in FIG. 4, when a component is adhesively fixed to the surface 13 b of the adhesive portion 13 on which the convex portion C is formed, a gap G serving as a starting point of peeling is formed between the component 20 and the adhesive portion 13. Therefore, if the component 20 is to be picked up, the component 20 is easily peeled off from the adhesive portion 13.
Therefore, the embossed carrier tape 1 of the present invention can easily pick up the component 20 without using a dedicated jig such as a pin. In addition, since the embossed carrier tape 1 of the present invention can easily pick up the component 20, an adhesive material is designed so that the adhesive force distribution of the adhesive portion 13 is non-uniform, or the shape of the component storage portion 11 is complicatedly formed. There is no need to do. Therefore, productivity is also excellent.

また、本実施形態のエンボスキャリアテープ１は、部品収納部１１の底部１１ａの内面に形成された凹み部Ｈでのみ、粘着部１３の裏面１３ａが部品収納部１１の底部１１ａに接着し、非接着領域ＩＩが形成されている。よって、部品２０を持ち上げたときに非接着領域ＩＩにおける粘着部１３が伸びやすく、変形しやすい。従って、部品２０をより容易にピックアップできる。   Further, the embossed carrier tape 1 of the present embodiment is such that the back surface 13a of the adhesive portion 13 adheres to the bottom portion 11a of the component storage portion 11 only at the recessed portion H formed on the inner surface of the bottom portion 11a of the component storage portion 11. An adhesion region II is formed. Therefore, when the component 20 is lifted, the pressure-sensitive adhesive portion 13 in the non-adhesion region II is easily stretched and easily deformed. Therefore, the component 20 can be picked up more easily.

本発明のエンボスキャリアテープは、部品を収納（保持）するものであり、部品を搬送したり、保管したりする場合に適している。特に、薄くて割れやすい半導体チップや壊れやすい電子部品など、振動や衝撃により破損しやすい部品を収納して搬送するのに好適である。   The embossed carrier tape of the present invention accommodates (holds) parts, and is suitable for transporting and storing parts. In particular, it is suitable for storing and transporting parts that are easily damaged by vibration or impact, such as thin and easily broken semiconductor chips and easily broken electronic parts.

なお、本実施形態のエンボスキャリアテープは、図２〜４に示す形態に限定されない。図２〜４に示すエンボスキャリアテープ１は、部品収納部１１の底部１１ａの内面の周縁に凹み部Ｈが形成され、さらに底部１１ａの内面の縦横中央にも十字状の凹み部Ｈが形成されているが（図１参照）、例えば図５（ａ）に示すように、底部１１ａの内面の周縁のみに凹み部Ｈが形成されていてもよいし、図６（ａ）、７（ａ）に示すように、底部１１ａの内面の周縁以外の場所に凹み部Ｈが形成されていてもよい。   In addition, the embossed carrier tape of this embodiment is not limited to the form shown in FIGS. The embossed carrier tape 1 shown in FIGS. 2 to 4 is formed with a recess H at the periphery of the inner surface of the bottom 11a of the component storage portion 11, and further has a cross-shaped recess H at the vertical and horizontal center of the inner surface of the bottom 11a. However, as shown in FIG. 5 (a), for example, as shown in FIG. 5 (a), a recess H may be formed only on the peripheral edge of the inner surface of the bottom 11a, or FIGS. 6 (a) and 7 (a). As shown in FIG. 3, the recessed part H may be formed in places other than the periphery of the inner surface of the bottom part 11a.

また、図２〜７に示すエンボスキャリアテープ１は、部品収納部１１の底部１１ａの内面に形成された凹み部Ｈにおいて粘着部１３の裏面１３ａが部品収納部１１の底部１１ａに接着し、突出部Ｐでは粘着部１３は接着していないが、例えば図８（ａ）に示すように、突出部Ｐにおいて粘着部１３が接着し、凹み部Ｈでは粘着部１３は接着していなくてもよいし、図９（ａ）に示すように、凹み部Ｈと突出部Ｐの両方において粘着部１３が接着し、すなわち、粘着部１３の裏面１３ａが部品収納部１１の底部１１ａに全面接着していてもよい。
ただし、図２〜７に示すエンボスキャリアテープ１のように、粘着部１３の裏面１３ａが部品収納部１１の底部１１ａに部分接着して接着領域Ｉと非接着領域ＩＩを形成し、かつ接着領域Ｉの位置が非接着領域ＩＩの位置よりも低い方が、部品をピックアップしたときに粘着部１３が伸びやすく、変形しやすい。 Moreover, the embossed carrier tape 1 shown in FIGS. 2-7 has the back surface 13a of the adhesion part 13 adhere | attached on the bottom part 11a of the components storage part 11 in the recessed part H formed in the inner surface of the bottom part 11a of the components storage part 11, and protrudes. Although the adhesive part 13 is not bonded to the part P, for example, as shown in FIG. 8A, the adhesive part 13 is bonded to the protruding part P, and the adhesive part 13 is not bonded to the recessed part H. As shown in FIG. 9A, the adhesive portion 13 is bonded to both the recessed portion H and the protruding portion P, that is, the back surface 13 a of the adhesive portion 13 is bonded to the bottom portion 11 a of the component storage portion 11. May be.
However, like the embossed carrier tape 1 shown in FIGS. 2 to 7, the back surface 13 a of the adhesive portion 13 is partially bonded to the bottom portion 11 a of the component storage portion 11 to form an adhesive region I and a non-adhesive region II, and the adhesive region When the position of I is lower than the position of the non-adhesive region II, the pressure-sensitive adhesive portion 13 is easily stretched and easily deformed when a component is picked up.

＜部品収納体＞
次に、本発明の部品収納体について、図面を参照して説明する。図３は、図２に示す第１実施形態のエンボスキャリアテープ１に部品２０が収納された部品収納体１００を幅方向に切断した断面図である。
部品２０としては特に限定されないが、半導体チップや、セラミックコンデンサ、チップ抵抗、コイル等の電子部品などが好適である。
電子部品の大きさについても特に限定されず、０６０３、０４０２、０３０１５、０２０１など、各大きさの電子部品に対応できる。また、薄くて割れやすい半導体チップや、壊れやすい電子部品（例えば三次元積層チップ、ＭＥＭＳ等）など、振動や衝撃により破損しやすい部品にも対応できる。 <Parts container>
Next, the component storage body of the present invention will be described with reference to the drawings. FIG. 3 is a cross-sectional view of the component storage body 100 in which the component 20 is stored in the embossed carrier tape 1 of the first embodiment shown in FIG. 2 cut in the width direction.
Although it does not specifically limit as the component 20, Electronic components, such as a semiconductor chip, a ceramic capacitor, chip resistance, a coil, etc. are suitable.
There is no particular limitation on the size of the electronic component, and the electronic component can correspond to electronic components of various sizes such as 0603, 0402, 03015, and 0201. Further, it can cope with components that are easily damaged by vibration or impact, such as thin and easily broken semiconductor chips and easily broken electronic components (for example, three-dimensional laminated chips, MEMS, etc.).

この例の部品収納体１００は、部品２０が、エンボスキャリアテープ１の粘着部１３の凸部Ｃに接して、粘着部１３の表面１３ｂに粘着固定され、部品２０と粘着部１３との間に隙間Ｇが形成されている。
部品収納体１００は、通常、図１０に示すように、部品が収納された部品収納部がカバーテープ３０で封止され、さらにリール４０に巻き取られた状態で保管、搬送される。カバーテープ３０の材質としては、基材シート１０と同様の材質のものが挙げられる。 In the component container 100 of this example, the component 20 is in contact with the convex portion C of the adhesive portion 13 of the embossed carrier tape 1 and is adhesively fixed to the surface 13 b of the adhesive portion 13, and between the component 20 and the adhesive portion 13. A gap G is formed.
As shown in FIG. 10, the component storage body 100 is normally stored and transported in a state in which a component storage portion in which components are stored is sealed with a cover tape 30 and wound around a reel 40. Examples of the material of the cover tape 30 include the same material as that of the base sheet 10.

以上説明した本発明の部品収納体１００は、本発明のエンボスキャリアテープ１の部品収納部１１に部品２０が収納されている。よって、部品２０が搬送等の衝撃で破損しやすい場合でも、保持性に優れる。   In the component storage body 100 of the present invention described above, the component 20 is stored in the component storage portion 11 of the embossed carrier tape 1 of the present invention. Therefore, even when the component 20 is easily damaged by an impact such as conveyance, the retainability is excellent.

また、部品２０を実装する際は、カバーテープを剥離しながらバキュームピンセットなどを用いて部品２０を一つずつピックアップし、基板等に載置するが、本発明の部品収納体１００であれば、部品２０と粘着部１３との間に隙間Ｇが形成され、この隙間Ｇが部品２０をピックアップする際の剥離の起点となる。すなわち、部品２０と粘着部１３との間に隙間Ｇが形成されていると、図４に示すように、部品２０を持ち上げたときに隙間Ｇを剥離の起点として部品２０が粘着部１３から剥がれていくとともに、粘着材料からなる粘着部が伸びて変形する。その結果、隙間Ｇが徐々に大きくなっていくことで部品２０と粘着部１３の接触面積が小さくなり、部品２０を容易にピックアップできる。このとき、接着領域Ｉの部分の粘着部１３は接着部１４によって部品収納部１１の底部１１ａに接着固定されているので、非接着領域ＩＩの部分の粘着部１３が伸びやすく、変形しやすいため、部品２０が粘着部１３から剥がれやすくなる。よって、ピンなどの専用の治具を用いなくても部品２０を容易にピックアップできる。   Further, when mounting the component 20, the components 20 are picked up one by one using vacuum tweezers while peeling the cover tape and placed on a substrate or the like. A gap G is formed between the component 20 and the adhesive portion 13, and this gap G is a starting point of peeling when the component 20 is picked up. That is, when the gap G is formed between the component 20 and the adhesive portion 13, as shown in FIG. 4, when the component 20 is lifted, the component 20 is peeled from the adhesive portion 13 with the gap G as a starting point of peeling. At the same time, the adhesive part made of an adhesive material stretches and deforms. As a result, the gap G gradually increases, so that the contact area between the component 20 and the adhesive portion 13 is reduced, and the component 20 can be easily picked up. At this time, since the adhesive portion 13 in the adhesive region I is bonded and fixed to the bottom 11a of the component storage portion 11 by the adhesive portion 14, the adhesive portion 13 in the non-adhesive region II is easy to stretch and deform easily. The component 20 is easily peeled off from the adhesive portion 13. Therefore, the component 20 can be easily picked up without using a dedicated jig such as a pin.

なお、本実施形態の部品収納体は、図３、４に示す形態に限定されない。図３、４に示す部品収納体１００は、図１に示すように部品収納部１１の底部１１ａの内面の周縁に凹み部Ｈが形成され、さらに底部１１ａの内面の縦横中央にも十字状の凹み部Ｈが形成されているエンボスキャリアテープ１に部品２０が収納されているが、例えば図５（ｂ）に示すように、底部１１ａの内面の周縁のみに凹み部Ｈが形成されているエンボスキャリアテープ１や、図６（ｂ）、図７（ｂ）に示すように、底部１１ａの内面の周縁以外の場所に凹み部Ｈが形成されているエンボスキャリアテープ１に部品２０が収納されていてもよい。さらに、例えば図８（ｂ）に示すように、突出部Ｐにおいて粘着部１３の裏面１３ａが部品収納部１１の底部１１ａに接着し、凹み部Ｈでは粘着部１３は接着していないエンボスキャリアテープ１や、図９（ｂ）に示すように、凹み部Ｈと突出部Ｐの両方において粘着部１３の裏面１３ａが部品収納部１１の底部１１ａに接着しているエンボスキャリアテープ１に部品２０が収納されていてもよい。   In addition, the component storage body of this embodiment is not limited to the form shown in FIGS. As shown in FIG. 1, the component storage body 100 shown in FIGS. 3 and 4 is formed with a recess H at the periphery of the inner surface of the bottom portion 11 a of the component storage portion 11, and also has a cross shape at the vertical and horizontal centers of the inner surface of the bottom portion 11 a. The component 20 is housed in the embossed carrier tape 1 in which the recess H is formed. For example, as shown in FIG. 5B, the embossment in which the recess H is formed only at the periphery of the inner surface of the bottom 11a. As shown in FIGS. 6B and 7B, the component 20 is housed in the carrier tape 1 or the embossed carrier tape 1 in which the recessed portion H is formed in a place other than the peripheral edge of the inner surface of the bottom portion 11a. May be. Further, for example, as shown in FIG. 8B, an embossed carrier tape in which the back surface 13 a of the adhesive portion 13 is bonded to the bottom portion 11 a of the component storage portion 11 in the protruding portion P and the adhesive portion 13 is not bonded to the recessed portion H. 1 and as shown in FIG. 9B, the component 20 is attached to the embossed carrier tape 1 in which the back surface 13a of the adhesive portion 13 is bonded to the bottom portion 11a of the component storage portion 11 in both the recessed portion H and the protruding portion P. It may be stored.

［第２実施形態］
＜エンボスキャリアテープ＞
次に、本発明の第２実施形態のエンボスキャリアテープについて、図面を参照して説明する。図１１は、本実施形態のエンボスキャリアテープ２の斜視図であり、図１２は図１１に示すにエンボスキャリアテープ１に部品２０が収納された部品収納体２００を幅方向に切断した断面図である。 [Second Embodiment]
<Embossed carrier tape>
Next, the embossed carrier tape of 2nd Embodiment of this invention is demonstrated with reference to drawings. FIG. 11 is a perspective view of the embossed carrier tape 2 of the present embodiment, and FIG. 12 is a cross-sectional view of the component storage body 200 in which the component 20 is stored in the embossed carrier tape 1 shown in FIG. is there.

本実施形態のエンボスキャリアテープ２は、フィルム状の粘着部１３の裏面１３ａの周縁が、接着部１４を介して部品収納部１１の底部１１ａに部分接着して設けられ、かつ接着領域Ｉにおいて粘着部１３の表面１３ｂがブラスト処理され、複数の微細な凸部Ｃと凹部とが形成され、凹凸形状となっている。
よって、粘着部１３の表面１３ｂに部品を粘着固定すると、図１２に示すように、粘着部１３の表面１３ｂの凹凸形状となっている部分において、部品２０と粘着部１３との間に剥離の起点となる隙間Ｇが形成される。そのため、部品２０を持ち上げたときに隙間Ｇを剥離の起点として部品２０が粘着部１３から剥がれていくとともに、粘着材料からなる粘着部１３が伸びて変形する。その結果、隙間Ｇが徐々に大きくなっていくことで部品２０と粘着部１３の接触面積が小さくなり、部品２０を容易にピックアップできる。
なお、図１１において、ブラスト処理により形成された複数の微細な凸部と凹部は省略する。 The embossed carrier tape 2 of the present embodiment is provided such that the peripheral edge of the back surface 13a of the film-like pressure-sensitive adhesive portion 13 is partially bonded to the bottom portion 11a of the component storage portion 11 via the bonding portion 14, and is sticky in the bonding region I. The surface 13b of the portion 13 is blasted to form a plurality of fine convex portions C and concave portions, and has an uneven shape.
Therefore, when the component is adhesively fixed to the surface 13b of the adhesive portion 13, the peeling between the component 20 and the adhesive portion 13 occurs in the uneven portion of the surface 13b of the adhesive portion 13 as shown in FIG. A gap G serving as a starting point is formed. Therefore, when the component 20 is lifted, the component 20 is peeled from the adhesive portion 13 with the gap G as a starting point of peeling, and the adhesive portion 13 made of an adhesive material is extended and deformed. As a result, the gap G gradually increases, so that the contact area between the component 20 and the adhesive portion 13 is reduced, and the component 20 can be easily picked up.
In FIG. 11, a plurality of fine convex portions and concave portions formed by blasting are omitted.

また、本実施形態のエンボスキャリアテープ２は、粘着部１３の裏面１３ａが部品収納部１１の底部１１ａに部分接着し、非接着領域ＩＩが形成されている。
よって、部品２０を持ち上げたときに、接着領域Ｉの部分の粘着部１３は接着部１４によって部品収納部１１の底部１１ａに接着固定されているので、非接着領域ＩＩの部分の粘着部１３が伸びやすく、変形しやすい。従って、部品２０をより容易にピックアップできる。 Further, in the embossed carrier tape 2 of the present embodiment, the back surface 13a of the adhesive portion 13 is partially bonded to the bottom portion 11a of the component storage portion 11 to form a non-adhesive region II.
Therefore, when the component 20 is lifted, the adhesive portion 13 in the adhesive region I is bonded and fixed to the bottom 11a of the component storage portion 11 by the adhesive portion 14, so that the adhesive portion 13 in the non-adhesive region II is Easily stretch and deform easily. Therefore, the component 20 can be picked up more easily.

さらに、本実施形態のエンボスキャリアテープ２は、部品２０の粘着部１３に接する側の面２０ａの全面が粘着部１３に接して粘着固定されているので、部品２０を部品収納部１１に収納したときの保持性が高まり、搬送時などにおいて部品２０が粘着部１３から剥がれにくい。   Further, the embossed carrier tape 2 of the present embodiment has the part 20 stored in the part storage part 11 because the entire surface 20a of the part 20 on the side in contact with the adhesive part 13 is in contact with and fixed to the adhesive part 13. Holdability is improved, and the component 20 is less likely to be peeled off from the adhesive portion 13 during transportation.

エンボスキャリアテープ２は、例えば以下のようにして製造できる。
まず、部品収納部１１の底部１１ａが図１１、１２に示す形状となるような金型を用い、基材シート１０をエンボス加工して、部品収納部１１を形成する。
ついで、基材シート１０の幅方向の一方の端部側に送り孔１２を形成する。送り孔１２の形成方法としては、公知の穿孔方法を適用できる。
ついで、部品収納部１１の底部１１ａの周縁４辺に接着剤を塗布する。
別途、粘着材料からなるフィルム状の粘着部１３の表面１３ｂの周縁をブラスト処理しておく。ブラスト処理の方法としては、サンドブラスト処理などが挙げられる。
ブラスト処理済みの粘着部１３を部品収納部１１の底部１１ａに貼り付け、部品収納部１１の底部１１ａに粘着部１３を部分接着させて、エンボスキャリアテープ２を得る。
なお、送り孔１２は、エンボス加工と同時に成形してもよいし、エンボス加工の前に形成してもよいし、エンボス加工の後かつ粘着部１３の接着前に形成してもよいし、粘着部１３の接着後に形成してもよい。また、接着剤からなる両面テープを部品収納部１１の底部１１ａの周縁４辺に貼着してもよい。さらに、ブラスト処理は粘着部１３を部品収納部１１の底部１１ａに接着した後でもよい。 The embossed carrier tape 2 can be manufactured as follows, for example.
First, the base material sheet 10 is embossed using a mold such that the bottom part 11a of the part storage part 11 has the shape shown in FIGS.
Next, the feed hole 12 is formed on one end side in the width direction of the base sheet 10. As a method for forming the feed hole 12, a known drilling method can be applied.
Next, an adhesive is applied to the four peripheral edges of the bottom 11 a of the component storage unit 11.
Separately, the peripheral edge of the surface 13b of the film-like adhesive portion 13 made of an adhesive material is blasted. Examples of the blasting method include sandblasting.
The embossed carrier tape 2 is obtained by attaching the blast-treated adhesive part 13 to the bottom part 11a of the component storage part 11 and partially bonding the adhesive part 13 to the bottom part 11a of the part storage part 11.
The feed hole 12 may be formed at the same time as the embossing, may be formed before the embossing, may be formed after the embossing and before the adhesion portion 13 is adhered, You may form after adhesion | attachment of the part 13. FIG. Alternatively, a double-sided tape made of an adhesive may be attached to the four peripheral edges of the bottom 11 a of the component storage unit 11. Further, the blasting process may be performed after the adhesive portion 13 is bonded to the bottom portion 11 a of the component storage portion 11.

以上説明したように、本発明のエンボスキャリアテープ２は、部品収納部１１の底部１１ａに粘着部１３が接着して設けられているので、部品２０を粘着部１３の表面１３ｂに粘着固定でき、破損しやすい部品を収納する場合でも保持性に優れる。
また、本発明のエンボスキャリアテープ２は、ピンなどの専用の治具を用いなくても部品２０を容易にピックアップできる。また、本発明のエンボスキャリアテープ２は部品２０を容易にピックアップできるので、粘着部１３の粘着力分布が不均一になるように粘着材料を設計したり、部品収納部１１の形状を複雑に成形したりする必要がない。よって、生産性にも優れる。 As described above, since the embossed carrier tape 2 of the present invention is provided with the adhesive portion 13 bonded to the bottom portion 11a of the component storage portion 11, the component 20 can be adhesively fixed to the surface 13b of the adhesive portion 13, Excellent retention even when storing easily damaged parts.
The embossed carrier tape 2 of the present invention can easily pick up the component 20 without using a dedicated jig such as a pin. In addition, since the embossed carrier tape 2 of the present invention can easily pick up the component 20, an adhesive material is designed so that the adhesive force distribution of the adhesive portion 13 is non-uniform, or the shape of the component storage portion 11 is complicatedly formed. There is no need to do. Therefore, productivity is also excellent.

なお、本実施形態のエンボスキャリアテープは、図１１、１２に示す形態に限定されない。図１１、１２に示すエンボスキャリアテープ２は、粘着部１３の裏面１３ａの周縁のみが部品収納部１１の底部１１ａに接着しているが、例えば図１３（ａ）に示すように、粘着部１３の裏面１３ａの中央など、周縁以外の場所が底部１１ａに接着していてもよい。   In addition, the embossed carrier tape of this embodiment is not limited to the form shown in FIGS. In the embossed carrier tape 2 shown in FIGS. 11 and 12, only the peripheral edge of the back surface 13a of the adhesive portion 13 is bonded to the bottom portion 11a of the component storage portion 11. For example, as shown in FIG. A place other than the periphery, such as the center of the back surface 13a, may be bonded to the bottom 11a.

また、図１１〜１３に示すエンボスキャリアテープ２は、接着領域Ｉにおいて粘着部１３の表面１３ｂがブラスト処理され、複数の微細な凸部と凹部とが形成され、凹凸形状となっているが、ブラスト処理される場所は接着領域Ｉに限定されない。ブラスト処理される場所は、部品が粘着部の表面に粘着固定された際に、粘着部の部品が接する部分の表面の少なくとも一部がブラスト処理されていれば、例えば図１４（ａ）に示すように、非接着領域ＩＩにおいてブラスト処理されていてもよい。
ただし、図１２に示すように、接着領域Ｉと非接着領域ＩＩの両方で部品２０が粘着部１３に接している場合は、少なくとも接着領域Ｉにおいて粘着部１３の表面１３ｂがブラスト処理されている方が、部品をピックアップしたときに粘着部１３が伸びやすく、変形しやすい。 In addition, the embossed carrier tape 2 shown in FIGS. 11 to 13 has a concavo-convex shape in which the surface 13b of the adhesive portion 13 is blasted in the adhesion region I to form a plurality of fine convex portions and concave portions. The place to be blasted is not limited to the adhesion region I. For example, FIG. 14A shows a place where the blasting process is performed, if at least a part of the surface of the part where the part of the adhesive part contacts is blasted when the part is adhesively fixed to the surface of the adhesive part. As such, blasting may be performed in the non-adhesion region II.
However, as shown in FIG. 12, when the component 20 is in contact with the adhesive portion 13 in both the adhesion region I and the non-adhesion region II, the surface 13b of the adhesion portion 13 is blasted at least in the adhesion region I. On the other hand, when the part is picked up, the adhesive portion 13 is easily stretched and easily deformed.

また、図１１〜１４に示すエンボスキャリアテープ２は、粘着部１３が部品収納部１１の底部１１ａに部分接着しているが、例えば図１５（ａ）に示すように、粘着部１３は部品収納部１１の底部１１ａに全面接着していてもよい。粘着部１３が全面接着している場合、ブラスト処理される場所は、部品が粘着部の表面に粘着固定された際に、粘着部の部品が接する部分の表面の少なくとも一部がブラスト処理されていれば特に限定されず、図１５（ａ）に示すように粘着部１３の表面１３ｂの一部でもよいし、部品の保持性を維持できれば全面でもよい。ただし、部品のピックアップ性を考慮すると、部品が粘着部の表面に粘着固定された際に、部品の両端部が接する部分の粘着部の表面がブラスト処理されていることが好ましい。   Further, in the embossed carrier tape 2 shown in FIGS. 11 to 14, the adhesive portion 13 is partially bonded to the bottom 11a of the component storage portion 11. For example, as shown in FIG. The entire surface may be bonded to the bottom 11 a of the portion 11. When the adhesive part 13 is adhered to the entire surface, the blasting place is such that when the part is adhesively fixed to the surface of the adhesive part, at least a part of the surface of the part where the part of the adhesive part contacts is blasted. If it is not limited, it may be a part of the surface 13b of the adhesive portion 13 as shown in FIG. However, considering the pick-up property of the component, it is preferable that the surface of the adhesive portion where the both ends of the component are in contact with each other is blasted when the component is adhesively fixed to the surface of the adhesive portion.

＜部品収納体＞
次に、本発明の部品収納体について、図面を参照して説明する。図１２は、第２実施形態のエンボスキャリアテープ２に部品２０が収納された部品収納体２００の断面図である。
この例の部品収納体２００は、部品２０が、エンボスキャリアテープ２の粘着部１３のブラスト処理された部分にかかるように、粘着部１３の表面１３ｂに粘着固定され、部品２０と粘着部１３との間に隙間Ｇが形成されている。
部品収納体２００は、第１実施形態の部品収納体と同様に、通常は、部品が収納された部品収納部がカバーテープで封止され、さらにリールに巻き取られた状態で保管、搬送される。 <Parts container>
Next, the component storage body of the present invention will be described with reference to the drawings. FIG. 12 is a cross-sectional view of a component storage body 200 in which the component 20 is stored in the embossed carrier tape 2 of the second embodiment.
The component container 200 of this example is adhesively fixed to the surface 13b of the adhesive portion 13 so that the component 20 is applied to the blasted portion of the adhesive portion 13 of the embossed carrier tape 2, and the component 20 and the adhesive portion 13 A gap G is formed between the two.
As in the case of the component storage unit according to the first embodiment, the component storage unit 200 is normally stored and transported in a state in which a component storage unit in which components are stored is sealed with a cover tape and wound around a reel. The

以上説明した本発明の部品収納体２００は、本発明のエンボスキャリアテープ２の部品収納部１１に部品２０が収納されている。よって、部品２０が搬送等の衝撃で破損しやすい部品であっても、保持性に優れる。特に、部品収納体２００は、部品２０の粘着部１３に接する側の面２０ａの全面が粘着部１３に接して粘着固定されているので、部品２０を部品収納部１１に収納したときの保持性が高まり、搬送時などにおいて部品２０が粘着部１３から剥がれにくい。   In the component storage body 200 of the present invention described above, the component 20 is stored in the component storage portion 11 of the embossed carrier tape 2 of the present invention. Therefore, even if the component 20 is a component that is easily damaged by an impact such as conveyance, the retainability is excellent. Particularly, since the entire surface 20a of the component 20 on the side in contact with the adhesive portion 13 is adhesively fixed in contact with the adhesive portion 13, the component storage body 200 retains when the component 20 is stored in the component storage portion 11. And the component 20 is unlikely to be peeled off from the adhesive portion 13 during transportation.

また、本発明の部品収納体２００であれば、部品２０と粘着部１３との間に隙間Ｇが形成され、この隙間Ｇが部品２０をピックアップする際の剥離の起点となる。また、部品２０を持ち上げたときに粘着部１３も引っ張られやすくなり、粘着部１３が伸びて変形しやすい。よって、ピンなどの専用の治具を用いなくても部品２０を容易にピックアップできる。   Further, in the case of the component storage body 200 of the present invention, a gap G is formed between the component 20 and the adhesive portion 13, and this gap G becomes a starting point of peeling when the component 20 is picked up. Further, when the component 20 is lifted, the adhesive portion 13 is also easily pulled, and the adhesive portion 13 is easily extended and deformed. Therefore, the component 20 can be easily picked up without using a dedicated jig such as a pin.

なお、本実施形態の部品収納体は、図１２に示す形態に限定されない。図１２に示す部品収納体２００は、粘着部１３の裏面１３ａの周縁のみが部品収納部１１の底部１１ａに接着しているエンボスキャリアテープ２に部品２０が収納されているが、例えば図１３（ｂ）に示すように、粘着部１３の裏面１３ａの中央など、周縁以外の場所が底部１１ａに接着しているエンボスキャリアテープ２や、図１４（ｂ）に示すように、非接着領域ＩＩにおいて粘着部１３の表面１３ｂがブラスト処理されているエンボスキャリアテープ２に部品２０が収納されていてもよい。また、図１５（ｂ）に示すように、粘着部１３が部品収納部１１の底部１１ａに全面接着しているエンボスキャリアテープ２に部品２０が収納されていてもよい。   In addition, the component storage body of this embodiment is not limited to the form shown in FIG. In the component storage body 200 shown in FIG. 12, the component 20 is stored in the embossed carrier tape 2 in which only the periphery of the back surface 13a of the adhesive portion 13 is bonded to the bottom portion 11a of the component storage portion 11. For example, FIG. As shown in FIG. 14B, the embossed carrier tape 2 in which a place other than the periphery such as the center of the back surface 13a of the adhesive portion 13 is adhered to the bottom 11a, or in the non-adhesive region II as shown in FIG. The component 20 may be accommodated in the embossed carrier tape 2 in which the surface 13b of the adhesive portion 13 is blasted. Further, as shown in FIG. 15B, the component 20 may be stored in the embossed carrier tape 2 in which the adhesive portion 13 is bonded to the bottom portion 11 a of the component storage portion 11.

［第３実施形態］
＜エンボスキャリアテープ＞
次に、本発明の第３実施形態のエンボスキャリアテープについて、図面を参照して説明する。図１６は、本実施形態のエンボスキャリアテープ３の斜視図であり、図１７は図１６に示すにエンボスキャリアテープ３に部品２０が収納された部品収納体３００を幅方向に切断した断面図である。 [Third Embodiment]
<Embossed carrier tape>
Next, an embossed carrier tape according to a third embodiment of the present invention will be described with reference to the drawings. FIG. 16 is a perspective view of the embossed carrier tape 3 of this embodiment, and FIG. 17 is a cross-sectional view of the component storage body 300 in which the components 20 are stored in the embossed carrier tape 3 shown in FIG. is there.

本実施形態のエンボスキャリアテープ３は、粘着部１３の裏面１３ａが部品収納部１１の底部１１ａに全面接着して設けられ、かつ粘着部１３の表面１３ｂが外側に（部品収納部１１の開口部に向って）湾曲して、１つの凸部Ｃを形成している。
よって、粘着部１３の表面１３ｂに部品を粘着固定すると、図１７に示すように、部品２０と粘着部１３との間に隙間Ｇが形成される。そのため、部品２０を持ち上げたときに隙間Ｇを剥離の起点として部品２０が粘着部１３から剥がれていくとともに、粘着材料からなる粘着部１３が伸びて変形する。その結果、隙間Ｇが徐々に大きくなっていくことで部品２０と粘着部１３の接触面積が小さくなり、部品２０を容易にピックアップできる。 The embossed carrier tape 3 of the present embodiment is provided with the back surface 13a of the adhesive portion 13 adhered to the bottom portion 11a of the component storage portion 11 and the surface 13b of the adhesive portion 13 outward (the opening of the component storage portion 11). Curved) to form one convex portion C.
Therefore, when the component is adhesively fixed to the surface 13b of the adhesive portion 13, a gap G is formed between the component 20 and the adhesive portion 13 as shown in FIG. Therefore, when the component 20 is lifted, the component 20 is peeled from the adhesive portion 13 with the gap G as a starting point of peeling, and the adhesive portion 13 made of an adhesive material is extended and deformed. As a result, the gap G gradually increases, so that the contact area between the component 20 and the adhesive portion 13 is reduced, and the component 20 can be easily picked up.

エンボスキャリアテープ３は、例えば以下のようにして製造できる。
まず、部品収納部１１の底部１１ａが図１６、１７に示す形状となるような金型を用い、基材シート１０をエンボス加工して、部品収納部１１を形成する。
ついで、基材シート１０の幅方向の一方の端部側に送り孔１２を形成する。送り孔１２の形成方法としては、公知の穿孔方法を適用できる。
ついで、部品収納部１１の底部１１ａの全面に接着剤を塗布する。
別途、表面１３ｂが外側に湾曲するように粘着部１３を作製しておき、この粘着部１３を部品収納部１１の底部１１ａに貼り付け、部品収納部１１の底部１１ａに粘着部１３を全面接着させて、エンボスキャリアテープ３を得る。
なお、送り孔１２は、エンボス加工と同時に成形してもよいし、エンボス加工の前に形成してもよいし、エンボス加工の後かつ粘着部１３の接着前に形成してもよいし、粘着部１３の接着後に形成してもよい。また、接着剤からなる両面テープを部品収納部１１の底部１１ａの全面に貼着してもよい。 The embossed carrier tape 3 can be manufactured as follows, for example.
First, the base material sheet 10 is embossed using a mold such that the bottom part 11a of the part storage part 11 has the shape shown in FIGS.
Next, the feed hole 12 is formed on one end side in the width direction of the base sheet 10. As a method for forming the feed hole 12, a known drilling method can be applied.
Next, an adhesive is applied to the entire surface of the bottom portion 11 a of the component storage portion 11.
Separately, the adhesive portion 13 is prepared so that the surface 13b is curved outward, the adhesive portion 13 is attached to the bottom portion 11a of the component storage portion 11, and the adhesive portion 13 is adhered to the bottom portion 11a of the component storage portion 11 on the entire surface. The embossed carrier tape 3 is obtained.
The feed hole 12 may be formed at the same time as the embossing, may be formed before the embossing, may be formed after the embossing and before the adhesion portion 13 is adhered, You may form after adhesion | attachment of the part 13. FIG. Further, a double-sided tape made of an adhesive may be attached to the entire surface of the bottom 11 a of the component storage unit 11.

以上説明したように、本発明のエンボスキャリアテープ３は、部品収納部１１の底部１１ａに粘着部１３が接着して設けられているので、部品２０を粘着部１３の表面１３ｂに粘着固定でき、破損しやすい部品を収納する場合でも保持性に優れる。
また、本発明のエンボスキャリアテープ３は、ピンなどの専用の治具を用いなくても部品２０を容易にピックアップできる。また、本発明のエンボスキャリアテープ３は部品２０を容易にピックアップできるので、粘着部１３の粘着力分布が不均一になるように粘着材料を設計したり、部品収納部１１の形状を複雑に成形したりする必要がない。よって、生産性にも優れる。 As described above, since the embossed carrier tape 3 of the present invention is provided with the adhesive portion 13 adhered to the bottom portion 11a of the component storage portion 11, the component 20 can be adhesively fixed to the surface 13b of the adhesive portion 13, Excellent retention even when storing easily damaged parts.
The embossed carrier tape 3 of the present invention can easily pick up the component 20 without using a dedicated jig such as a pin. In addition, since the embossed carrier tape 3 of the present invention can easily pick up the component 20, an adhesive material is designed so that the adhesive force distribution of the adhesive portion 13 becomes non-uniform, or the shape of the component storage portion 11 is complicatedly formed. There is no need to do. Therefore, productivity is also excellent.

＜部品収納体＞
次に、本発明の部品収納体について、図面を参照して説明する。図１７は、第３実施形態のエンボスキャリアテープ３に部品２０が収納された部品収納体３００の断面図である。
この例の部品収納体３００は、部品２０が、エンボスキャリアテープ３の粘着部１３の凸部Ｃに接して、粘着部１３の表面１３ｂに粘着固定され、部品２０と粘着部１３との間に隙間Ｇが形成されている。
部品収納体２００は、第１実施形態の部品収納体と同様に、通常は、部品が収納された部品収納部がカバーテープで封止され、さらにリールに巻き取られた状態で保管、搬送される。 <Parts container>
Next, the component storage body of the present invention will be described with reference to the drawings. FIG. 17 is a cross-sectional view of a component storage body 300 in which the component 20 is stored in the embossed carrier tape 3 of the third embodiment.
In the component container 300 of this example, the component 20 is in contact with the convex portion C of the adhesive portion 13 of the embossed carrier tape 3 and is adhesively fixed to the surface 13 b of the adhesive portion 13, and between the component 20 and the adhesive portion 13. A gap G is formed.
As in the case of the component storage unit according to the first embodiment, the component storage unit 200 is normally stored and transported in a state in which a component storage unit in which components are stored is sealed with a cover tape and wound around a reel. The

以上説明した本発明の部品収納体２００は、本発明のエンボスキャリアテープ３の部品収納部１１に部品２０が収納されている。よって、部品２０が搬送等の衝撃で破損しやすい部品であっても、保持性に優れる。   In the component storage body 200 of the present invention described above, the component 20 is stored in the component storage portion 11 of the embossed carrier tape 3 of the present invention. Therefore, even if the component 20 is a component that is easily damaged by an impact such as conveyance, the retainability is excellent.

また、本発明の部品収納体３００であれば、部品２０と粘着部１３との間に隙間Ｇが形成され、この隙間Ｇが部品２０をピックアップする際の剥離の起点となる。また、部品２０を持ち上げたときに粘着部１３も引っ張られやすくなり、粘着部１３が伸びて変形しやすい。よって、ピンなどの専用の治具を用いなくても部品２０を容易にピックアップできる。   Further, in the case of the component storage body 300 of the present invention, a gap G is formed between the component 20 and the adhesive portion 13, and this gap G becomes a starting point of peeling when the component 20 is picked up. Further, when the component 20 is lifted, the adhesive portion 13 is also easily pulled, and the adhesive portion 13 is easily extended and deformed. Therefore, the component 20 can be easily picked up without using a dedicated jig such as a pin.

以下、本発明について実施例を示して具体的に説明する。   Hereinafter, the present invention will be specifically described with reference to examples.

［実施例１］
スチレン系樹脂からなる長尺な基材シート（幅２４ｍｍ×厚さ０．３ｍｍ）をプレス成形機に移送し、縦１０ｍｍ×横１５ｍｍ×深さ２ｍｍであり、図１に示すような底部の内面の周縁および縦横中央に幅ｗが１ｍｍ、深さｈが５０μｍの凹み部Ｈが形成された平面視四角状の部品収納部１１を、長さ方向に沿って２０ｍｍピッチで成形した。また、直径１．５ｍｍの位置決めのための送り孔を打ち抜き加工した。
ついで、凹み部Ｈにエポキシ系接着剤を厚さが３０μｍになるように塗布して接着部を形成し、その上に、ポリプロピレン系エラストマー（三菱化学株式会社製、「ゼラス」）からなるフィルム（厚さ５０μｍ）を、縦１０ｍｍ×横１５ｍｍにカットしたものを、弛まないように接着して粘着部を形成し、図２に示すようなエンボスキャリアテープ１を得た。
得られたエンボスキャリアテープ１の粘着部１３の表面の中央に、部品２０として縦９ｍｍ×横１４ｍｍ×厚さ２００μｍのチップを粘着固定し、部品収納部１１に部品２０を収納し、図１８に示すような部品収納体１００Ａを得た。 [Example 1]
A long base material sheet (width 24 mm × thickness 0.3 mm) made of styrene resin is transferred to a press molding machine, the length is 10 mm × width 15 mm × depth 2 mm, and the bottom inner surface as shown in FIG. The rectangular component housing part 11 in which a recess H having a width w of 1 mm and a depth h of 50 μm was formed at the peripheral edge and the vertical and horizontal center of the was formed at a pitch of 20 mm along the length direction. Further, a feed hole for positioning with a diameter of 1.5 mm was punched.
Next, an adhesive is formed by applying an epoxy adhesive to the recess H so as to have a thickness of 30 μm, and a film made of a polypropylene elastomer (“ZELATH” manufactured by Mitsubishi Chemical Corporation) An adhesive part was formed by adhering a piece having a thickness of 50 μm cut to a length of 10 mm × width of 15 mm so as not to loosen, and an embossed carrier tape 1 as shown in FIG. 2 was obtained.
In the center of the surface of the adhesive part 13 of the resulting embossed carrier tape 1, a chip having a length of 9 mm, a width of 14 mm and a thickness of 200 μm is adhesively fixed as a part 20, and the part 20 is stored in the part storage part 11 as shown in FIG. A component housing 100A as shown was obtained.

得られた部品収納体１００Ａは、図３に示すように、部品２０が凸部Ｃにて粘着部１３と接し、粘着部１３との間に隙間Ｇが形成され、この隙間Ｇが形成していた。
この部品収納体１００Ａを１０ｃｍの長さに切り出し、部品収納部１１を下向きにして１０ｃｍの高さからテーブル上に落下させたが、部品２０は粘着部１３から剥がれず、良好な保持性を示した。
次に、部品収納部１１を上向きにして部品収納体１００Ａを作業台に固定し、部品２０を上方からバキュームピンセットで持ち上げたところ、粘着部１３が徐々に剥がれていき、最終的に全てが剥がれ、部品２０をエンボスキャリアテープ１の部品収納部１１から容易に取り出すことができ、良好なピックアップ性を示した。 As shown in FIG. 3, in the obtained component storage body 100 </ b> A, the component 20 is in contact with the adhesive portion 13 at the convex portion C, and a gap G is formed between the component 20 and the adhesive portion 13. It was.
The component storage body 100A was cut out to a length of 10 cm and dropped onto the table from a height of 10 cm with the component storage portion 11 facing downward, but the component 20 did not peel off from the adhesive portion 13 and showed good holding properties. It was.
Next, the component storage body 100A is fixed to the work table with the component storage portion 11 facing upward, and when the component 20 is lifted with vacuum tweezers from above, the adhesive portion 13 is gradually peeled off and finally all peels off. The component 20 could be easily taken out from the component storage portion 11 of the embossed carrier tape 1 and showed good pick-up properties.

［比較例１］
ポリ塩化ビニルからなる長尺な基材シート（幅２４ｍｍ×厚さ０．３ｍｍ）をプレス成形機に移送し、縦１５ｍｍ×横１５ｍｍ×深さ５ｍｍであり、底部が四角状の部品収納部を、長さ方向に沿って２０ｍｍピッチで成形した。また、直径１．５ｍｍの位置決めのための送り孔を打ち抜き加工した。
ついで、部品収納部の底部の全面に、アクリル系接着剤からなる両面テープを貼り付けて接着部を形成し、その上に、ポリスチレン系エラストマー（住友化学株式会社製、「アクリフト」）からなるフィルム（厚さ１００μｍ）を、縦１５ｍｍ×横１５ｍｍにカットしたものを、弛まないように接着して粘着部を形成し、図１９に示すようなエンボスキャリアテープ４を得た。
得られたエンボスキャリアテープ４の粘着部１３の表面の中央に、部品２０として縦１０ｍｍ×横１０ｍｍ×厚さ１００μｍのチップを粘着固定し、部品収納部１１に部品２０を収納した。 [Comparative Example 1]
A long base sheet made of polyvinyl chloride (width 24 mm x thickness 0.3 mm) is transferred to a press molding machine, and is 15 mm long x 15 mm wide x 5 mm deep, with a square-shaped component storage part at the bottom. Molded at a pitch of 20 mm along the length direction. Further, a feed hole for positioning with a diameter of 1.5 mm was punched.
Next, a double-sided tape made of an acrylic adhesive is applied to the entire bottom surface of the component storage part to form an adhesive part, and a film made of polystyrene elastomer (Sumitomo Chemical Co., Ltd., “ACRlift”) is formed thereon. A (cut thickness of 100 μm) cut into a length of 15 mm × width of 15 mm was bonded so as not to loosen to form an adhesive part, and an embossed carrier tape 4 as shown in FIG. 19 was obtained.
A chip having a length of 10 mm, a width of 10 mm, and a thickness of 100 μm was adhesively fixed as a component 20 at the center of the surface of the adhesive portion 13 of the resulting embossed carrier tape 4, and the component 20 was stored in the component storage portion 11.

部品収納後のエンボスキャリアテープ４を１０ｃｍの長さに切り出し、部品収納部１１を下向きにして１０ｃｍの高さからテーブル上に落下させたが、部品２０は粘着部１３から剥がれず、良好な保持性を示した。
次に、部品収納部１１を上向きにしてエンボスキャリアテープ４を作業台に固定し、部品２０を上方からバキュームピンセットで持ち上げようとしたが、粘着部１３が部品２０から剥がれず、ピックアップできなかった。そこで、部品２０を無理に持ち上げようとしたところ、部品２０が割れた。 The embossed carrier tape 4 after storing the parts was cut out to a length of 10 cm and dropped onto the table from a height of 10 cm with the parts storage part 11 facing downward, but the parts 20 did not peel off from the adhesive part 13 and kept well. Showed sex.
Next, the embossed carrier tape 4 was fixed to the work table with the component storage portion 11 facing upward, and the component 20 was lifted with vacuum tweezers from above, but the adhesive portion 13 was not peeled off from the component 20 and could not be picked up. . Then, when trying to lift the component 20 forcibly, the component 20 was cracked.

１、２、３、４：エンボスキャリアテープ、
５：キャリアテープ、
１０：基材シート、
１１：部品収納部、
１１ａ：底部（部品収納部の底部）、
１２：送り孔、
１３：粘着部、
１３ａ：裏面（粘着部の裏面）、
１３ｂ：表面（粘着部の表面）、
１４：接着部、
２０：部品、
２０ａ：部品の粘着部に接する側の面、
３０：カバーテープ、
４０：リール、
１００、１００Ａ、２００、３００：部品収納体、
Ｃ：凸部、
Ｈ：凹み部、
Ｐ：突出部。
1, 2, 3, 4: Embossed carrier tape,
5: Carrier tape,
10: base material sheet,
11: Parts storage unit,
11a: bottom part (bottom part storage part),
12: Feed hole,
13: Adhesive part,
13a: back side (back side of adhesive part),
13b: surface (surface of the adhesive part),
14: Adhesive part,
20: parts,
20a: surface on the side in contact with the adhesive part of the component
30: Cover tape,
40: reel
100, 100A, 200, 300: parts container,
C: convex part,
H: dent,
P: Protruding part.

Claims (6)

部品を収納するための凹状の部品収納部が形成されたエンボスキャリアテープにおいて、
部品を粘着固定する、可撓性を有する粘着材料からなる粘着部の裏面が、前記部品収納部の底部に接着して設けられ、
前記粘着部の表面に１つ以上の凸部が形成されていることを特徴とするエンボスキャリアテープ。 In an embossed carrier tape formed with a concave component storage part for storing components,
The back surface of the adhesive portion made of a flexible adhesive material that adheres and fixes the component is provided by adhering to the bottom of the component storage portion,
An embossed carrier tape, wherein one or more convex portions are formed on the surface of the adhesive portion. 前記部品収納部の底部の内面に凹み部が形成され、フィルム状の前記粘着部が部品収納部の底部の内面形状に追従するように、粘着部の裏面が凹み部に接着していることを特徴とする請求項１に記載のエンボスキャリアテープ。   A concave portion is formed on the inner surface of the bottom of the component storage portion, and the back surface of the adhesive portion is bonded to the concave portion so that the film-like adhesive portion follows the inner shape of the bottom portion of the component storage portion. The embossed carrier tape according to claim 1. 前記粘着部の表面の少なくとも一部がブラスト処理され、１つ以上の凸部が形成されていることを特徴とする請求項１に記載のエンボスキャリアテープ。   The embossed carrier tape according to claim 1, wherein at least a part of the surface of the adhesive portion is blasted to form one or more convex portions. 前記粘着部の裏面が部品収納部の底部に部分接着し、その接着領域において粘着部の表面がブラスト処理されていることを特徴とする請求項３に記載のエンボスキャリアテープ。   The embossed carrier tape according to claim 3, wherein the back surface of the adhesive portion is partially bonded to the bottom portion of the component storage portion, and the surface of the adhesive portion is blasted in the bonding region. 請求項１〜４のいずれか一項に記載のエンボスキャリアテープの部品収納部に部品が収納された部品収納体であって、
前記部品と粘着部との間に隙間が形成されていることを特徴とする部品収納体。 A component storage body in which components are stored in the component storage portion of the embossed carrier tape according to any one of claims 1 to 4,
A component storage body, wherein a gap is formed between the component and the adhesive portion. 前記部品が収納された部品収納部がカバーテープで封止されたことを特徴とする請求項５に記載の部品収納体。   The component storage body according to claim 5, wherein a component storage portion in which the components are stored is sealed with a cover tape.
JP2012025989A 2012-02-09 2012-02-09 Embossed carrier tape, and component storage body Pending JP2013163525A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012025989A JP2013163525A (en) 2012-02-09 2012-02-09 Embossed carrier tape, and component storage body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012025989A JP2013163525A (en) 2012-02-09 2012-02-09 Embossed carrier tape, and component storage body

Publications (1)

Publication Number Publication Date
JP2013163525A true JP2013163525A (en) 2013-08-22

Family

ID=49175157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012025989A Pending JP2013163525A (en) 2012-02-09 2012-02-09 Embossed carrier tape, and component storage body

Country Status (1)

Country Link
JP (1) JP2013163525A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335787A (en) * 1992-05-28 1993-12-17 Shinko Kagaku Kogyo Kk Tray for electronic component, tray for electronic component with adhesive section attached, and electronic component mounter
JP2006232320A (en) * 2005-02-24 2006-09-07 Daishinku Corp Packaging case for optical devices
JP2008273620A (en) * 2007-03-30 2008-11-13 Shin Etsu Polymer Co Ltd Accommodation body, manufacturing method of carrier tape, and its manufacturing device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335787A (en) * 1992-05-28 1993-12-17 Shinko Kagaku Kogyo Kk Tray for electronic component, tray for electronic component with adhesive section attached, and electronic component mounter
JP2006232320A (en) * 2005-02-24 2006-09-07 Daishinku Corp Packaging case for optical devices
JP2008273620A (en) * 2007-03-30 2008-11-13 Shin Etsu Polymer Co Ltd Accommodation body, manufacturing method of carrier tape, and its manufacturing device

Similar Documents

Publication Publication Date Title
JP5196838B2 (en) Manufacturing method of chip with adhesive
JP4879702B2 (en) Die sort sheet and chip transfer method having adhesive layer
JP4268091B2 (en) Parts holder
JPH07101461A (en) Emboss carrier tape
JPWO2008013153A1 (en) Wafer storage container with cushion sheet
JP5965154B2 (en) Embossed carrier tape and parts container
US11764133B2 (en) Tape carrier assemblies having an integrated adhesive film
JP2007184465A (en) Semiconductor chip tray
KR20180124962A (en) Peeling device
JP2006069633A (en) Tray
US20110233109A1 (en) Insert For Tape And Reel Packaging
JP5927042B2 (en) Embossed carrier tape and parts container
JP2013163525A (en) Embossed carrier tape, and component storage body
JP5679950B2 (en) Electronic component holder
JP4600495B2 (en) Wafer take-out apparatus and semiconductor device manufacturing method
JP6507599B2 (en) Cover tape, packaging material for electronic component packaging, and electronic component package
JP5717502B2 (en) Semiconductor chip holder and method of using the same
JP2010105723A (en) Carrier tape for optical device
JP2020001825A (en) Electronic component storage package and storage method of electronic components
JPH0613327B2 (en) How to store small electronic components
CN110902142B (en) Semiconductor chip carrier and packaging method
KR102102312B1 (en) Laminating apparatus and laminating method
KR20090027382A (en) Cover tape for transferring electric components, transferring tape comprising the same and apparatus comprising the transferring tape
US20030201549A1 (en) Pickup apparatus, pickup method and method for manufacturing semiconductor device
JP5181287B2 (en) Storage tray for flexible printed wiring boards

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150108

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150903

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150915

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20160202