JPH0533562U - Printed circuit board through hole structure - Google Patents

Abstract

(57) [Summary] [Purpose] To increase the component mounting rate of modularized double-sided printed circuit boards with connecting lead legs. [Structure] A through hole 4 is formed by conducting plating so as to extend the connecting lead leg 5 of the modularized double-sided printed circuit board 1 into the double-sided printed circuit board 1. The through-holes 3 are provided at positions apart from the connecting lead legs 5 which intersect with each other.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a through-hole structure of a small module board in which chip components are mounted on a double-sided board made of glass epoxy or the like, and connecting lead legs are arranged at one end of the board.

[0002]

[Prior Art]

 Conventionally, as a measure for downsizing a printed circuit board, a part of the circuit included in the circuit board is blocked as a module board equipped with lead legs, connectors, etc., and the module board is three-dimensionally mounted on the original board. In this way, the board area is reduced. Also, in order to increase the mounting density of the printed circuit board itself, it was the usual method to downsize the mounting components, make the connection patterns finer, and use a double-sided through-hole board to increase the mounting density. Furthermore, in order to increase the packaging density, a method using a multi-layer substrate is also used.

[0003]

[Problems to be solved by the device]

 As described above, in order to reduce the size of the printed circuit board, the block circuit as shown in FIG. 2 is used as the module substrate 1, and the double-sided through-hole substrate is used as a means for increasing the mounting density of the module substrate 1. 1 is used, but because the connection lead leg 5 to the mother board is arranged on one side of the substrate 1, the pattern of the component mounted on the side opposite to the connection lead leg 5 side in the pattern design. 2 is guided to the connection lead leg 5 while avoiding crossing with the pattern 2 of another component, or crossing of the pattern 2 cannot be avoided even with a double-sided board, and even if an expensive multilayer board is used instead. If not, the chip component 6 for the jumper is mounted and the clip land 7 for the connecting lead leg 5 is provided, which has been a factor of lowering the component mounting rate of the substrate.

[0004]

Means for Solving the Problems In order to solve the above-mentioned problems, in a double-sided printed circuit board in which a connecting lead leg is arranged at one end of a substrate, the connecting lead leg is fixed so as to be embedded in the end face of the substrate To extend it, a through hole with conductive plating inside the board is formed in parallel to the opposite board end, and a through hole is provided at the intersection of the through hole and the pattern on the front and back surfaces connected to the connecting lead legs. Provided is a through-hole structure for a printed circuit board, which is characterized by being connected.

[0005]

[Action]

 As described above, in a double-sided printed circuit board in which the connecting lead legs are arranged at one end of the substrate, the connecting lead legs are fixed so as to be embedded in the end face of the substrate, and conductive plating or the like is performed inside the substrate so as to extend it. A multi-layer board was used by forming through holes to the opposite end of the board and forming through holes at the intersections of the through holes and the patterns on the front and back surfaces that connect to the connecting lead legs. It is possible to avoid the crossing of patterns, and it is not necessary to mount chip parts for jumpers or clip lands for connecting lead legs, so the area for mounting more parts can be increased and the mounting efficiency can be improved. It is also possible to make the module substrate smaller.

[0006]

【Example】

 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 (A) is a sectional view of an embodiment of a printed circuit board through hole structure according to the present invention, and FIG. 1 (B) is a board plan view of the embodiment showing the state of front and back surface patterns.

In the figure, reference numeral 1 denotes a double-sided printed circuit board, and a pattern 2 for connecting components to be mounted is formed on the front and back surfaces, and a through hole 3 for connecting the front and back patterns 2 is formed as necessary. It is provided. Further, a through hole 4 is formed in the center of the thickness of the substrate 1 by drilling at a distance between the connecting lead legs 5 and subjected to conductive plating, and the connecting lead legs 5 are fitted and fixed to one end. Similar to the method of manufacturing a multi-layer substrate, the through holes 4 are conductively plated on a strip formed in a V-shape or a semicircle in conformity with the lead legs 5, and the lead legs 5 are inserted and fixed by sticking them together. Good. In the above description, conductive plating is applied as the conductor of the through hole 4, but conductive paint or the like may be used.

The pattern 2 on the front and back surfaces of the double-sided printed circuit board 1 configured as described above is formed from the board end where the through holes 4 formed inside the board for each connecting lead leg 5 and the connecting lead leg 5 are fixed. They are formed so as to intersect at positions as far as possible, and through holes 3 are provided at the intersections for connection.

[0009]

[Effect of the device]

 As described above, in a double-sided printed circuit board in which the connection lead legs are arranged at one end of the substrate, the connection lead legs are fixed so as to be embedded in the end face of the substrate, and conductive plating is applied inside the substrate to extend them. By forming a through hole to the opposite end of the board and forming a through hole at the intersection of the through hole and the pattern on the front and back surfaces that connect to the connecting lead legs, it is possible to use a multilayer board. Since it is possible to avoid crossing of patterns, and the mounting of chip parts for jumpers and the clip land for connecting lead legs are unnecessary, the module board can be made smaller, or the parts can be mounted from the motherboard and mounted. It is also possible to increase the cost without using an expensive multi-layer substrate, and it is possible to improve the space efficiency, while at the same time reducing the cost, the size of the device can be reduced. It is remarkable to contribute to.

[Brief description of drawings]

FIG. 1A is a cross-sectional view of an embodiment showing a printed circuit board through-hole structure according to the present invention, and FIG. 1B is a board plan view of the embodiment showing a state of front and back patterns.

FIG. 2 is a plan view of an embodiment showing a printed circuit board having a conventional pattern.

[Explanation of symbols]

 1 Double-sided printed circuit board 2 Pattern 3 Through hole 4 Conductive plating through hole 5 Connection lead leg 6 Jumper chip component 7 Clip land

Claims (1)

[Scope of utility model registration request] 1. In a double-sided printed circuit board in which a connecting lead leg is arranged at one end of a substrate to form a module, the connecting lead leg is fixed so as to be embedded in the end face of the substrate, and conductive plating is applied inside the substrate so as to extend it. A printed circuit board, characterized in that the formed through holes are formed in parallel to the opposite board ends, and through holes are provided at the intersections of the through holes and the patterns on the front and back surfaces connected to the connection lead legs. Through hole structure.