JPH0532848Y2 - - Google Patents

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Publication number
JPH0532848Y2
JPH0532848Y2 JP1985022844U JP2284485U JPH0532848Y2 JP H0532848 Y2 JPH0532848 Y2 JP H0532848Y2 JP 1985022844 U JP1985022844 U JP 1985022844U JP 2284485 U JP2284485 U JP 2284485U JP H0532848 Y2 JPH0532848 Y2 JP H0532848Y2
Authority
JP
Japan
Prior art keywords
nozzle
mask
view
spray
developer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985022844U
Other languages
Japanese (ja)
Other versions
JPS61140355U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985022844U priority Critical patent/JPH0532848Y2/ja
Publication of JPS61140355U publication Critical patent/JPS61140355U/ja
Application granted granted Critical
Publication of JPH0532848Y2 publication Critical patent/JPH0532848Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案はスプレー処理装置、より詳しくはスプ
レー現像等に用いるノズルの改良に関する。
[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a spray processing apparatus, and more specifically to an improvement of a nozzle used for spray development and the like.

〔従来の技術〕[Conventional technology]

例えばマスクの現像に用いるスプレー処理装置
は第2図の断面図に示され、同図において、21
はカツプ、22は回転チヤツク、23はチヤツク
22を回転するモータ、24はノズル、25は現
像液タンク、26はオペレータバルブ、27は廃
液排出管、をそれぞれ示す。現像されるべきマス
ク28はチヤツク22上に配置され、チヤツクの
回転と共に回転し、それに対し現像液29がスプ
レーされマスクに塗布されたレジストが現像され
る。
For example, a spray processing apparatus used for developing a mask is shown in a cross-sectional view in FIG.
22 is a rotary chuck, 23 is a motor for rotating the chuck 22, 24 is a nozzle, 25 is a developer tank, 26 is an operator valve, and 27 is a waste liquid discharge pipe. A mask 28 to be developed is placed on the chuck 22 and rotates as the chuck rotates, and a developer 29 is sprayed onto it to develop the resist applied to the mask.

ノズル24は第3図の側面図に示される構成の
もので、一方側は直径Dの管状部が直径dの先端
部にテーパされ、他方側にはねじ山が切つてあ
る。一般的に、Dは15mm、dは7mmの寸法のもの
である。
The nozzle 24 has the configuration shown in the side view of FIG. 3, with a tubular portion having a diameter D tapering to a tip having a diameter d on one side and a thread on the other side. Typically, D is 15 mm and d is 7 mm.

ノズル24の先端は第4図の正面図に示され、
横幅w、縦幅tの開口30が開けてある。開口3
0は図示の如く水平方向に開いていて、一般にw
は3.0mm、tは0.02mmの寸法のものである。
The tip of the nozzle 24 is shown in the front view of FIG.
An opening 30 having a width w and a length t is opened. opening 3
0 is open horizontally as shown in the figure, and generally w
is 3.0 mm, and t is 0.02 mm.

現像液のスプレーに際しては、第5図の斜視図
に示される如く、マスク28は矢印I方向に回転
し、それに対し現像液29は水平方向に平行な帯
状にスプレーされる。
When spraying the developer, as shown in the perspective view of FIG. 5, the mask 28 is rotated in the direction of arrow I, and the developer 29 is sprayed in a strip parallel to the horizontal direction.

〔考案が解決しようとする問題点〕[Problem that the invention attempts to solve]

最近マスクは大口径(6インチ(15.2cm)、7
インチ(17.8cm))化してきている。このような
に大口径化したマスクを第5図に示すようにスプ
レー現像したところ、マスク周辺にまわる現像液
が分散しすぎ、マスク周辺における現像ムラがで
きやすいことが問題となつている。
Recently, masks have a large diameter (6 inches (15.2 cm), 7
inch (17.8cm)). When such a large-diameter mask is spray-developed as shown in FIG. 5, a problem arises in that the developing solution surrounding the mask is too dispersed and uneven development tends to occur around the mask.

〔問題点を解決するための手段〕[Means for solving problems]

上記問題点は、被処理基板表面方向に対して略
垂直方向に長い開口が形成された薬液スプレーノ
ズルを有し、該薬液スプレーノズルによつて該被
処理基板表面への薬液散布が実質的に直線状に分
布するように構成したスプレー処理装置を提供す
ることによつて解決される。
The above problem is that the chemical spray nozzle has a long opening formed in a direction substantially perpendicular to the surface direction of the substrate to be processed, and the chemical spray nozzle does not substantially spread the chemical onto the surface of the substrate to be processed. The solution is to provide a spray treatment device configured for linear distribution.

〔作用〕[Effect]

上記のノズルを用いて薬液をスプレーすると
き、周辺にまわる薬液が分散しすぎることなく集
中するので、処理のムラが発生し難いのである。
When a chemical solution is sprayed using the above-mentioned nozzle, the chemical solution surrounding the area is concentrated without being too dispersed, making it difficult for uneven processing to occur.

〔実施例〕〔Example〕

以下、図面を参照して本考案の実施例を詳細に
説明する。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

本考案にかかるノズル11は、第1図の斜視図
に示されるように、開口12が水平方向に対し垂
直に形成されている。その寸法は第4図に示され
たものと同じに設定する。
As shown in the perspective view of FIG. 1, the nozzle 11 according to the present invention has an opening 12 formed perpendicular to the horizontal direction. Its dimensions are set the same as shown in FIG.

かかるノズルを用いると、現像液は水平方向に
対し直角の帯13となつてマスク14にスプレー
される。マスク14は従来例同様回転チヤツク上
に配置されて矢印Iの方向に回転する。
With such a nozzle, the developer is sprayed onto the mask 14 in a band 13 perpendicular to the horizontal direction. The mask 14 is conventionally placed on a rotary chuck and rotates in the direction of arrow I.

第1図に示す如くスプレーしたところ、周辺に
まわる現像液が集中することが目視され、現像ム
ラがでにくいことが確認された。そのことは使用
現像液が、15.2cm(6インチ)口径のマスクの現
像において、従来例に比べ9/13の率で節約され
ることで裏付けられた。
When spraying as shown in FIG. 1, it was visually observed that the developer surrounding the area was concentrated, and it was confirmed that uneven development was less likely to occur. This is confirmed by the fact that the amount of developer used was saved by 9/13 compared to the conventional example when developing a mask with a diameter of 15.2 cm (6 inches).

〔考案の効果〕[Effect of idea]

以上説明したように本考案によれば、水辺方向
に対し垂直の開口をもつたノズルを用い現像液の
帯状スプレーをすることにより、周辺の現像ムラ
が防止される効果が顕著である。そして、本考案
は上記した現像の場合に限定されるものでなく、
それ以外のエツチング等の処理にも適用可能であ
りその場合にも及ぶものである。
As explained above, according to the present invention, by spraying a strip of developer using a nozzle having an opening perpendicular to the waterside direction, there is a remarkable effect of preventing uneven development in the periphery. Moreover, the present invention is not limited to the case of the above-mentioned development,
It is also applicable to other treatments such as etching, and extends to such cases as well.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案実施例の斜視図、第2図はスプ
レー現像装置の断面図、第3図はスプレー現像装
置のノズルの側面図、第4図は第3図のノズルの
正面図、第5図は第4図のノズルを用いるスプレ
ーの斜視図である。 図中、11はノズル、12は開口、13は現像
液、14はマスク、をそれぞれ示す。
Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a sectional view of the spray developing device, Fig. 3 is a side view of the nozzle of the spray developing device, Fig. 4 is a front view of the nozzle of Fig. 3, FIG. 5 is a perspective view of a spray using the nozzle of FIG. 4. In the figure, 11 is a nozzle, 12 is an opening, 13 is a developer, and 14 is a mask.

Claims (1)

【実用新案登録請求の範囲】 被処理基板表面方向に対して略垂直方向に長い
開口が形成された薬液スプレーノズルを有し、 該薬液スプレーノズルによつて該被処理基板表
面への薬液散布が実質的に直線状に分布するよう
に構成したスプレー処理装置。
[Claims for Utility Model Registration] A chemical liquid spray nozzle having a long opening formed in a direction substantially perpendicular to the surface direction of the substrate to be processed, the chemical liquid being sprayed onto the surface of the substrate to be processed by the chemical liquid spray nozzle. A spray treatment device configured to provide a substantially linear distribution.
JP1985022844U 1985-02-20 1985-02-20 Expired - Lifetime JPH0532848Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985022844U JPH0532848Y2 (en) 1985-02-20 1985-02-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985022844U JPH0532848Y2 (en) 1985-02-20 1985-02-20

Publications (2)

Publication Number Publication Date
JPS61140355U JPS61140355U (en) 1986-08-30
JPH0532848Y2 true JPH0532848Y2 (en) 1993-08-23

Family

ID=30515522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985022844U Expired - Lifetime JPH0532848Y2 (en) 1985-02-20 1985-02-20

Country Status (1)

Country Link
JP (1) JPH0532848Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088207B2 (en) * 1989-06-12 1996-01-29 富士通株式会社 Spray development method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5732446A (en) * 1980-08-04 1982-02-22 Mitsubishi Electric Corp Resist developing device
JPS59232417A (en) * 1983-06-16 1984-12-27 Toshiba Corp Semiconductor wafer resist developing apparatus
JPS61160930A (en) * 1985-01-09 1986-07-21 Dainippon Screen Mfg Co Ltd Method of supplying surface treatment solution for substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5732446A (en) * 1980-08-04 1982-02-22 Mitsubishi Electric Corp Resist developing device
JPS59232417A (en) * 1983-06-16 1984-12-27 Toshiba Corp Semiconductor wafer resist developing apparatus
JPS61160930A (en) * 1985-01-09 1986-07-21 Dainippon Screen Mfg Co Ltd Method of supplying surface treatment solution for substrate

Also Published As

Publication number Publication date
JPS61140355U (en) 1986-08-30

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