KR970063415A - Wafer development method - Google Patents

Wafer development method Download PDF

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Publication number
KR970063415A
KR970063415A KR1019960004453A KR19960004453A KR970063415A KR 970063415 A KR970063415 A KR 970063415A KR 1019960004453 A KR1019960004453 A KR 1019960004453A KR 19960004453 A KR19960004453 A KR 19960004453A KR 970063415 A KR970063415 A KR 970063415A
Authority
KR
South Korea
Prior art keywords
wafer
spraying
nozzle
edge
center
Prior art date
Application number
KR1019960004453A
Other languages
Korean (ko)
Inventor
백점곤
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960004453A priority Critical patent/KR970063415A/en
Publication of KR970063415A publication Critical patent/KR970063415A/en

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Abstract

웨이퍼 상에 현상액 및 세척액을 분사하여 현상하는 방법에 대해 기재되어 있다.And a method of spraying a developer and a cleaning liquid onto a wafer to perform development.

이는, 분사노즐을 사용하여 회전하는 웨이퍼 상에 세척액 및 현상액을 분사하는 방법에 있어서, 분사노즐을 웨이퍼의 가장자리로부터 중심부로 이동시키면서 분사하는 것을 특징으로 한다.This is characterized in that, in a method of spraying a cleaning liquid and a developing liquid onto a rotating wafer using an injection nozzle, the spraying nozzle is injected while moving from the edge of the wafer to the center thereof.

따라서, 웨이퍼의 가장자리 및 중심부에서 현상이 균일하게 이루어지도록 하고, 현상된 포토레지스트 성분을 완전히 제거할 수 있다.Accordingly, the development can be uniformly performed at the edge and the center of the wafer, and the developed photoresist component can be completely removed.

Description

웨이퍼 현상방법Wafer development method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제2a도는 본 발명에 의한 웨이퍼 현상방법을 설명하기 위하여 공정 진행에 따른 장치를 도시한 도면.FIG. 2a is a view showing an apparatus according to a process progress to explain a wafer developing method according to the present invention;

제2b도는 웨이퍼의 회전방향 및 노즐의 이동방향을 나타내는 도면.2b is a view showing the rotation direction of the wafer and the moving direction of the nozzle.

Claims (2)

분사노즐을 사용하여 회전하는 웨이퍼 상에 소정의 물질을 분사하는 방법에 있어서, 상기 분사노즐을 웨이퍼의 가장자리로부터 중심부로 이동시키면서 분사하는 것을 특징으로 하는 웨이퍼 현상방법.A method of spraying a predetermined substance onto a rotating wafer using an injection nozzle, wherein the spraying nozzle is moved while moving from the edge of the wafer to the center thereof. 제1항에 있어서, 상기 분사노즐은 현상액 또는 세척액을 분사하기 위한 노즐인 것을 특징으로 하는 웨이퍼 현상방법.The method of claim 1, wherein the spray nozzle is a nozzle for spraying a developer or a cleaning liquid. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960004453A 1996-02-24 1996-02-24 Wafer development method KR970063415A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960004453A KR970063415A (en) 1996-02-24 1996-02-24 Wafer development method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960004453A KR970063415A (en) 1996-02-24 1996-02-24 Wafer development method

Publications (1)

Publication Number Publication Date
KR970063415A true KR970063415A (en) 1997-09-12

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ID=66221540

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960004453A KR970063415A (en) 1996-02-24 1996-02-24 Wafer development method

Country Status (1)

Country Link
KR (1) KR970063415A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010058399A (en) * 1999-12-27 2001-07-05 박종섭 Injection device for developing agents

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010058399A (en) * 1999-12-27 2001-07-05 박종섭 Injection device for developing agents

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