JPH05327166A - Mounting of electronic component - Google Patents

Mounting of electronic component

Info

Publication number
JPH05327166A
JPH05327166A JP13328392A JP13328392A JPH05327166A JP H05327166 A JPH05327166 A JP H05327166A JP 13328392 A JP13328392 A JP 13328392A JP 13328392 A JP13328392 A JP 13328392A JP H05327166 A JPH05327166 A JP H05327166A
Authority
JP
Japan
Prior art keywords
fpc
thickness
board
components
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13328392A
Other languages
Japanese (ja)
Inventor
Yuichi Minamimura
雄一 南村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13328392A priority Critical patent/JPH05327166A/en
Publication of JPH05327166A publication Critical patent/JPH05327166A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Circuit Arrangements For Discharge Lamps (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To obtain a mounting structure, wherein the thickness of a device can be made thin, by a method wherein an FPC is connected to one surface of a printed board and electronic components are soldered to the FPC in such a way that they are dropped in the printed board. CONSTITUTION:In a base material consisting of a printed board 1 (a thickness of t1) and an FPC 2 (a thickness of t2) connected to one surface of the board 1, thin components, such as a chip resistor, are soldered on the board 1, but components of a high height, such as an electolytic capacitor and a transformer, are soldered on the FPC in such a way that the board 1 is removed by the amount of the form of the components and the components are dropped in the board. As a result, the height of the whole device becomes equal to the thickness t2 + the thickness t3 of the components. In the case where a component 4 having a weight, which can not be held by the FPC only, is mounted, the weight of the component 4 can be held by the board 1 by fixing the component 4 to the board 1 using a bonding agent 6 and an excessive force is not applied to the FPC 2. Thereby, the thickness of the device can be made thin.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、放電管点灯装置に係
り、特に、バックライト用インバータのように薄型化を
要求される点灯装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a discharge tube lighting device, and more particularly to a lighting device that is required to be thin, such as a backlight inverter.

【０００２】[0002]

【従来の技術】従来の放電管点灯装置は、ガラスエポキ
シ基材のような固い材料上に電子部品を半田付けする構
造であった。そのため装置の厚みを“基板厚さ＋電子部
品高さ”より薄くすることが困難であった。2. Description of the Related Art A conventional discharge tube lighting device has a structure in which an electronic component is soldered onto a hard material such as a glass epoxy base material. Therefore, it was difficult to make the thickness of the device thinner than "the thickness of the substrate + the height of the electronic component".

【０００３】[0003]

【発明が解決しようとする課題】従来の放電管点灯装置
では、装置の厚みを“基板厚さ＋電子部品高さ”より薄
くすることが困難であった。また、ＦＰＣ（フレキシブ
ル プリンテッド サーキット；銅箔の上下にポリアミ
ド等のフィルムを圧接等により挟み着けた柔らかい配線
シート）のみに実装する方法では部品保持，セット実装
に対して問題があった。In the conventional discharge tube lighting device, it was difficult to make the thickness of the device thinner than "substrate thickness + electronic component height". Further, the method of mounting only on the FPC (flexible printed circuit; a soft wiring sheet in which films of polyamide or the like are sandwiched by pressure contact or the like on the top and bottom of a copper foil) has a problem in component holding and set mounting.

【０００４】本発明の目的は、装置の厚みを薄くできる
実装構造を提供することにある。An object of the present invention is to provide a mounting structure capable of reducing the thickness of the device.

【０００５】[0005]

【課題を解決するための手段】上記目的は、プリント基
板の片側にＦＰＣを接続し、電子部品をプリント基板に
対して落し込んでＦＰＣに半田付けすることで達成でき
る。The above object can be achieved by connecting an FPC to one side of a printed circuit board, dropping an electronic component onto the printed circuit board, and soldering it to the FPC.

【０００６】[0006]

【作用】プリント基板の片側にＦＰＣを接続し、電子部
品をプリント基板に対して落し込んでＦＰＣに半田付け
すると、装置の厚みが“電子部品高さ＋ＦＰＣ厚”とな
りプリント基板のみの使用時よりも薄くできる。また、
ガラス繊維エホキシ樹脂等のプリント基板も併用するた
め点灯装置としての機械寸法が固定化でき、また、重量
部品がある場合もプリント基板側に接着材等で固定する
ことで保持できる。[Function] When an FPC is connected to one side of a printed circuit board, and an electronic component is dropped onto the printed circuit board and soldered to the FPC, the thickness of the device becomes "electronic component height + FPC thickness", compared to when using only the printed circuit board. Can be thin. Also,
Since a printed circuit board such as glass fiber epoxy resin is also used, the mechanical size of the lighting device can be fixed, and even if there is a heavy component, it can be held by fixing it to the printed circuit board side with an adhesive or the like.

【０００７】[0007]

【実施例】図１に本発明の１実施例の断面図を示す。プ
リント基板１（厚みｔ1 ）の片側にＦＰＣ２（厚み
ｔ2 ）が接続された基材で、チップ抵抗のような薄い部
品はプリント基板上に半田付けする（もちろん部品３，
４のように落し込んでもよい）が、電解コンデンサやト
ランスのような高さの高い部品は図３のように部品形状
分だけプリント基板を抜いて落し込むようにし、ＦＰＣ
に半田付けする。その結果、装置全体の高さはｔ2＋ｔ3
となる。ＦＰＣを使わない従来の方法では、図２のよう
に、装置高さはｔ1＋ｔ3となり基板厚さの分高くなる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a sectional view of one embodiment of the present invention. A base material in which the FPC 2 (thickness t 2 ) is connected to one side of the printed circuit board 1 (thickness t 1 ), and thin parts such as chip resistors are soldered on the printed board (part 3, of course).
4), but for high-height parts such as electrolytic capacitors and transformers, pull out the printed circuit board by the shape of the part and drop it in the FPC as shown in Fig. 3.
Solder to. As a result, the height of the entire device is t 2 + t 3
Becomes In the conventional method which does not use the FPC, the device height is t 1 + t 3 as shown in FIG. 2, which is increased by the substrate thickness.

【０００８】ＦＰＣだけでは重量を保持できない部品４
をとりつける場合には、図１のように部品４とプリント
基板１とを接着材６で固定することによって、部品４の
重量をプリント基板１に保持させることができ、ＦＰＣ
には無理な力が加わらない。Parts that cannot hold weight only by FPC 4
When mounting the component, the weight of the component 4 can be held on the printed circuit board 1 by fixing the component 4 and the printed circuit board 1 with the adhesive 6 as shown in FIG.
Unreasonable power is not added to.

【０００９】[0009]

【発明の効果】本発明によれば、装置の厚みを薄くする
ことができる。According to the present invention, the thickness of the device can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例の断面図。FIG. 1 is a sectional view of an embodiment of the present invention.

【図２】従来技術の断面図。FIG. 2 is a cross-sectional view of a conventional technique.

【図３】図１の平面図。FIG. 3 is a plan view of FIG.

【符号の説明】[Explanation of symbols]

１…プリント基板、２…ＦＰＣ、３…電子部品、４…電
子部品、５…電子部品、６…接着剤。1 ... Printed circuit board, 2 ... FPC, 3 ... Electronic component, 4 ... Electronic component, 5 ... Electronic component, 6 ... Adhesive.

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】プリント基板と電子部品より構成される装
置において、フレキシブル プリンテッド サーキット
を前記プリント基板の片面に接続し、前記電子部品を前
記プリント基板に落し込むことを特徴とする電子部品実
装方法。1. A method for mounting an electronic component, comprising: an apparatus including a printed circuit board and an electronic component, wherein a flexible printed circuit is connected to one surface of the printed circuit board, and the electronic component is dropped onto the printed circuit board. ..
JP13328392A 1992-05-26 1992-05-26 Mounting of electronic component Pending JPH05327166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13328392A JPH05327166A (en) 1992-05-26 1992-05-26 Mounting of electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13328392A JPH05327166A (en) 1992-05-26 1992-05-26 Mounting of electronic component

Publications (1)

Publication Number Publication Date
JPH05327166A true JPH05327166A (en) 1993-12-10

Family

ID=15101027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13328392A Pending JPH05327166A (en) 1992-05-26 1992-05-26 Mounting of electronic component

Country Status (1)

Country Link
JP (1) JPH05327166A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0766505A2 (en) * 1995-09-29 1997-04-02 Allen-Bradley Company, Inc. Rigid-flex circuit board having a window for an insulated mounting area
JP2017060256A (en) * 2015-09-15 2017-03-23 株式会社オートネットワーク技術研究所 Circuit structure and electric connection box
WO2018216466A1 (en) * 2017-05-23 2018-11-29 株式会社オートネットワーク技術研究所 Coil device, coil device with substrate, and electrical connection box
JP2018198304A (en) * 2017-05-23 2018-12-13 株式会社オートネットワーク技術研究所 Coil device, substrate-equipped coil device, and electrical junction box

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0766505A2 (en) * 1995-09-29 1997-04-02 Allen-Bradley Company, Inc. Rigid-flex circuit board having a window for an insulated mounting area
EP0766505A3 (en) * 1995-09-29 1998-12-23 Allen-Bradley Company, Inc. Rigid-flex circuit board having a window for an insulated mounting area
JP2017060256A (en) * 2015-09-15 2017-03-23 株式会社オートネットワーク技術研究所 Circuit structure and electric connection box
WO2017047373A1 (en) * 2015-09-15 2017-03-23 株式会社オートネットワーク技術研究所 Circuit structure and electrical connection box
US10334734B2 (en) 2015-09-15 2019-06-25 Autonetworks Technologies, Ltd. Circuit assembly and electrical junction box
WO2018216466A1 (en) * 2017-05-23 2018-11-29 株式会社オートネットワーク技術研究所 Coil device, coil device with substrate, and electrical connection box
JP2018198304A (en) * 2017-05-23 2018-12-13 株式会社オートネットワーク技術研究所 Coil device, substrate-equipped coil device, and electrical junction box

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