JPH0843845A - Liquid crystal display device - Google Patents
Liquid crystal display deviceInfo
- Publication number
- JPH0843845A JPH0843845A JP17911294A JP17911294A JPH0843845A JP H0843845 A JPH0843845 A JP H0843845A JP 17911294 A JP17911294 A JP 17911294A JP 17911294 A JP17911294 A JP 17911294A JP H0843845 A JPH0843845 A JP H0843845A
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- liquid crystal
- display device
- crystal display
- wiring patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はガラス基板上の非表示領
域に配線パターンを有し、更に駆動用ドライバーＩＣを
実装した液晶表示装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device having a wiring pattern in a non-display area on a glass substrate and further having a driver IC mounted thereon.
【０００２】[0002]
【従来の技術】液晶表示装置を駆動するための駆動用ド
ライバーＩＣを基板表面に直接実装し、そのＩＣと電圧
印加用端子とを電気的接続するＣＯＧ方式が提案されて
いる。2. Description of the Related Art A COG method has been proposed in which a driver IC for driving a liquid crystal display device is directly mounted on the surface of a substrate and the IC and the voltage application terminal are electrically connected.
【０００３】上記構成の液晶表示装置においては、ガラ
ス基板上に微細な配線を引き回す必要があり、これによ
り、この配線には電気的ノイズが発生しやすく、誤動作
の原因となるという問題点があった。In the liquid crystal display device having the above-mentioned structure, it is necessary to draw fine wiring on the glass substrate, and this causes a problem that electrical noise is apt to occur in this wiring and causes malfunction. It was
【０００４】かかる問題点を解決せんがために、液晶表
示装置の誤動作防止の有効な手段として外部信号入力部
から最も離れた基板上の部位において、コンデンサーや
抵抗（レジスター）の電子部品を上記配線に接続し、こ
れにより、信号中の電気的ノイズを低減させ、駆動用ド
ライバーＩＣの誤動作を防止するという方法が提案され
ている。In order to solve such a problem, as an effective means for preventing malfunction of the liquid crystal display device, electronic parts such as a capacitor and a resistor (register) are connected to the above wiring in a portion on the substrate farthest from the external signal input portion. It has been proposed to reduce the electrical noise in the signal and prevent the driver driver IC from malfunctioning.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記構
成の液晶表示装置によれば、この電子部品を実装するた
めに、ハンダ付けや銀ペーストを用いており、そのため
にハンダ中のアルカリ成分（特に塩素）による配線パタ
ーンの腐食が発生したり、あるいはハンダ流れや銀のマ
イグレーション等により導通不良も生じていた。しか
も、その実装時の加熱による表示への悪影響など信頼性
に欠けるという問題点もあった。However, according to the liquid crystal display device having the above structure, soldering or silver paste is used to mount this electronic component. Therefore, the alkaline component (especially chlorine) in the solder is used. ), The wiring pattern is corroded, or a conduction failure is caused by a solder flow or silver migration. In addition, there is a problem that reliability is lacked due to an adverse effect on display due to heating at the time of mounting.
【０００６】この問題点を解決するために、上記電子部
品を接着剤でもってガラス基板上に固定し、そして、こ
の電子部品をワイヤボンデイングにより接続する方法も
考えられるが、この方法によれば、その電子部品自体の
大きさ、その電極の位置や寸法、接続パターン等に配慮
して配線パターンを決定しなければならず、しかも、そ
の電子部品搭載用電極パターンや、そのためのスペース
も設定しなければならない。In order to solve this problem, a method is conceivable in which the electronic component is fixed on a glass substrate with an adhesive and the electronic component is connected by wire bonding. According to this method, The wiring pattern must be determined in consideration of the size of the electronic component itself, the position and size of the electrode, the connection pattern, and the like, and the electronic component mounting electrode pattern and the space therefor must be set. I have to.
【０００７】したがって、本発明の目的は配線パターン
の腐食や導通不良を解決するとともに、信号中の電気的
ノイズを低減させ、駆動用ドライバーＩＣの誤動作を防
止した高性能かつ高信頼性の液晶表示装置を提供するこ
とにある。Therefore, an object of the present invention is to solve the corrosion of the wiring pattern and the conduction failure, reduce the electrical noise in the signal, and prevent the malfunction of the driver IC for driving. To provide a device.
【０００８】また、本発明の他の目的は誤動作防止用の
コンデンサー等電子部品チップを配線パターンに接続す
るに際して、その配線パターンとは別の電子部品チップ
搭載用スペースを設ける必要のない自由度の高い液晶表
示装置を提供することにある。Another object of the present invention is to have a degree of freedom in connecting an electronic component chip such as a capacitor for preventing malfunctions to a wiring pattern without providing a space for mounting the electronic component chip different from the wiring pattern. An object is to provide a high liquid crystal display device.
【０００９】[0009]
【課題を解決するための手段】本発明の液晶表示装置
は、表示領域を有するガラス基板上に駆動用ドライバー
ＩＣを実装している配線パターン上に、コンデンサーや
抵抗等の電子部品を絶縁性基板上に搭載して成るノイズ
吸収器を実装するとともに、この絶縁性基板上の回路配
線と上記配線パターンとをワイヤボンデイングして成る
ことを特徴とする。In a liquid crystal display device of the present invention, an electronic component such as a capacitor or a resistor is provided on an insulating substrate on a wiring pattern in which a driver driver IC is mounted on a glass substrate having a display area. It is characterized in that a noise absorber mounted thereon is mounted, and the circuit wiring on the insulating substrate and the wiring pattern are wire-bonded.
【００１０】[0010]
【作用】上記構成の液晶表示装置によれば、コンデンサ
ーや抵抗等の電子部品を絶縁性基板上に搭載して成るノ
イズ吸収器を配線パターン上に実装し、この絶縁性基板
上の回路配線と上記配線パターンとをワイヤボンデイン
グした構成であり、この構成であれば、従来のようにハ
ンダ付けや銀ペーストを用いて電子部品を実装すること
がなく、これにより、ハンダ中のアルカリ成分による配
線パターンの腐食が発生したり、ハンダ流れや銀のマイ
グレーション等による導通不良が生じなくなる。According to the liquid crystal display device having the above structure, a noise absorber formed by mounting electronic components such as a capacitor and a resistor on an insulating substrate is mounted on a wiring pattern, and circuit wiring on the insulating substrate and This is a configuration in which the above wiring pattern is wire-bonded, and with this configuration, there is no need to mount electronic components using soldering or silver paste as in the conventional case, and as a result, the wiring pattern due to the alkaline component in the solder No corrosion occurs, and no conduction failure occurs due to solder flow or silver migration.
【００１１】また、この構成においては、配線パターン
に電気的ノイズが発生した場合に、随時、その配線パタ
ーン上にノイズ吸収器を実装することにより解決するこ
とができる。したがって、予めこの電子部品を搭載する
スペースを基板上に確保する必要がなく、また、この電
子部品の電極位置と配線パターンとの関係を考慮するこ
ともなく、簡便なる対処により問題を解決することがで
きる。Further, in this structure, when electrical noise occurs in the wiring pattern, it can be solved by mounting a noise absorber on the wiring pattern at any time. Therefore, it is not necessary to secure a space for mounting the electronic component on the substrate in advance, and the relationship between the electrode position of the electronic component and the wiring pattern is not considered, and the problem can be solved by a simple countermeasure. You can
【００１２】[0012]
【実施例】以下、本発明の実施例を図１〜図４により説
明する。図１はこの実施例のＣＯＧ方式液晶表示装置１
であり、図２は絶縁性基板を本体とするプリントサーキ
ットボード（ＰＣＢ）３（例えば２．２ｍｍ×２．０ｍ
ｍ）の上にチップコンデンサーである電子部品２（例え
ば１．６ｍｍ×０．８ｍｍ）を搭載して成るノイズ吸収
器Ａの斜視図であり、図３はＰＣＢ３上の回路配線を示
す平面図である。また、図４は液晶表示装置１の配線パ
ターン４にノイズ吸収器Ａを実装した要部斜視図であ
る。Embodiments of the present invention will be described below with reference to FIGS. FIG. 1 shows a COG type liquid crystal display device 1 of this embodiment.
2 is a printed circuit board (PCB) 3 (for example, 2.2 mm × 2.0 m) having an insulating substrate as a main body.
m) is a perspective view of a noise absorber A in which an electronic component 2 (for example, 1.6 mm × 0.8 mm), which is a chip capacitor, is mounted on FIG. 3, and FIG. 3 is a plan view showing circuit wiring on the PCB 3. is there. Further, FIG. 4 is a perspective view of an essential part in which the noise absorber A is mounted on the wiring pattern 4 of the liquid crystal display device 1.
【００１３】図１において、５、６はガラス基板、７は
有効表示部、８は駆動用ドライバーＩＣ、９は外部信号
入力部（例えば異方性導電膜を介したフレキシブルケー
ブルでもって構成する）である。In FIG. 1, reference numerals 5 and 6 are glass substrates, 7 is an effective display portion, 8 is a driver IC for driving, and 9 is an external signal input portion (for example, a flexible cable via an anisotropic conductive film). Is.
【００１４】この配線パターン４は薄膜形成技術により
形成し、具体的にはガラス基板５上に透明導電膜（厚み
２０００Ａ）、クロム（厚み５００Ａ）、アルミ（厚み
１０，０００Ａ）を連続成膜し、所定のパターンを有す
るフォトマスクを使用してパターニングする。有効表示
部７においては、透明導電膜のみを残し、それ以外は３
層構造とし、この３層構造上に駆動用ドライバーＩＣ８
を実装した。しかも、ノイズ吸収器Ａも、この３層構造
の配線パターン４上に実装するが、望ましくは各駆動用
ドライバーＩＣ８に対応して、それぞれに１個実装す
る。The wiring pattern 4 is formed by a thin film forming technique. Specifically, a transparent conductive film (thickness 2000A), chromium (thickness 500A) and aluminum (thickness 10,000A) are continuously formed on the glass substrate 5. , Patterning using a photomask having a predetermined pattern. In the effective display portion 7, only the transparent conductive film is left, and the others are 3
It has a layered structure, and the driver IC 8 for driving is formed on this three-layered structure.
Implemented. Moreover, the noise absorber A is also mounted on the wiring pattern 4 having the three-layer structure, but preferably one is mounted for each driver IC 8 for driving.
【００１５】また、このＰＣＢ３には図３に示す通り、
回路配線１０が形成されており、この回路配線１０は電
子部品２と電気的に接続される領域１０ａと、配線パタ
ーン４とワイヤボンデイングするためのパッド領域１０
ｂとから成る。そして、図２に示すように電子部品２を
ＰＣＢ３に搭載する場合、電子部品２の電極２ａと領域
１０ａとを半田付けすることによって、電子部品２を固
定する。Further, as shown in FIG.
A circuit wiring 10 is formed, and the circuit wiring 10 has a region 10a electrically connected to the electronic component 2 and a pad region 10 for wire bonding with the wiring pattern 4.
b. When the electronic component 2 is mounted on the PCB 3 as shown in FIG. 2, the electronic component 2 is fixed by soldering the electrode 2a of the electronic component 2 and the region 10a.
【００１６】このような構成のノイズ吸収器Ａを配線パ
ターン４上にエポキシ樹脂等の接着剤により任意の箇所
に実装し、その後にボンデイングワイヤ１１でもってパ
ッド領域１０ｂと配線パターン４とをワイヤボンデイン
グする。The noise absorber A having such a configuration is mounted on the wiring pattern 4 at an arbitrary position with an adhesive such as an epoxy resin, and then the pad region 10b and the wiring pattern 4 are wire-bonded with the bonding wire 11. To do.
【００１７】かくして上記構成の液晶表示装置１におい
ては、配線パターン４に金属薄膜を用いるため、入力信
号中にノイズが存在すると、このノイズがパターンを通
って駆動用ドライバーＩＣ８に入り込み、これにより、
ＩＣ８に誤動作が発生するが、これを防止するためにノ
イズ吸収器Ａを実装しているので、ノイズが吸収され、
そのＩＣ８の誤動作が改善された。Since the metal thin film is used for the wiring pattern 4 in the liquid crystal display device 1 having the above structure, if noise is present in the input signal, this noise enters the driver IC 8 for driving through the pattern, whereby
A malfunction occurs in the IC8, but since the noise absorber A is mounted to prevent this, noise is absorbed,
The malfunction of the IC8 has been improved.
【００１８】しかも、上記構成の液晶表示装置１におい
ては、従来のようにハンダ付けや銀ペーストを用いて電
子部品を実装することがなく、これにより、ハンダ中の
アルカリ成分による配線パターンの腐食が発生したり、
ハンダ流れや銀のマイグレーション等による導通不良が
生じなくなった。In addition, in the liquid crystal display device 1 having the above-mentioned structure, electronic components are not mounted by soldering or using silver paste as in the conventional case, which causes corrosion of the wiring pattern due to the alkaline component in the solder. Occur,
Conduction failure due to solder flow and silver migration did not occur.
【００１９】更に上記構成の液晶表示装置１によれば、
所要の部位にノイズ吸収器Ａを実装した後に、ＰＣＢ３
上のパッド領域１０ｂに対して、どのような配線パター
ン４とも精度よくワイヤボンデイングすることができ
た。したがって、上記電子部品２を配線パターン４上に
接着剤により直に固定し、電子部品２の電極２ａと配線
パターン４とをワイヤボンデイングする場合に比べて、
配線パターン４の配置と電子部品２のチップサイズ、電
極サイズによって搭載位置の限定されるという問題点が
が解決できた。Further, according to the liquid crystal display device 1 having the above structure,
After mounting the noise absorber A on the required part,
It was possible to wire bond any wiring pattern 4 to the upper pad region 10b with high accuracy. Therefore, as compared with the case where the electronic component 2 is directly fixed on the wiring pattern 4 with an adhesive and the electrode 2a of the electronic component 2 and the wiring pattern 4 are wire-bonded,
The problem that the mounting position is limited by the layout of the wiring pattern 4, the chip size of the electronic component 2, and the electrode size can be solved.
【００２０】尚、本発明は上記実施例に限定されるもの
ではなく、本発明の要旨を逸脱しない範囲内で種々の変
更や改良等は何ら支障ない。The present invention is not limited to the above embodiments, and various modifications and improvements can be made without departing from the scope of the present invention.
【００２１】[0021]
【発明の効果】以上の通り、本発明の液晶表示装置にお
いては、コンデンサーや抵抗等の電子部品を絶縁性基板
上に搭載して成るノイズ吸収器を配線パターン上に実装
し、この絶縁性基板上の回路配線と上記配線パターンと
をワイヤボンデイングした構成であり、この構成であれ
ば、ハンダ中のアルカリ成分による配線パターンの腐食
が発生したり、ハンダ流れや銀のマイグレーション等に
よる導通不良が生じなくなり、その結果、高品質且つ高
信頼性の液晶表示装置が提供できた。As described above, in the liquid crystal display device of the present invention, a noise absorber formed by mounting electronic components such as capacitors and resistors on an insulating substrate is mounted on a wiring pattern. This is a configuration in which the upper circuit wiring and the above wiring pattern are wire-bonded, and with this configuration, corrosion of the wiring pattern due to the alkaline component in the solder occurs, or conduction failure due to solder flow or silver migration occurs. As a result, a liquid crystal display device of high quality and high reliability can be provided.
【００２２】また、本発明の液晶表示装置においては、
配線パターンに電気的ノイズが発生した場合に、随時、
その配線パターン上にノイズ吸収器を実装することによ
り解決することができるので、予め上記電子部品を搭載
するスペースを基板上に確保する必要がなく、また、こ
の電子部品の電極位置と配線パターンとの関係を考慮す
ることもなく、しかも、この絶縁性基板上のパッド領域
に対して、どのような配線パターンとも精度よくワイヤ
ボンデイングすることができるので、その実装時の作業
性についても容易であり、製造効率が著しく高めること
もできた。In the liquid crystal display device of the present invention,
If electrical noise occurs in the wiring pattern,
Since the problem can be solved by mounting a noise absorber on the wiring pattern, it is not necessary to secure a space for mounting the electronic component on the substrate in advance, and the electrode position of the electronic component and the wiring pattern It is possible to wire bond any pad pattern on this insulating substrate with high accuracy without considering the relationship between the two, so that workability at the time of mounting is also easy. The manufacturing efficiency could be significantly increased.
【００２３】その上、液晶表示装置の製品完成後、配線
パターンに電気的ノイズが発生せず、誤動作が発生しな
い液晶表示装置であっても、その後、その装置の作動条
件に応じて配線パターンに電気的ノイズが発生する場合
があり、この場合であっても、そのままの配線パターン
を形成しながらも、更にこの配線パターン上にノイズ吸
収器を実装することで簡便に解決することができた。Furthermore, even after the liquid crystal display device is completed, even if the liquid crystal display device is free from electrical noises and malfunctions in the wiring pattern, the wiring pattern may be changed according to the operating conditions of the device. Electrical noise may occur, and even in this case, it was possible to easily solve the problem by forming a wiring pattern as it is and further mounting a noise absorber on this wiring pattern.
【図１】実施例の液晶表示装置の斜視図である。FIG. 1 is a perspective view of a liquid crystal display device according to an embodiment.
【図２】プリントサーキットボード上に電子部品を搭載
した斜視図である。FIG. 2 is a perspective view of an electronic component mounted on a printed circuit board.
【図３】プリントサーキットボード上の回路配線を示す
平面図である。FIG. 3 is a plan view showing circuit wiring on a printed circuit board.
【図４】実施例の液晶表示装置においてノイズ吸収器を
実装した要部斜視図である。FIG. 4 is a perspective view of a main part in which a noise absorber is mounted in the liquid crystal display device of the embodiment.
Ａ ノイズ吸収器 １ 液晶表示装置 ２ 電子部品 ３ プリントサーキットボード（ＰＣＢ） ４ 配線パターン ５、６ ガラス基板 ８ 駆動用ドライバーＩＣ １０ 回路配線 １０ｂ パッド領域 １１ ボンデイングワイヤ A Noise absorber 1 Liquid crystal display device 2 Electronic component 3 Printed circuit board (PCB) 4 Wiring pattern 5, 6 Glass substrate 8 Driving driver IC 10 Circuit wiring 10b Pad area 11 Bonding wire
Claims (1)
ドライバーＩＣを実装している配線パターン上に、コン
デンサーや抵抗等の電子部品を絶縁性基板上に搭載して
成るノイズ吸収器を実装するとともに、この絶縁性基板
上の回路配線と上記配線パターンとをワイヤボンデイン
グして成る液晶表示装置。1. A noise absorber in which electronic components such as capacitors and resistors are mounted on an insulating substrate is mounted on a wiring pattern in which a driver driver IC is mounted on a glass substrate having a display area. At the same time, a liquid crystal display device is formed by wire bonding the circuit wiring on the insulating substrate and the wiring pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17911294A JP3199579B2 (en) | 1994-07-29 | 1994-07-29 | Liquid crystal display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17911294A JP3199579B2 (en) | 1994-07-29 | 1994-07-29 | Liquid crystal display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0843845A true JPH0843845A (en) | 1996-02-16 |
| JP3199579B2 JP3199579B2 (en) | 2001-08-20 |
Family
ID=16060227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17911294A Expired - Fee Related JP3199579B2 (en) | 1994-07-29 | 1994-07-29 | Liquid crystal display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3199579B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002169176A (en) * | 2000-12-04 | 2002-06-14 | Rohm Co Ltd | Structure of liquid crystal display |
| JP2006267605A (en) * | 2005-03-24 | 2006-10-05 | Mitsubishi Electric Corp | Display device |
| KR100577774B1 (en) * | 1997-12-22 | 2007-01-31 | 비오이 하이디스 테크놀로지 주식회사 | Liquid crystal display device and manufacturing method thereof |
| JP2012134076A (en) * | 2010-12-23 | 2012-07-12 | Denso Corp | Impedance measuring instrument for fuel cell |
| CN104994690A (en) * | 2015-07-29 | 2015-10-21 | 武汉华星光电技术有限公司 | Liquid crystal panel element arranging method and liquid crystal panel |
-
1994
- 1994-07-29 JP JP17911294A patent/JP3199579B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100577774B1 (en) * | 1997-12-22 | 2007-01-31 | 비오이 하이디스 테크놀로지 주식회사 | Liquid crystal display device and manufacturing method thereof |
| JP2002169176A (en) * | 2000-12-04 | 2002-06-14 | Rohm Co Ltd | Structure of liquid crystal display |
| JP2006267605A (en) * | 2005-03-24 | 2006-10-05 | Mitsubishi Electric Corp | Display device |
| JP2012134076A (en) * | 2010-12-23 | 2012-07-12 | Denso Corp | Impedance measuring instrument for fuel cell |
| CN104994690A (en) * | 2015-07-29 | 2015-10-21 | 武汉华星光电技术有限公司 | Liquid crystal panel element arranging method and liquid crystal panel |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3199579B2 (en) | 2001-08-20 |
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