JPS6261396A - Mounting method for part - Google Patents
Mounting method for partInfo
- Publication number
- JPS6261396A JPS6261396A JP20095485A JP20095485A JPS6261396A JP S6261396 A JPS6261396 A JP S6261396A JP 20095485 A JP20095485 A JP 20095485A JP 20095485 A JP20095485 A JP 20095485A JP S6261396 A JPS6261396 A JP S6261396A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- electronic component
- electronic components
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概 要〕
印刷配線基板の両面にリフローソルダ法によって電子部
品を実装すると、片面に電子部品を実装する際に先に実
装されていた他面の電子部品が脱落する。そこで電子部
品を印刷配線基板に接着しりフローソルダ法による両面
実装を可能にしたものである。[Detailed Description of the Invention] [Summary] When electronic components are mounted on both sides of a printed wiring board by the reflow soldering method, when electronic components are mounted on one side, the electronic components that were previously mounted on the other side fall off. . Therefore, it is possible to bond electronic components to a printed wiring board and perform double-sided mounting using the flow soldering method.
本発明は液晶やガス放電を利用した表示装置に係り、特
に駆動回路を構成する電子部品の実装方法に関する。The present invention relates to a display device using liquid crystal or gas discharge, and more particularly to a method for mounting electronic components constituting a drive circuit.
第４図は液晶表示パネルに用いられるガラス基板の一例
である。FIG. 4 shows an example of a glass substrate used in a liquid crystal display panel.
ガラス基板１は図示の如くガラス板１１の表面に多数個
の透明電極１２が形成されており、この透明電極１２の
配列間隔が小さいほど高い表示品位が得られる。透明電
極１２のそれぞれには駆動回路が接続されており、透明
電極１２の配列間隔が小さい表示装置即ち表示品位が高
い表示装置はど駆動回路の高密度実装が要求される。As shown in the figure, the glass substrate 1 has a large number of transparent electrodes 12 formed on the surface of a glass plate 11, and the smaller the arrangement interval of the transparent electrodes 12, the higher the display quality can be obtained. A drive circuit is connected to each of the transparent electrodes 12, and a display device in which the transparent electrodes 12 are arranged at a small interval, that is, a display device with high display quality, requires high-density packaging of the drive circuits.
そこでかかる要求を充足するために電子部品の高密度実
装を可能にする実装方法の開発が望まれている。Therefore, in order to satisfy such requirements, it is desired to develop a mounting method that enables high-density mounting of electronic components.
第５図はチップ状電子部品の実装方法を示す断面斜視図
である。FIG. 5 is a cross-sectional perspective view showing a method for mounting chip-shaped electronic components.
各種電子装置の小形化、高密度実装化を進める中で第５
図に示す如く、フェースボンディング形端子を有する抵
抗やコンデンサ、ダイオード等のチップ状電子部品２１
を、ペースト状はんだ２２を印刷した印刷配線基板２３
の端子２４に直接搭載し、ペースト状はんだ２２を溶融
せしめることによって、チップ状電子部品２１を印刷配
線基板２３の端子２４にはんだ付けする実装方法は、電
子部品の自動実装を可能にする方法として広く利用され
ている。With the progress of miniaturization and high-density packaging of various electronic devices, the fifth
As shown in the figure, chip-shaped electronic components 21 such as resistors, capacitors, and diodes with face bonding terminals
A printed wiring board 23 on which paste solder 22 is printed.
The mounting method of soldering the chip-shaped electronic component 21 to the terminal 24 of the printed wiring board 23 by directly mounting the chip-shaped electronic component 21 on the terminal 24 of the printed wiring board 23 by melting the paste solder 22 is a method that enables automatic mounting of electronic components. Widely used.
かかる実装方法において端子２４に直接搭載したチップ
状電子部品２１が、移動中の振動その他の理由によって
所定の位置から外れるのを防止するために、予め印刷配
線基板２３に塗布されている接着剤２５によってチップ
状電子部品２１を印刷配線基板２３に貼着している。In this mounting method, in order to prevent the chip-shaped electronic component 21 directly mounted on the terminal 24 from coming off the predetermined position due to vibration during movement or other reasons, adhesive 25 is applied to the printed wiring board 23 in advance. The chip-shaped electronic component 21 is attached to the printed wiring board 23 by using the following method.
（発明が解決しようとする問題点〕
しかし上記実装方法は電子部品と印刷配線基板との隙間
が極く僅かなチップ状電子部品の実装に限られ、例えば
半導体集積回路や混成集積回路等のようにリード端子を
具え、印刷配線基板との間に大きな隙間があり且つその
隙間が変動する電子部品の実装には適さない。即ち電子
部品と印刷配線基板との間に大きな隙間があるために、
多量の接着剤を予め印刷配線基板に塗布しておかなけれ
ばならない。しかしその隙間が変動し隙間が小さくなる
と余分な接着剤は、電子部品と印刷配線基板との間から
はみ出して端子に付着しその後のはんだ付けを阻害する
。そこでかかる電子部品は片面のみリフローソルダ法で
印刷配線基板に実装し、他面は手はんだで印刷配線基板
に実装しなければならないという問題があった。(Problems to be Solved by the Invention) However, the above mounting method is limited to mounting chip-shaped electronic components where the gap between the electronic component and the printed wiring board is extremely small, such as semiconductor integrated circuits, hybrid integrated circuits, etc. It is not suitable for mounting electronic components that are equipped with lead terminals and have a large gap between them and the printed wiring board, and the gap fluctuates.In other words, since there is a large gap between the electronic component and the printed wiring board,
A large amount of adhesive must be applied to the printed wiring board in advance. However, if the gap changes and becomes smaller, excess adhesive will protrude from between the electronic component and the printed wiring board and adhere to the terminals, interfering with subsequent soldering. There was a problem in that such electronic components had to be mounted on a printed wiring board only on one side by reflow soldering, and the other side had to be mounted on the printed wiring board by hand soldering.
第１図は本発明になる部品実装方法を示す原理図である
。なお企図を通し同じ対象物は同一記号で表している。FIG. 1 is a principle diagram showing the component mounting method according to the present invention. The same objects are represented by the same symbols throughout the plan.
上記問題点は第１図に示す印刷配線基板３０両面に半導
体集積回路や混成集積回路等の電子部品４を実装するに
際し、印刷配線基板３の電子部品４を実装する位置の略
中央部に貫通孔３１を設け、電子部品４の端子４１を印
刷配線基板３の導体端子部３２にはんだ付けした後、電
子部品４と印刷配線基板３との隙間に貫通孔３１を利用
して接着剤５を注入し、少なくとも片面に実装する電子
部品４を印刷配線基板３に貼着せしめる本発明の部品実
装方法によって解決される。The above problem occurs when mounting electronic components 4 such as semiconductor integrated circuits and hybrid integrated circuits on both sides of the printed wiring board 30 shown in FIG. After forming the hole 31 and soldering the terminal 41 of the electronic component 4 to the conductor terminal portion 32 of the printed wiring board 3, the adhesive 5 is applied to the gap between the electronic component 4 and the printed wiring board 3 using the through hole 31. This problem is solved by the component mounting method of the present invention, in which the electronic component 4 to be mounted on at least one side is bonded to the printed wiring board 3 by injection.
第１図において印刷配線基板の電子部品を実装する位置
の中央部に貫通孔を設けることによって、電子部品の端
子を印刷配線基板の導体端子部にはんだ付けした後、電
子部品と印刷配線基板との隙間に接着剤を注入すること
が可能になり、はんだ付性を阻害することなくリフロー
ソルダ法で印刷配線基板の両面に電子部品を実装し実装
密度の向上を図ることができる。In Figure 1, by providing a through hole in the center of the printed wiring board at the position where the electronic component is mounted, the terminals of the electronic component are soldered to the conductor terminals of the printed wiring board, and then the electronic component and the printed wiring board are connected. This makes it possible to inject adhesive into the gaps between the two, allowing electronic components to be mounted on both sides of a printed circuit board using reflow soldering without impeding solderability, thereby improving mounting density.
以下添付図により本発明の実施例について説明する。第
２図は本発明の一実施例を示す側断面図、第３図は本発
明の他の実施例を示す側断面図である。Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 2 is a side sectional view showing one embodiment of the invention, and FIG. 3 is a side sectional view showing another embodiment of the invention.
第２図において印刷配線基板３の電子部品４を実装する
位置の中央部に貫通孔３１を設けてあり、電子部品４の
端子４１は印刷配線基板３の導体端子部３２にはんだ付
けされている。かかる印刷配線基板３の貫通孔３１にデ
ィスペンサのノズル６から適量の接着剤５を滴下する。In FIG. 2, a through hole 31 is provided in the center of the printed wiring board 3 at the position where the electronic component 4 is mounted, and the terminal 41 of the electronic component 4 is soldered to the conductor terminal portion 32 of the printed wiring board 3. . An appropriate amount of adhesive 5 is dropped into the through hole 31 of the printed wiring board 3 from the nozzle 6 of the dispenser.
貫通孔３１に滴下された接着剤５は電子部品４と印刷配
線基板３との隙間に浸透し電子部品°４を印刷配線基板
３に貼着せしめる。電子部品４と印刷配線基板３との隙
間に浸透した余分な接着剤が導体端子部３２に付着して
も、電子部品４の端子４１をはんだ付けした後でありは
んだ付は性を阻害することはない。The adhesive 5 dripped into the through hole 31 penetrates into the gap between the electronic component 4 and the printed wiring board 3 and adheres the electronic component 4 to the printed wiring board 3. Even if excess adhesive that has permeated the gap between the electronic component 4 and the printed wiring board 3 adheres to the conductor terminal portion 32, it will not occur after the terminal 41 of the electronic component 4 has been soldered, and soldering will inhibit the soldering properties. There isn't.
また第３図において印刷配線基板３の電子部品４を実装
する位置の中央部に貫通孔３１を設けζあり、電子部品
４の端子４１は印刷配線基板３の導体端子部３２にはん
だ付けされている。かかる印刷配線基Ｆｊ、３の貫通孔
３１に排気管７を当接せしめると共に電子部品４の周囲
には接着剤５を塗布し、排気管７および貫通孔３１を介
して吸引することによって、接着剤５は電子部品４と印
刷配線基板３との隙間に浸透し電子部品４を印刷配線基
板３に貼着せしめる。塗布した接着剤が導体端子部３２
に付着するが電子部品４の端子４１をはんだ付けした後
でありはんだ付は性を阻害することはない。In addition, in FIG. 3, a through hole 31 is provided in the center of the printed wiring board 3 at the position where the electronic component 4 is mounted, and the terminal 41 of the electronic component 4 is soldered to the conductor terminal portion 32 of the printed wiring board 3. There is. The exhaust pipe 7 is brought into contact with the through hole 31 of the printed wiring board Fj, 3, and the adhesive 5 is applied around the electronic component 4, and the adhesive is bonded by suctioning through the exhaust pipe 7 and the through hole 31. The agent 5 penetrates into the gap between the electronic component 4 and the printed wiring board 3 and adheres the electronic component 4 to the printed wiring board 3. The applied adhesive is attached to the conductor terminal portion 32.
However, it adheres to the terminals 41 of the electronic component 4 after the terminals 41 of the electronic component 4 are soldered, and the soldering does not impair the performance.
印刷配線基板の両面に電子部品を実装する場合少な（と
も片方の面に実装する電子部品を上記方法で印刷配線基
板に貼着することにより、他面に電子部品を実装する際
に先に実装された電子部品が印刷配線基板から脱落する
という問題が解決され、その結果リフローソルダ法で印
刷配線基板の両面に電子部品を実装し実装密度の向上を
図ることができる。When mounting electronic components on both sides of a printed wiring board (in both cases, by attaching the electronic components to be mounted on one side to the printed wiring board using the above method, it is possible to mount the electronic components on the other side first). This solves the problem of electronic components falling off the printed wiring board, and as a result, it is possible to mount electronic components on both sides of the printed wiring board using the reflow soldering method, thereby improving the packaging density.
上述の如く本発明によれば電子部品の高密度実装を可能
にする実装方法を提供することができる。As described above, according to the present invention, it is possible to provide a mounting method that enables high-density mounting of electronic components.
第１図は本発明になる部品実装方法を示す原理図、
第２図は本発明の一実施例を示す側断面図、第３図は本
発明の他の実施例を示す側断面図、第４図は液晶表示パ
ネルに用いられるガラス基板の一例、
第５図はチップ状電子部品の実装方法を示す断面斜視図
、
である。図において
３は印刷配線基板、 ４は電子部品、
５は接着剤、 ６はノズル、
７は排気管、 ３１はＨ通孔、
３２は導体端子部、 ４１は端子、
をそれぞれ表す。Fig. 1 is a principle diagram showing a component mounting method according to the present invention, Fig. 2 is a side sectional view showing an embodiment of the invention, and Fig. 3 is a side sectional view showing another embodiment of the invention. FIG. 4 is an example of a glass substrate used in a liquid crystal display panel, and FIG. 5 is a cross-sectional perspective view showing a method for mounting chip-shaped electronic components. In the figure, 3 is a printed wiring board, 4 is an electronic component, 5 is an adhesive, 6 is a nozzle, 7 is an exhaust pipe, 31 is an H hole, 32 is a conductor terminal portion, and 41 is a terminal.
Claims (1)
回路等の電子部品（４）を実装するに際し、該印刷配線
基板（３）の該電子部品（４）を実装する位置の略中央
部に貫通孔（３１）を設け、該電子部品（４）の端子（
４１）を該印刷配線基板（３）の導体端子部（３２）に
はんだ付けした後、該電子部品（４）と該印刷配線基板
（３）との隙間に該貫通孔（３１）を利用して接着剤（
５）を注入し、少なくとも片面に実装する該電子部品（
４）を該印刷配線基板（３）に貼着せしめることを特徴
とする部品実装方法。When mounting electronic components (4) such as semiconductor integrated circuits and hybrid integrated circuits on both sides of the printed wiring board (3), approximately the center of the printed wiring board (3) at the position where the electronic components (4) are mounted. A through hole (31) is provided in the terminal (31) of the electronic component (4).
41) to the conductor terminal portion (32) of the printed wiring board (3), use the through hole (31) in the gap between the electronic component (4) and the printed wiring board (3). adhesive (
5) and mounted on at least one side of the electronic component (
4) on the printed wiring board (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20095485A JPS6261396A (en) | 1985-09-11 | 1985-09-11 | Mounting method for part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20095485A JPS6261396A (en) | 1985-09-11 | 1985-09-11 | Mounting method for part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6261396A true JPS6261396A (en) | 1987-03-18 |
Family
ID=16433068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20095485A Pending JPS6261396A (en) | 1985-09-11 | 1985-09-11 | Mounting method for part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6261396A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0613863U (en) * | 1992-07-28 | 1994-02-22 | 住友ゴム工業株式会社 | Iron type club head |
| WO2020017124A1 (en) * | 2018-07-20 | 2020-01-23 | 日本電気硝子株式会社 | Printed circuit board and method for manufacturing same |
-
1985
- 1985-09-11 JP JP20095485A patent/JPS6261396A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0613863U (en) * | 1992-07-28 | 1994-02-22 | 住友ゴム工業株式会社 | Iron type club head |
| WO2020017124A1 (en) * | 2018-07-20 | 2020-01-23 | 日本電気硝子株式会社 | Printed circuit board and method for manufacturing same |
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