JPS6163083A - High density mounting substrate - Google Patents
High density mounting substrateInfo
- Publication number
- JPS6163083A JPS6163083A JP18383984A JP18383984A JPS6163083A JP S6163083 A JPS6163083 A JP S6163083A JP 18383984 A JP18383984 A JP 18383984A JP 18383984 A JP18383984 A JP 18383984A JP S6163083 A JPS6163083 A JP S6163083A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- density mounting
- printed circuit
- circuit board
- high density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は小形電子機器等に利用される高密度実装基板に
関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a high-density mounting board used for small electronic devices and the like.
（従来例の構成とその問題点）
従来の高密度実装基板について、第１図により説明する
。同図は従来の高密度実装基板に装着された、電子素子
を含む１個のチップ形電子部品１を示したもので、チッ
プ形電子部品１は、その電極２がプリント基板３の表面
に形成された接続用ランド４とはんだ５により接続され
ている。(Structure of conventional example and its problems) A conventional high-density mounting board will be explained with reference to FIG. The figure shows one chip-shaped electronic component 1 including an electronic element mounted on a conventional high-density mounting board. It is connected to the connecting land 4 by solder 5.
プリント基板３にチップ形電子部品１を装着するには、
プリント基板３の上に接着剤６を塗布した後、チップ形
電子部品１をその電極２が接続用ランド４に載るように
取り付け、接着剤６の硬化を待ってはんだ付けを行った
ものである。To attach the chip type electronic component 1 to the printed circuit board 3,
After applying the adhesive 6 onto the printed circuit board 3, the chip-shaped electronic component 1 is attached so that its electrode 2 rests on the connection land 4, and soldering is performed after waiting for the adhesive 6 to harden. .
このようなチップ形電子部品１を狭い間隔でプリント基
板３上に装着し、電子素子として回路を構成することに
より高密度実装基板が得られるが、チップ形電子部品１
の底面がプリント基板３を占有するため、プリント基板
３上の電子素子の中に占めるチップ形電子部品１の数を
増すことができないという問題点があった。A high-density mounting board can be obtained by mounting such chip-shaped electronic components 1 on a printed circuit board 3 at narrow intervals and configuring a circuit as an electronic element.
Since the bottom surface of the printed circuit board 3 occupies the printed circuit board 3, there is a problem that the number of chip-shaped electronic components 1 occupying among the electronic elements on the printed circuit board 3 cannot be increased.
（発明の目的）
本発明は上記の欠点を解消するもので、同じ大きさのプ
リント基板上に装着される電子素子に占めるチップ形電
子部品の割合を増加し、従来より密度の高い高密度実装
基板を提供しようとするものである。(Objective of the Invention) The present invention solves the above-mentioned drawbacks by increasing the proportion of chip-type electronic components in the electronic elements mounted on a printed circuit board of the same size, and by increasing the proportion of chip-type electronic components in electronic devices mounted on a printed circuit board of the same size. The aim is to provide a substrate.
（発明の構成）
本発明はチップ抵抗器、チップコンデンサ等のリードの
ないチップ形電子部品を立てて、プリント基板上に装着
し、チップ形電子部品が占有する所要面積を小さくして
、単位面積当りの装着数を増加し、高密度実装基板の一
層の高密度化を図るものである。(Structure of the Invention) The present invention is to stand up chip-shaped electronic components without leads, such as chip resistors and chip capacitors, and mount them on a printed circuit board, thereby reducing the required area occupied by the chip-shaped electronic components. The aim is to increase the number of mountings per unit and further increase the density of the high-density mounting board.
（実施例の説明） 本発明の実施例を第２図及び第３図により説明する。(Explanation of Examples) An embodiment of the present invention will be described with reference to FIGS. 2 and 3.
第２図はチップ形電子部品の斜視図で、これを平らに置
いたときの底面積１ａと立てて置いたときの側面積１ｂ
との比較を視覚的に示したもので、このようなチップ形
電子部品は立てて装着すれば。Figure 2 is a perspective view of a chip-type electronic component, with a bottom area 1a when it is placed flat and a side area 1b when it is placed upright.
This is a visual comparison of how chip-shaped electronic components like this can be mounted upright.
平らに装着した場合に比べ所要面積がせまくて済むこと
を示す、第３図は本発明による高密度実装基板に装着さ
れた、電子素子を含む１個のチップ形電子部品を示した
もので、チップ形電子部品１は、プリント基板３の表面
に形成された接続用ランド４の上に立てた状態で、はん
だ５によって接続されている。Fig. 3 shows one chip-shaped electronic component including an electronic element mounted on a high-density mounting board according to the present invention, showing that the required area is smaller than when mounted flatly. The chip-shaped electronic component 1 is connected by solder 5 while standing on a connecting land 4 formed on the surface of a printed circuit board 3.
プリント基板３にチップ形電子部品１を接着剤６を利用
して装着する方法は第１図と同様である。The method of attaching the chip type electronic component 1 to the printed circuit board 3 using the adhesive 6 is the same as that shown in FIG.
こにようにチップ形電子部品１を立てて装着することに
より、その占有面積は平らに装着する場合に比べて数分
の１となり、この分だけプリント基板上に装着し得る電
子素子の数を増加でき、高密度実装基板の一層の高密度
化が可能となる。By mounting the chip-shaped electronic component 1 vertically in this way, the area it occupies is reduced to a fraction of that of mounting it flat, and the number of electronic elements that can be mounted on the printed circuit board is reduced by this amount. This makes it possible to increase the density of the high-density mounting board.
（発明の効果）
本発明によれば高密度実装基板の一層の高密度かが可能
となり、これを利用する電子機器の小型軽量化、高性能
化に著しい効果がある。(Effects of the Invention) According to the present invention, it is possible to further increase the density of a high-density mounting board, and there is a significant effect in reducing the size, weight, and performance of electronic devices that utilize this.
第１図は従来の高密度実装基板の部分斜視図、第２図は
チップ形電子部品の斜視図、第３図は本発明による高密
度実装基板の部分斜視図である。
１ ・・・チップ形電子部品、１ａ・・・底面積。
１ｂ・・・側面積、 ２・・・電極、 ３ ・・・プリ
ント基板、 ４ ・・・接続用ランド、 ５ ・・・は
んだ、 ６・・・接着剤。
特許出願人 松下電器産業株式会社
第１図
゛第２図FIG. 1 is a partial perspective view of a conventional high-density mounting board, FIG. 2 is a perspective view of a chip-type electronic component, and FIG. 3 is a partial perspective view of a high-density mounting board according to the present invention. 1...Chip type electronic component, 1a...Base area. 1b...Side area, 2...Electrode, 3...Printed circuit board, 4...Connection land, 5...Solder, 6...Adhesive. Patent applicant: Matsushita Electric Industrial Co., Ltd. Figure 1 and Figure 2
Claims (1)
プ形電子部品が立てて装着されていることを特徴とする
高密度実装基板。A high-density mounting board characterized by chip-type electronic components without leads such as chip resistors and chip capacitors being mounted vertically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18383984A JPS6163083A (en) | 1984-09-04 | 1984-09-04 | High density mounting substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18383984A JPS6163083A (en) | 1984-09-04 | 1984-09-04 | High density mounting substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6163083A true JPS6163083A (en) | 1986-04-01 |
Family
ID=16142739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18383984A Pending JPS6163083A (en) | 1984-09-04 | 1984-09-04 | High density mounting substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6163083A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62238681A (en) * | 1986-04-10 | 1987-10-19 | 松下電器産業株式会社 | Method of attaching electronic parts to printed wiring board |
| JP2006190802A (en) * | 2005-01-06 | 2006-07-20 | Ibiden Co Ltd | Multilayer printed wiring board |
-
1984
- 1984-09-04 JP JP18383984A patent/JPS6163083A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62238681A (en) * | 1986-04-10 | 1987-10-19 | 松下電器産業株式会社 | Method of attaching electronic parts to printed wiring board |
| JP2006190802A (en) * | 2005-01-06 | 2006-07-20 | Ibiden Co Ltd | Multilayer printed wiring board |
| JP4667045B2 (en) * | 2005-01-06 | 2011-04-06 | イビデン株式会社 | Multilayer printed wiring board |
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