JPH0344431B2 - - Google Patents
Info
- Publication number
- JPH0344431B2 JPH0344431B2 JP26879785A JP26879785A JPH0344431B2 JP H0344431 B2 JPH0344431 B2 JP H0344431B2 JP 26879785 A JP26879785 A JP 26879785A JP 26879785 A JP26879785 A JP 26879785A JP H0344431 B2 JPH0344431 B2 JP H0344431B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- insulating film
- components
- leaded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010408 film Substances 0.000 description 20
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、液晶式ポケツトテレビに用いる電子
チユーナ等の超小型の高周波機器に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to ultra-compact high-frequency equipment such as electronic tuners used in liquid crystal pocket televisions.
（従来の技術）
一般に、超小型の高周波機器においては、チツ
プ部品が多く用いられるのであるが、ダイオード
やコイルなどのリード付き部品も未だ相当数利用
され、第４図に示すようにチツプ部品５およびリ
ード付き部品７がプリント基板１上に装着されて
いる。(Prior art) In general, many chip parts are used in ultra-compact high-frequency equipment, but a considerable number of parts with leads such as diodes and coils are still used, and as shown in Figure 4, chip parts 5 and a leaded component 7 are mounted on the printed circuit board 1.
（発明が解決しようとする問題点）
この場合、プリント基板１上での部品装着密度
には限度があり、部品間隔を一定以上密にする
と、部品どうしの接触による短絡が発生し易くな
る。したがつて、部品数が多い回路を構成する場
合には、プリント基板面積を大きくせざるを得
ず、小型化の妨げとなるものであつた。(Problems to be Solved by the Invention) In this case, there is a limit to the mounting density of components on the printed circuit board 1, and if the intervals between components are made denser than a certain level, short circuits due to contact between components are likely to occur. Therefore, when configuring a circuit with a large number of components, the area of the printed circuit board must be increased, which hinders miniaturization.
また、プリント基板１の同一表面にチツプ部品
５とリード付き部品７とを装着する場合は、チツ
プ部品５を先に半田ペーストを介してプリント基
板１に装着する。その後、加熱炉を通して半田を
溶かす。次いでリード付き部品７のリード線７ａ
をプリント基板１の差し込み、半田デイツプによ
り、リード線７ａをプリント回路に接続する工程
をとる。この場合、半田デイツプの際、リード線
部品７は軽いために浮き上がりが発生し易い。そ
こで、浮き上がりを防止するために、リード付き
部品７を所定箇所に予め接着剤Ｓで仮り止めす
る。 Further, when the chip component 5 and the leaded component 7 are mounted on the same surface of the printed circuit board 1, the chip component 5 is first mounted on the printed circuit board 1 via solder paste. The solder is then melted through a heating furnace. Next, the lead wire 7a of the leaded component 7
Insert the printed circuit board 1 and connect the lead wire 7a to the printed circuit with a solder dip. In this case, during solder dipping, the lead wire component 7 is light and therefore tends to lift up. Therefore, in order to prevent the leaded component 7 from lifting up, the leaded component 7 is temporarily fixed in advance at a predetermined location with an adhesive S.
ところが、このような接着剤の塗り付けはチツ
プ部品５が既に装着されて段差が生じているプリ
ント基板１上に施すのでスクリーン印刷手段が使
用できず、リード付き部品装着部位ごどに一点ず
つ接着剤Ｓを塗布せざるを得ず、作業能率が悪い
ものとなつていた。 However, since this type of adhesive is applied onto the printed circuit board 1 where the chip parts 5 have already been mounted and there is a step, screen printing means cannot be used, and the adhesive is applied one by one to each part where the leaded parts are mounted. Agent S had to be applied, resulting in poor work efficiency.
本発明はこのような実情に鑑みてなされたもの
であつて、プリント基板を大型化することなく、
しかも部品間の電気的短絡現象を発生させるとこ
とがないようにして多数の部品の装着を可能に
し、かつ能率的に部品の組み付けが行なえるよう
にすることを目的とする。 The present invention was made in view of the above circumstances, and it is possible to reduce the size of the printed circuit board without increasing the size of the printed circuit board.
Moreover, it is an object of the present invention to enable mounting of a large number of components without causing electrical short circuits between components, and to enable efficient assembly of components.
（問題点を解決するための手段）
本発明はこのような目的を達成するためにリー
ド付き部品群が接着支持された絶縁フイルムを、
基板上に装着されたチツプ部品群の上に載置する
とともに、絶縁フイルムを貫通したリード付き部
品群のリード線とプリント基板のプリント回路と
を接続してある構造とした。(Means for Solving the Problems) In order to achieve the above object, the present invention provides an insulating film on which a group of leaded components is adhesively supported.
It is placed on a group of chip components mounted on a board, and has a structure in which the lead wires of the component group with leads passing through an insulating film are connected to the printed circuit of the printed circuit board.
（作用）
このような構造であれば、プリント基板上のチ
ツプ部品は従来と同様に先に半田ペーストを介し
てプリント基板に装着しておく。リード付き部品
は絶縁フイルムに接着剤で仮止めしておく。そし
て、リード付き部品を仮止め装着した絶縁フイル
ムをプリント基板のチツプ部品群上に載置し、絶
縁フイルムから貫通したリード付き部品のリード
線を基板の所定位置に差し込む。その後、プリン
ト基板の下面を半田デイツプしてリード線をプリ
ント回路に接続する。即ち、プリント基板上にチ
ツプ部品群とリード付き部品群とを絶縁フイルム
で絶縁した状態で２層に配備する。(Function) With this structure, the chip components on the printed circuit board are first attached to the printed circuit board via solder paste, as in the conventional case. Temporarily fix the parts with leads to the insulating film with adhesive. Then, the insulating film to which the leaded components are temporarily attached is placed on the group of chip components of the printed circuit board, and the lead wires of the leaded components that penetrate through the insulating film are inserted into predetermined positions on the board. Then, dip the bottom surface of the printed circuit board with solder and connect the lead wires to the printed circuit. That is, a group of chip components and a group of leaded components are arranged in two layers on a printed circuit board while being insulated with an insulating film.
（実施例）
第１図は、本発明の一実施例に係る高周波機器
の一例である超小型の電子チユーナの分解斜視図
である。第１図において、符号１はプリント基
板、２は絶縁フイルム、３はリード端子群、４は
シヤーシである。(Embodiment) FIG. 1 is an exploded perspective view of a micro-sized electronic tuner, which is an example of a high-frequency device according to an embodiment of the present invention. In FIG. 1, numeral 1 is a printed circuit board, 2 is an insulating film, 3 is a group of lead terminals, and 4 is a chassis.
プリント基板１の上下面には、プリント回路
（図示せず）が形成されている。プリント基板１
の上面には、チツプ部品５群が半田ペーストを介
して装着されている。チツプ部品５群は加熱炉で
の半田溶融処理を経てその半田ペーストによりプ
リント基板１の上面に固定されるようになつてい
る。プリント基板１の下面には、チツプ部品６
（第１図中には表われない）が接着剤で仮止め装
着されている。 Printed circuits (not shown) are formed on the upper and lower surfaces of the printed circuit board 1. Printed circuit board 1
Five groups of chip parts are attached to the top surface of the unit via solder paste. The group of chip parts 5 is fixed to the upper surface of the printed circuit board 1 by solder paste after undergoing solder melting treatment in a heating furnace. A chip component 6 is provided on the bottom surface of the printed circuit board 1.
(not shown in Figure 1) is temporarily attached with adhesive.
絶縁フイルム２は、ポリイミド等の耐熱性に優
れた約0.1mm程度の薄いフイルムが使用されてい
る。絶縁フイルム２はプリント基板１と同一か、
またはほぼ同一の大きさに形成されている。絶縁
フイルム２の上面には、コイル、ダイオード等の
リード付き部品７群が接着剤Ｓで仮止め装着され
るとともに、各部品７のリード線７ａが絶縁フイ
ルム２を貫通して下方に突出されている。リード
付き部品７を仮止めする接着剤は、スクリーン印
刷により絶縁フイルム２上の所定位置に塗布され
ている。このように、リード付き部品６群を装備
した絶縁フイルム２は、プリント基板１のチツプ
部品５群の上に配置されるとともに、各リード線
７ａがプリント基板１に形成された孔８に差し込
まれている。リード端子３群は、プラスチツク製
の端子ホルダ９に所定ピツチで並列に打ち込み固
定されている。リード端子３群はまた、絶縁フイ
ルム２の中央の並列孔１０群を通してプリント基
板１の中央の並列孔１１群に差し込まれる。 As the insulating film 2, a thin film of about 0.1 mm and made of polyimide or the like with excellent heat resistance is used. Is the insulating film 2 the same as the printed circuit board 1?
or are formed to have approximately the same size. On the upper surface of the insulating film 2, 7 groups of leaded components such as coils and diodes are temporarily attached with adhesive S, and the lead wires 7a of each component 7 penetrate the insulating film 2 and protrude downward. There is. The adhesive for temporarily fixing the leaded component 7 is applied to a predetermined position on the insulating film 2 by screen printing. In this way, the insulating film 2 equipped with the six groups of leaded components is placed on the five groups of chip components of the printed circuit board 1, and each lead wire 7a is inserted into the hole 8 formed in the printed circuit board 1. ing. The three groups of lead terminals are driven and fixed in parallel to a plastic terminal holder 9 at a predetermined pitch. The 3 groups of lead terminals are also inserted into the 11 groups of parallel holes at the center of the printed circuit board 1 through the 10 groups of parallel holes at the center of the insulating film 2 .
シヤーシ４は、型抜きした素材を折り曲げて矩
形枠状に形成されいる。シヤーシ４には、その周
壁上縁わたつてシールド板１２が一体に架設され
ている。そして、絶縁フイルム２およびリード端
子３を組み付けたプリント基板１は、シヤーシ４
の下方から挿入される。この挿入状態でプリント
基板１は、シールド板１２の下縁の一部と、周壁
から打ち出した舌片１３とにより、シヤーシ４内
に上下位置決め固定される。この固定状態で、リ
ード端子ホルダ９は、プリント基板１と中央のシ
ールド板１２の下縁との間に挟持されている。 The chassis 4 is formed into a rectangular frame shape by bending a die-cut material. A shield plate 12 is integrally installed on the chassis 4 across the upper edge of its peripheral wall. The printed circuit board 1 with the insulating film 2 and lead terminals 3 assembled thereon is mounted on a chassis 4.
is inserted from below. In this inserted state, the printed circuit board 1 is vertically positioned and fixed within the chassis 4 by a portion of the lower edge of the shield plate 12 and the tongue piece 13 projected from the peripheral wall. In this fixed state, the lead terminal holder 9 is held between the printed circuit board 1 and the lower edge of the central shield plate 12.
中央のシールド板１２には、長短複数のガイド
ピン１４，１５が下方に突設されている。リード
端子ホルダ９には、ガイドピン１４，１５を貫通
および挿入する孔１６が設けられている。リード
端子ホルダ９から突出する長いガイドピン１４は
絶縁フイルム２の孔１７を通つてプリント基板１
の孔１８に挿通される。 A plurality of long and short guide pins 14 and 15 are provided on the central shield plate 12 to project downward. Lead terminal holder 9 is provided with a hole 16 through which guide pins 14 and 15 are inserted. The long guide pin 14 protruding from the lead terminal holder 9 passes through the hole 17 of the insulating film 2 and connects to the printed circuit board 1.
It is inserted into the hole 18 of.
以上の組み付けが終了した状態の高周波機器は
第２図および第３図に示される。この組み付けの
状態でプリント基板１の下面から半田デイツプ処
理を施し下側チツプ部品６、リード線７ａ、リー
ド端子３および長いガイドピン１４を同時にプリ
ント回路に半田付けする。 The high frequency equipment after the above assembly is shown in FIGS. 2 and 3. In this assembled state, a solder dip process is applied to the lower surface of the printed circuit board 1, and the lower chip component 6, lead wire 7a, lead terminal 3, and long guide pin 14 are simultaneously soldered to the printed circuit.
（発明の効果）
以上説明したように、本発明によればチツプ部
品群とリード付き部品群とを絶縁フイルムで絶縁
した状態で２層に配備してプリント基板に取り付
けるようにしたから、隣接部品の間隔を十分にと
つて電気的短絡の発生を未然に防止しながら、小
面積のプリント基板上に多数の部品を装着するこ
とが可能となり、高周波機器の小型化を、より促
進することができるようになつた。(Effects of the Invention) As explained above, according to the present invention, the chip parts group and the leaded parts group are arranged in two layers while being insulated with an insulating film, and are attached to the printed circuit board. This makes it possible to mount a large number of components on a small printed circuit board while ensuring sufficient spacing to prevent electrical short circuits, further promoting the miniaturization of high-frequency equipment. It became like that.
また、リード付き部品を絶縁フイルムに接着剤
で仮止めするから、絶縁フイルム上への接着剤の
塗布にスクリーン印刷を利用することが可能とな
り、チツプ部品を先に取り付けたプリント基板上
にリード付き部品を取り付ける従来構造のよう
に、リード付き部品の仮止め用接着剤を一点ずつ
塗布するような手間のかかる作業が不要となり、
作業能率が向上した。 In addition, since the parts with leads are temporarily attached to the insulating film with adhesive, it is possible to use screen printing to apply the adhesive onto the insulating film, and the leads can be attached to the printed circuit board on which the chip parts are attached first. This eliminates the need for the time-consuming work of applying adhesive for temporary fixing of leaded parts one by one, which is required in the conventional structure for attaching parts.
Work efficiency has improved.
第１図は本発明の一実施例に係る高周波機器の
分解斜視図、第２図は部品組み付け完了状態での
縦断正面図、第３図はその縦断側面図、第４図は
従来の回路基板を示す斜視図である。
１……プリント基板、２……絶縁フイルム、７
……リード付き部品、７ａ……リード線。
Fig. 1 is an exploded perspective view of a high-frequency device according to an embodiment of the present invention, Fig. 2 is a longitudinal sectional front view of the high-frequency device in a state in which parts have been assembled, Fig. 3 is a longitudinal sectional side view thereof, and Fig. 4 is a conventional circuit board. FIG. 1... Printed circuit board, 2... Insulating film, 7
...Parts with leads, 7a...Lead wire.
Claims (1)
ルムを、プリント基板上に装着されたチツプ部品
群の上に載置するとともに、 絶縁フイルムを貫通したリード付き部品群のリ
ード線とプリント基板に形成されているプリント
回路とを持続してあることを特徴とする高周波機
器。[Claims] 1. An insulating film on which a group of leaded components is adhesively supported is placed on a group of chip components mounted on a printed circuit board, and the lead wires of the group of leaded components are passed through the insulating film. and a printed circuit formed on a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26879785A JPS62128187A (en) | 1985-11-28 | 1985-11-28 | Radio frequency equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26879785A JPS62128187A (en) | 1985-11-28 | 1985-11-28 | Radio frequency equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62128187A JPS62128187A (en) | 1987-06-10 |
| JPH0344431B2 true JPH0344431B2 (en) | 1991-07-05 |
Family
ID=17463397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26879785A Granted JPS62128187A (en) | 1985-11-28 | 1985-11-28 | Radio frequency equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62128187A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2558567B2 (en) * | 1992-01-22 | 1996-11-27 | 龍夫 岡崎 | Continuous electrolyzed water generator with flow path switching valve device |
| WO2009019771A1 (en) * | 2007-08-08 | 2009-02-12 | Bosch Corporation | Circuit board with high packaging density |
-
1985
- 1985-11-28 JP JP26879785A patent/JPS62128187A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62128187A (en) | 1987-06-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |