JPH0212892A - Method of packaging electronic component - Google Patents
Method of packaging electronic componentInfo
- Publication number
- JPH0212892A JPH0212892A JP16073988A JP16073988A JPH0212892A JP H0212892 A JPH0212892 A JP H0212892A JP 16073988 A JP16073988 A JP 16073988A JP 16073988 A JP16073988 A JP 16073988A JP H0212892 A JPH0212892 A JP H0212892A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- electronic component
- board
- component
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title abstract 5
- 238000012545 processing Methods 0.000 claims description 4
- 239000000725 suspension Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 239000011888 foil Substances 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、カード電卓、メモリーカード等の薄型電子機
器に適した、表面実装用電子部品の実装方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for mounting surface-mounted electronic components suitable for thin electronic devices such as card calculators and memory cards.
カード電卓、カードラジオ、メモリーカード等、薄型の
電子機器には第３図に示したような薄型の表面実装用部
品側、０濁が多用されている０表面実装用部品は単に機
器が小型軽量になるのみならず、実装用プリント配線板
０υにとっても部品端子用の穴（スルーホール）が不要
なため、コストが下がるとか部品実装部も配線に使える
といった利点がある。For thin electronic devices such as card calculators, card radios, and memory cards, thin surface mount parts are used as shown in Figure 3.0 surface mount parts, which are often used for thin electronic devices, are simply smaller and lighter devices. Not only that, but also for the mounting printed wiring board 0υ, there is no need for holes (through holes) for component terminals, so there are advantages such as lower costs and the component mounting area can also be used for wiring.
ところが、このような表面実装用部品を用いる場合でも
、さらに機器を薄くすることが要求されるため、第３図
（ｂｌに示したように部品実装部に部品側が入る程の大
きさの貫通穴（デバイスホール）０４１をあけて、裏面
で接続できるようにする方法が用いられる。しかしこの
場合、部品実装部は全く配線には使えなくなるとか、接
合部が裏面に出っ張るといった欠点がでてくる。However, even when such surface mount components are used, it is necessary to make the device even thinner, so as shown in Fig. A method is used in which (device hole) 041 is opened and connections can be made on the back side.However, in this case, there are disadvantages such as the component mounting area cannot be used for wiring at all and the joint part protrudes from the back side.
第３図＋ａｌは従来の表面実装法を示した図で、この場
合には配線板Ｑ１１の厚さも部品（１３，０１の厚さも
そのまま機器の厚さに影響が出てしまう、また、第３図
（ｂｌはデバイスホール００を使用した場合の図で、こ
の場合は配線板αＤの厚さは部品（２）の厚さに含まれ
てしまうので機器の厚さは薄くなるが、デバイスホール
０４１の部分は当然のことながら配線には使えなくなっ
ている。このことは、限られた寸法内に実装組立をしな
くてはならないこの種の電子機器の場合重大な問題とな
る。また、接合部が裏面に出っ張るのも組立の際問題と
なる。Figure 3+al is a diagram showing the conventional surface mounting method. Figure (bl is a diagram when device hole 00 is used. In this case, the thickness of wiring board αD is included in the thickness of component (2), so the thickness of the device becomes thinner, but device hole 041 Of course, this part cannot be used for wiring.This is a serious problem for this type of electronic equipment, which must be assembled within limited dimensions. The protrusion on the back side also poses a problem during assembly.
本発明は、このような表面実装法の現状に迄み、デバイ
スホールを使用せずに表面実装用電子部品を実装して、
しかも、デバイスホールを使用した場合と同等な薄型化
に効果を有する実装方法を提供することを目的としたも
のである。The present invention provides a method for mounting electronic components for surface mounting without using device holes, which is the current state of the surface mounting method.
Furthermore, the object is to provide a mounting method that is as effective in reducing the thickness as when using device holes.
即ち本発明は、プリント配線用基板に、表面実装用電子
部品の接続端子の接合部の大きさに比べて０．１〜１．
Ｏｎ大きい寸法を有する貫通穴を設け、該基板の一方の
面（裏面）に金属箔を接着した後、プリント配線加工と
同時に、前記貫通穴の底部（基板の裏面側）につり橋状
の電子部品接合用パッドを形成させ、表面実装用電子部
品の接合部を基板の表面側から前記貫通穴に挿入すると
共に、電子部品接合用バンドに当接させて固定すること
を特徴とする電子部品の実装方法である。That is, in the present invention, the size of the bonded portion of the connecting terminal of the surface-mounted electronic component on the printed wiring board is 0.1 to 1.
After making a through hole with large dimensions and gluing metal foil to one side (back side) of the board, at the same time as printed wiring processing, a suspension bridge-like electronic component is placed at the bottom of the through hole (back side of the board). Electronic component mounting characterized by forming a bonding pad, inserting the bonding part of the surface-mounted electronic component into the through hole from the front side of the board, and fixing it by abutting on the electronic component bonding band. It's a method.
本発明において使用するプリント配線用基板（素材）と
しては、プラスチックフィルムを用いたフレキシブルプ
リント配線板用材料がもっとも適しているが、これに限
定するものではなく、比較的薄いガラス基材エポキシ積
層板等も使用できる。また、素材の一方の面（表面）に
銅箔、アルミ箔等の金属箔を張り合せた、片面銅張板や
片面アルミ張板であっても使用できることは勿論である
。The most suitable printed wiring board (material) used in the present invention is a flexible printed wiring board material using a plastic film, but is not limited to this, and a relatively thin glass-based epoxy laminate etc. can also be used. It goes without saying that a single-sided copper-clad plate or a single-sided aluminum-clad plate, in which metal foil such as copper foil or aluminum foil is laminated on one side (surface) of the material, can also be used.
以下、図面により本発明による電子部品の実装方法を詳
細に説明する。Hereinafter, a method for mounting electronic components according to the present invention will be explained in detail with reference to the drawings.
第２図は本発明の一実施例となる部品実装方法を示した
図で、第１図はその貫通穴の近傍を示す拡大断面図であ
る。まず、プリント配線用の基板（１）に、パンチング
、ドリル加工等の方法により貫通穴（２）を設けた後、
半田耐熱性のある熱硬化性接着剤をこれに塗工して金属
箔を張り合わせ、貫通穴（２）にパネルメッキ（銅メツ
キ）およびエツチングに耐えられ、加工後に除去可能な
インクをうめ込んで、通常のエツチング法により、プリ
ント配線加工（回路作成）を行なう、この時、貫通穴の
底部（基板の裏面側）には貫通穴（２）を跨ぐような形
で、即ちつり橋状に電子部品接合用バンド（３）を形成
させる。次いで、表面実装用電子部品（４）の接続端子
（５）の接合部（６）を、基板（１１の表面側から貫通
穴（２）に挿入し、接合用バンド（３）に当接させて固
定する。FIG. 2 is a diagram showing a component mounting method according to an embodiment of the present invention, and FIG. 1 is an enlarged sectional view showing the vicinity of the through hole. First, after providing a through hole (2) in a printed wiring board (1) by punching, drilling, etc.
A thermosetting adhesive that is resistant to soldering heat is applied to this, metal foil is attached, and an ink that can withstand panel plating (copper plating) and etching and is removable after processing is filled in the through hole (2). , print wiring processing (circuit creation) is performed using the normal etching method. At this time, the electronic component is placed at the bottom of the through hole (on the back side of the board) in a shape that straddles the through hole (2), that is, in the form of a suspension bridge. A bonding band (3) is formed. Next, the joint part (6) of the connection terminal (5) of the surface mount electronic component (4) is inserted into the through hole (2) from the front side of the board (11), and brought into contact with the joint band (3). and fix it.
接合部（６）と接合用パッド（３）の接合方法は半田リ
フローがもっとも適しているが、これに限るものではな
く導電性接着剤（銀ペースト）等の使用も可能である。The most suitable method for joining the joint portion (6) and the joint pad (3) is solder reflow, but the method is not limited to this, and conductive adhesive (silver paste) or the like may also be used.
半田を使用する場合には、つり橋状の部品接合パッド（
３）の部品実装面と反対側（裏面側）にソルダーレジス
トを塗工しておくことにより、配線板の裏面への半田の
付着による出っ張りを防ぐことができ、好ましい、半田
リフロー法を使用する際のクリーム半田等の塗工は、配
線板素材特性に合わせてデイスペンサやメタルマスクで
の印刷等が通用でき、予備半田法を使用する場合は、こ
れも配線板素材の特性に合わせて半田メツキ法や半田レ
ベラー法も適用できる。また、半田リフロー法は熱板伝
熱法、赤外線照射法、気相潜熱（Ｖ Ｐ Ｓ）法、熱圧
着（パルスヒータ）法等、通常用いられる方法が適用で
きる。When using solder, use a suspension bridge-like component bonding pad (
By applying solder resist on the side opposite to the component mounting surface (back side) in 3), it is possible to prevent protrusions caused by adhesion of solder to the back side of the wiring board, and it is preferable to use the solder reflow method. When applying cream solder, etc., it is possible to use a dispenser or printing with a metal mask depending on the characteristics of the wiring board material, and when using the pre-soldering method, it is also possible to apply solder plating according to the characteristics of the wiring board material. method and solder leveler method can also be applied. Further, as the solder reflow method, commonly used methods such as a hot plate heat transfer method, an infrared irradiation method, a vapor phase latent heat (VPS) method, and a thermocompression bonding (pulse heater) method can be applied.
部品の搭載方法としては、自動搭載機や人手による搭載
等、従来の方法が使用できる０部品（４）の接合部は独
立の端子であってもよく、ＩＣ等にみられる集合した端
子群であってもよい、一方、貫通穴（２）の形状は、部
品（４ンの種類によって異なり、例えば、部品（４）の
接続端子が１対、即ち片側１本の場合には円形や矩形、
また、ＩＣ等のように複数対からなる端子群の場合には
、各接続端子毎に独立した貫通穴を設けてもよく、ある
いは片側の端子群全体を収容できる大きさのスリット形
状の細長い貫通穴を設け、そこに第２図（ｂｌに示した
ように端子数に応じた数の接合用パッド＋３）を並べて
形成させても良い。Conventional methods such as automatic mounting machines or manual mounting can be used to mount components.The joints of component (4) may be independent terminals, or they may be grouped terminals found in ICs, etc. On the other hand, the shape of the through hole (2) varies depending on the type of the component (4). For example, if the component (4) has one pair of connection terminals, that is, one on each side, the shape of the through hole (2) may be circular, rectangular,
In addition, in the case of a terminal group consisting of multiple pairs such as an IC, an independent through hole may be provided for each connection terminal, or a long and narrow through hole in the form of a slit large enough to accommodate the entire terminal group on one side. A hole may be provided, and bonding pads corresponding to the number of terminals +3 may be formed in the hole in FIG. 2 (as shown in bl).
本発明で言う接続端子の接合部の大きさとは、接続端子
１本毎に独立した貫通穴を設ける場合にあっては、第１
図に示した接合部（６）１個の大きさ、即ち、長さ（Ａ
）×横幅で示される。一方、端子群全体を収容するスリ
ット形状の貫通穴を設ける場合には、複数個の接合部全
体を囲む最小の領域、即ち、長さは第１図の八と同じで
あるが、横幅は両側に位置する接合部の両端間の寸法に
なる０貫通穴（２）の大きさを接続端子（５）の接合部
の寸法より大きくするのは部品の端子が容易に挿入でき
るようにするためである０貫通穴が小さすぎると接合部
をスムーズに挿入するのが 難かしく、一方、これがあ
まり大きいと端子がずれたり、外れることがある上に、
配線板の接合用パッド（３）が変形し易くなるので、必
要以上に大きくしないほうが良いのは勿論である０貫通
穴の大きさ（たて×横の寸法）は、それぞれ接合部の大
きさに比べて０．１〜！、〇−宵、好ましくは０．５〜
１．０−大きい寸法とするのが良い。In the present invention, the size of the joint portion of the connecting terminal refers to the size of the joint portion of the connecting terminal when an independent through hole is provided for each connecting terminal.
The size of one joint (6) shown in the figure, that is, the length (A
) x width. On the other hand, when providing a slit-shaped through hole that accommodates the entire terminal group, the minimum area that surrounds the entire multiple joints, that is, the length is the same as 8 in Figure 1, but the width is The size of the through hole (2), which is the dimension between both ends of the joint located at , is made larger than the dimension of the joint of the connecting terminal (5) so that the terminal of the component can be inserted easily. If a certain through-hole is too small, it will be difficult to insert the joint part smoothly; on the other hand, if it is too large, the terminal may shift or come off, and
It goes without saying that it is better not to make the bonding pad (3) of the wiring board larger than necessary, as it will easily deform. 0.1~! ,〇-evening, preferably 0.5~
1.0 - Larger dimensions are better.
本発明の部品実装方法を用いることにより、デバイスホ
ールを使用することなく機器をより薄くすることが可能
で、そして配線面積の増加を極小にでき、軽薄短小を狙
った機器の商品価値を高めることができる。By using the component mounting method of the present invention, it is possible to make the device thinner without using device holes, and the increase in wiring area can be minimized, thereby increasing the commercial value of devices that aim to be light, thin, short, and small. I can do it.
部品実装においては、デバイスホールを用いた場合には
表裏２面の実装をしなくてはならないのに対して、本発
明によれば、一方の面から本発明による部分も他の表面
実装用部品も同時に実装でき、工程ならびに工数が削減
できる。さらに、組立時に接合部の出っ張りがなく、こ
のための特別な対策をとる必要がなくなる。In component mounting, when using a device hole, it is necessary to perform mounting on two sides, but according to the present invention, the part according to the present invention can also be mounted from one side to another surface-mounted component. can be implemented at the same time, reducing processes and man-hours. Furthermore, there is no protrusion at the joint during assembly, and there is no need to take special measures for this.
第１図は本発明の一実施例を示す貫通穴近傍の拡大断面
図、第２図は本発明による部品実装の一例を示す図で、
（８１は側面図、Ｔｂｌは上面図である。
また、第３図は従来の部品実装方法を示す側面図で、（
ａｌは標準的な方法、ｆｂｌはデバイスホールを使用し
た場合の図である。FIG. 1 is an enlarged cross-sectional view of the vicinity of a through hole showing an embodiment of the present invention, and FIG. 2 is a diagram showing an example of component mounting according to the present invention.
(81 is a side view, Tbl is a top view. Fig. 3 is a side view showing a conventional component mounting method.
al is a diagram using the standard method, and fbl is a diagram using a device hole.
Claims (1)
続端子の接合部の大きさに比べて０．１〜１．０ｍｍ大
きい寸法を有する貫通穴を設け、該基板の一方の面（裏
面）に金属箔を接着した後、プリント配線加工と同時に
、前記貫通穴の底部（基板の裏面側）につり橋状の電子
部品接合用パッドを形成させ、表面実装用電子部品の接
合部に基板の表面側から前記貫通穴に挿入すると共に、
電子部品接合用パッドに当接させて固定することを特徴
とする電子部品の実装方法。(1) A through hole having a size 0.1 to 1.0 mm larger than the size of the joint of the connection terminal of the surface mount electronic component is provided in the printed wiring board, and one side of the board (back side ), and at the same time as printed wiring processing, a suspension bridge-shaped electronic component bonding pad is formed at the bottom of the through hole (on the back side of the board), and a pad for bonding the board to the surface mounting electronic component is bonded to the board. Inserted into the through hole from the surface side,
A method for mounting an electronic component, characterized in that the electronic component is fixed in contact with a pad for bonding the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16073988A JPH0212892A (en) | 1988-06-30 | 1988-06-30 | Method of packaging electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16073988A JPH0212892A (en) | 1988-06-30 | 1988-06-30 | Method of packaging electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0212892A true JPH0212892A (en) | 1990-01-17 |
Family
ID=15721408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16073988A Pending JPH0212892A (en) | 1988-06-30 | 1988-06-30 | Method of packaging electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0212892A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006145643A (en) * | 2004-11-17 | 2006-06-08 | Casio Comput Co Ltd | Projector, and instructed image erasing method |
-
1988
- 1988-06-30 JP JP16073988A patent/JPH0212892A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006145643A (en) * | 2004-11-17 | 2006-06-08 | Casio Comput Co Ltd | Projector, and instructed image erasing method |
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