JPS6197893A - Mask for solder printing - Google Patents
Mask for solder printingInfo
- Publication number
- JPS6197893A JPS6197893A JP21820084A JP21820084A JPS6197893A JP S6197893 A JPS6197893 A JP S6197893A JP 21820084 A JP21820084 A JP 21820084A JP 21820084 A JP21820084 A JP 21820084A JP S6197893 A JPS6197893 A JP S6197893A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- solder
- board
- solder printing
- cob
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は基板上に半田厚よシも高さの高い凸部、例え
ばＬＳＩのペアチップを直接グイボンディングし、ワイ
ヤがンディング、ツヤ／クシコンコートまでを施した部
分（以下ＣＯＢ部という）が存在する場合の他のチップ
部品搭載用の半田印刷用マスクに関するものである。[Detailed Description of the Invention] (Industrial Field of Application) This invention enables direct bonding of protrusions with a high solder thickness and height, such as pair chips of LSI, on a board, wire bonding, and gloss/contact coating. The present invention relates to a solder printing mask for mounting other chip components in the case where there is a portion (hereinafter referred to as a COB portion) subjected to the above.
（従来の技術）
従来、００３部等が存在する基板にチップ部品を半田付
けする場合には、次の（、） 、 （ｂ）のように行な
われている。(Prior Art) Conventionally, when a chip component is soldered to a board on which part 003 or the like is present, the following steps (,) and (b) are performed.
（、） 半田ごてを用いて部品を手で半田付けする。(,) Solder the parts by hand using a soldering iron.
（ｂ） チップ部品を接着剤などの固定剤を用いて仮
止めし、半田デイツプ槽に基板ごと浸して半田付けをす
る。(b) The chip components are temporarily fixed using a fixing agent such as adhesive, and the board is immersed together with the board in a solder dip bath for soldering.
（発明が解決しようとする問題点）
しかしながら、チップ部品は本来、半田リフロー法によ
って半田付けができるような構造になっているため、（
ａ）のように半田ごてを用いて半田付けを行なうことは
非常に困難であシ、工数を多く必要とする欠点があった
。また（ｂ）のように、すでに００３部が形成されてい
る基板を半田ディツノ槽に浸すことは００３部の信頼性
を劣化させる外、半田量のコントロールができないため
接続の信頼性が低下する欠点があった。(Problem to be solved by the invention) However, since chip components are originally structured so that they can be soldered using the solder reflow method, (
Soldering using a soldering iron as in a) is extremely difficult and requires a large number of man-hours. Also, as shown in (b), dipping a board on which part 003 has already been formed into a soldering tank not only degrades the reliability of part 003, but also reduces the reliability of the connection because the amount of solder cannot be controlled. was there.
そこで、この発明は、前記従来技術が持っていた問題点
を解決する半田印刷用マスクを提供することを目的とす
るものである。SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a solder printing mask that solves the problems of the prior art.
（問題点を解決するための手段）
この発明は、薄板状のマスクで、基板上のチップ部品用
半田印刷孔の外に、基板上のＣＯＢ等の凸部に対応する
部分に穴を設け、この凸部に対応する部分の穴を可撓性
の膜で覆うようにしたものである。(Means for Solving the Problems) This invention is a thin plate-like mask, and in addition to the solder printing holes for chip components on the board, holes are provided in the parts corresponding to the convex parts such as COBs on the board, The hole corresponding to the convex portion is covered with a flexible film.
（作 用）
このようなマスクを用いて基板上を覆うと、チップ部品
の部分のみ半田印刷が可能になる。(Function) When such a mask is used to cover the board, solder printing can be performed only on the chip parts.
（実施例）
第１図は本発明半田印刷用マスクの一実施例を示す斜視
図で、第２図に示すような基板に適用させたものである
。即ち、第２図はノ１イブリッドＩＣ基板の斜視図で、
基板１の上に通常半田厚よシも高さの高いＣＯＢ部２と
チップ部品用の半田付けｉ４ッド部３が形成されている
。第１図において、４は薄板状のマスクで、第３図に示
すようにＣＯＢ部２に対応する穴４１とチップ部品用印
刷孔４２が設けられている。このＣＯＢ部２に対応する
穴４ノを可撓性の膜で覆い、周囲を接着剤等で固定する
。第４図は第１図の部分断面図である。(Embodiment) FIG. 1 is a perspective view showing an embodiment of the solder printing mask of the present invention, which is applied to a substrate as shown in FIG. 2. That is, FIG. 2 is a perspective view of the hybrid IC board.
On a substrate 1, a COB part 2 which is usually high in solder thickness and height, and a soldering i4 pad part 3 for chip components are formed. In FIG. 1, reference numeral 4 denotes a thin plate-like mask, and as shown in FIG. 3, a hole 41 corresponding to the COB section 2 and a printing hole 42 for chip components are provided. The hole 4 corresponding to this COB part 2 is covered with a flexible film, and the surrounding area is fixed with adhesive or the like. FIG. 4 is a partial sectional view of FIG. 1.
次に、この半田印刷用マスクの使用法を述べる。Next, how to use this solder printing mask will be described.
第５図に示すように、第４図に示す半田印刷用マスクを
基板１上にかぶせる。この状態で第６図に示すようにク
リーム半田をスキージ７を用いて印刷する。この半田印
刷の終った基板１に、第７図で示すようにチップ部品８
を搭載し、この基板１をリフロー装置を通して半田付け
すれば完成されたハイブリッドＩＣが得られる。As shown in FIG. 5, the solder printing mask shown in FIG. 4 is placed over the substrate 1. As shown in FIG. In this state, cream solder is printed using a squeegee 7 as shown in FIG. As shown in FIG. 7, the chip component 8 is
A completed hybrid IC is obtained by mounting this board 1 and soldering it through a reflow device.
（発明の効果）
以上詳細に説明したように、本発明はチップ部品用半田
印刷孔の外に、基板上のＣＯＢ部等の凸部に対応する穴
を設け、さらに凸部に対応する穴の部分を可撓性の膜で
覆った半田印刷用薄板状マスクであるから、これを基板
上にＣＯＢ部等を形成させた基板上にかぶせることで、
他のチップ部品の半田印刷が可能になシ、シたがって半
田付けが容易にでき、またＣＯＢ部等の信頼性を損うこ
とがなくなるという効果がある。
′□(Effects of the Invention) As explained in detail above, the present invention provides holes corresponding to convex parts such as COB parts on a substrate in addition to solder printing holes for chip components, and furthermore, a hole corresponding to the convex part is provided. Since it is a thin plate-like mask for solder printing whose parts are covered with a flexible film, by covering it over a board on which a COB part etc. is formed on the board,
This makes it possible to print solder on other chip components, which makes soldering easy and does not impair the reliability of the COB part or the like.
′□
第１図は本発明半田印刷用マスクの一実施例を示す斜視
図、第２図はＣＯＢ部の存在する基板の斜視図、第３図
は第１図の薄板状マスクの斜視図、第４図は第１図の部
分断面図、第５図〜第７図は本発明半田印刷用マスクの
使用説明図である。
１・・・基板、２・・・ＣＯＢ部、３・・・半田付はパ
ッド部、４・・・薄板状マスク、４１・・・穴、４２・
・・印刷孔、５・・・膜。
第 １ 凶
第 ２ （２）
第 ３ 図FIG. 1 is a perspective view showing an embodiment of the solder printing mask of the present invention, FIG. 2 is a perspective view of a substrate on which a COB portion is present, FIG. 3 is a perspective view of the thin plate mask of FIG. 1, and FIG. The figure is a partial cross-sectional view of FIG. 1, and FIGS. 5 to 7 are explanatory views of the use of the solder printing mask of the present invention. DESCRIPTION OF SYMBOLS 1... Board, 2... COB part, 3... Pad part for soldering, 4... Thin plate mask, 41... Hole, 42...
...Print hole, 5...membrane. 1st 2nd (2) Fig. 3
Claims (1)
高い凸部に該当する部分及び半田印刷する部分に穴を設
け、かつ前記凸部に該当する部分の穴には周囲を接着固
定した可撓性の膜で覆うようにしたことを特徴とする半
田印刷用マスク。Holes are provided in the thin plate-shaped mask in the areas corresponding to the protrusions that are higher than the solder thickness on the IC board and in the areas where solder is to be printed, and the periphery of the holes in the areas corresponding to the protrusions is glued. A solder printing mask characterized by being covered with a fixed flexible film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21820084A JPS6197893A (en) | 1984-10-19 | 1984-10-19 | Mask for solder printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21820084A JPS6197893A (en) | 1984-10-19 | 1984-10-19 | Mask for solder printing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6197893A true JPS6197893A (en) | 1986-05-16 |
Family
ID=16716185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21820084A Pending JPS6197893A (en) | 1984-10-19 | 1984-10-19 | Mask for solder printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6197893A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61237495A (en) * | 1985-04-15 | 1986-10-22 | 松下電器産業株式会社 | Solding for hybrid integrated circuit |
| JPS63268288A (en) * | 1987-04-27 | 1988-11-04 | Matsushita Electric Ind Co Ltd | Soldering method for hybrid integrated circuit |
| JPH03104298A (en) * | 1989-09-19 | 1991-05-01 | Toyo Commun Equip Co Ltd | Coating of cream solder or the like |
-
1984
- 1984-10-19 JP JP21820084A patent/JPS6197893A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61237495A (en) * | 1985-04-15 | 1986-10-22 | 松下電器産業株式会社 | Solding for hybrid integrated circuit |
| JPS63268288A (en) * | 1987-04-27 | 1988-11-04 | Matsushita Electric Ind Co Ltd | Soldering method for hybrid integrated circuit |
| JPH03104298A (en) * | 1989-09-19 | 1991-05-01 | Toyo Commun Equip Co Ltd | Coating of cream solder or the like |
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