JPH053138B2 - - Google Patents

Info

Publication number
JPH053138B2
JPH053138B2 JP59233206A JP23320684A JPH053138B2 JP H053138 B2 JPH053138 B2 JP H053138B2 JP 59233206 A JP59233206 A JP 59233206A JP 23320684 A JP23320684 A JP 23320684A JP H053138 B2 JPH053138 B2 JP H053138B2
Authority
JP
Japan
Prior art keywords
semiconductor
circuit
semiconductor chip
mounting
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59233206A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61112338A (ja
Inventor
Shoichi Azuhata
Jun Morishita
Takayuki Okinaga
Nobuaki Hirano
Tooru Suzuki
Kazuyoshi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Microcomputer System Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Microcomputer System Ltd, Hitachi Ltd filed Critical Hitachi Microcomputer System Ltd
Priority to JP59233206A priority Critical patent/JPS61112338A/ja
Publication of JPS61112338A publication Critical patent/JPS61112338A/ja
Publication of JPH053138B2 publication Critical patent/JPH053138B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/20—
    • H10W72/07251—
    • H10W72/251—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/722—

Landscapes

  • Wire Bonding (AREA)
JP59233206A 1984-11-07 1984-11-07 半導体装置 Granted JPS61112338A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59233206A JPS61112338A (ja) 1984-11-07 1984-11-07 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59233206A JPS61112338A (ja) 1984-11-07 1984-11-07 半導体装置

Publications (2)

Publication Number Publication Date
JPS61112338A JPS61112338A (ja) 1986-05-30
JPH053138B2 true JPH053138B2 (enExample) 1993-01-14

Family

ID=16951413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59233206A Granted JPS61112338A (ja) 1984-11-07 1984-11-07 半導体装置

Country Status (1)

Country Link
JP (1) JPS61112338A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3880676B2 (ja) * 1997-02-21 2007-02-14 株式会社ルネサステクノロジ 集積回路装置
TWI470762B (zh) * 2007-07-27 2015-01-21 尼康股份有限公司 Laminated semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0658922B2 (ja) * 1982-12-24 1994-08-03 株式会社日立製作所 半導体装置

Also Published As

Publication number Publication date
JPS61112338A (ja) 1986-05-30

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