JPH0530891B2 - - Google Patents

Info

Publication number
JPH0530891B2
JPH0530891B2 JP62157089A JP15708987A JPH0530891B2 JP H0530891 B2 JPH0530891 B2 JP H0530891B2 JP 62157089 A JP62157089 A JP 62157089A JP 15708987 A JP15708987 A JP 15708987A JP H0530891 B2 JPH0530891 B2 JP H0530891B2
Authority
JP
Japan
Prior art keywords
wire
bonding
gold
weight
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62157089A
Other languages
English (en)
Japanese (ja)
Other versions
JPS644441A (en
Inventor
Eiichi Asada
Kazuo Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoei Chemical Inc
Original Assignee
Shoei Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Inc filed Critical Shoei Chemical Inc
Priority to JP62157089A priority Critical patent/JPS644441A/ja
Publication of JPS644441A publication Critical patent/JPS644441A/ja
Publication of JPH0530891B2 publication Critical patent/JPH0530891B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
JP62157089A 1987-06-24 1987-06-24 Bonding wire Granted JPS644441A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62157089A JPS644441A (en) 1987-06-24 1987-06-24 Bonding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62157089A JPS644441A (en) 1987-06-24 1987-06-24 Bonding wire

Publications (2)

Publication Number Publication Date
JPS644441A JPS644441A (en) 1989-01-09
JPH0530891B2 true JPH0530891B2 (https=) 1993-05-11

Family

ID=15642005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62157089A Granted JPS644441A (en) 1987-06-24 1987-06-24 Bonding wire

Country Status (1)

Country Link
JP (1) JPS644441A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920010119B1 (ko) * 1989-04-28 1992-11-16 다나카 덴시 고오교오 가부시기가이샤 반도체 소자의 본딩(bonding)용 금선
JP2729852B2 (ja) * 1990-08-07 1998-03-18 本田技研工業株式会社 ボール継手用外輪の成形に用いられるしごき加工用ポンチの製造方法
JP2641000B2 (ja) * 1991-12-26 1997-08-13 新日本製鐵株式会社 ボンディング用金合金細線

Also Published As

Publication number Publication date
JPS644441A (en) 1989-01-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees