JPS644441A - Bonding wire - Google Patents

Bonding wire

Info

Publication number
JPS644441A
JPS644441A JP62157089A JP15708987A JPS644441A JP S644441 A JPS644441 A JP S644441A JP 62157089 A JP62157089 A JP 62157089A JP 15708987 A JP15708987 A JP 15708987A JP S644441 A JPS644441 A JP S644441A
Authority
JP
Japan
Prior art keywords
bonding wire
contg
silver
gold
purity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62157089A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0530891B2 (https=
Inventor
Eiichi Asada
Kazuo Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoei Chemical Inc
Original Assignee
Shoei Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Inc filed Critical Shoei Chemical Inc
Priority to JP62157089A priority Critical patent/JPS644441A/ja
Publication of JPS644441A publication Critical patent/JPS644441A/ja
Publication of JPH0530891B2 publication Critical patent/JPH0530891B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
JP62157089A 1987-06-24 1987-06-24 Bonding wire Granted JPS644441A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62157089A JPS644441A (en) 1987-06-24 1987-06-24 Bonding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62157089A JPS644441A (en) 1987-06-24 1987-06-24 Bonding wire

Publications (2)

Publication Number Publication Date
JPS644441A true JPS644441A (en) 1989-01-09
JPH0530891B2 JPH0530891B2 (https=) 1993-05-11

Family

ID=15642005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62157089A Granted JPS644441A (en) 1987-06-24 1987-06-24 Bonding wire

Country Status (1)

Country Link
JP (1) JPS644441A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4938923A (en) * 1989-04-28 1990-07-03 Takeshi Kujiraoka Gold wire for the bonding of a semiconductor device
US5186082A (en) * 1990-08-07 1993-02-16 Honda Giken Kogyo Kabushiki Kaisha Ironing punch for making socket of ball-and-socket joint and method of manufacturing such ironing punch
JPH05179375A (ja) * 1991-12-26 1993-07-20 Nippon Steel Corp ボンディング用金合金細線

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4938923A (en) * 1989-04-28 1990-07-03 Takeshi Kujiraoka Gold wire for the bonding of a semiconductor device
US5186082A (en) * 1990-08-07 1993-02-16 Honda Giken Kogyo Kabushiki Kaisha Ironing punch for making socket of ball-and-socket joint and method of manufacturing such ironing punch
JPH05179375A (ja) * 1991-12-26 1993-07-20 Nippon Steel Corp ボンディング用金合金細線

Also Published As

Publication number Publication date
JPH0530891B2 (https=) 1993-05-11

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees