Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Shinkawa Ltd
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Hitachi Tokyo Electronics Co Ltd, Hitachi LtdfiledCriticalShinkawa Ltd
Priority to JP58169187ApriorityCriticalpatent/JPS6062425A/ja
Publication of JPS6062425ApublicationCriticalpatent/JPS6062425A/ja
Publication of JPH0530708B2publicationCriticalpatent/JPH0530708B2/ja
B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
Landscapes
Engineering & Computer Science
(AREA)
Mechanical Engineering
(AREA)
Automatic Assembly
(AREA)
Details Of Rigid Or Semi-Rigid Containers
(AREA)
Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like
(AREA)