JPH0530355Y2 - - Google Patents
Info
- Publication number
- JPH0530355Y2 JPH0530355Y2 JP7640086U JP7640086U JPH0530355Y2 JP H0530355 Y2 JPH0530355 Y2 JP H0530355Y2 JP 7640086 U JP7640086 U JP 7640086U JP 7640086 U JP7640086 U JP 7640086U JP H0530355 Y2 JPH0530355 Y2 JP H0530355Y2
- Authority
- JP
- Japan
- Prior art keywords
- reaction tube
- quartz reaction
- door flange
- rings
- door
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7640086U JPH0530355Y2 (forum.php) | 1986-05-21 | 1986-05-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7640086U JPH0530355Y2 (forum.php) | 1986-05-21 | 1986-05-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62188135U JPS62188135U (forum.php) | 1987-11-30 |
JPH0530355Y2 true JPH0530355Y2 (forum.php) | 1993-08-03 |
Family
ID=30923441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7640086U Expired - Lifetime JPH0530355Y2 (forum.php) | 1986-05-21 | 1986-05-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0530355Y2 (forum.php) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117981059A (zh) * | 2021-12-27 | 2024-05-03 | 株式会社国际电气 | 泄漏检测装置、半导体装置的制造方法、基板处理方法及程序 |
-
1986
- 1986-05-21 JP JP7640086U patent/JPH0530355Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS62188135U (forum.php) | 1987-11-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100280689B1 (ko) | 열처리 장치 | |
JP2825172B2 (ja) | 減圧処理装置および減圧処理方法 | |
US10663336B2 (en) | Processing chamber gas detection system and operation method thereof | |
TWI697037B (zh) | 處理裝置 | |
TWM590308U (zh) | 用於減少電漿蝕刻腔室中的污染的設備 | |
JPH0530355Y2 (forum.php) | ||
CN110023660B (zh) | 低颗粒保护的挡板阀 | |
US6082414A (en) | Apparatus and method for replacing an attachment on a vacuum chamber | |
JP3480280B2 (ja) | 縦型処理装置 | |
JP3463785B2 (ja) | 封止装置および処理装置 | |
JP3449636B2 (ja) | 半導体製造装置 | |
CN219861573U (zh) | 一种微波等离子体化学气相沉积设备反应腔结构 | |
JP4483040B2 (ja) | 熱処理装置 | |
JPH11145072A (ja) | 熱処理装置 | |
JPH10231932A (ja) | 封止装置 | |
JPH057239Y2 (forum.php) | ||
JPH01258427A (ja) | 半導体ウェハーの製造装置 | |
JPH11135447A (ja) | 熱処理装置 | |
JP2880726B2 (ja) | 半導体装置の製造装置 | |
CN116659772A (zh) | 一种用于薄膜设备的检漏装置以及检漏方法 | |
JP2739173B2 (ja) | 気相成長装置 | |
JPH0526735Y2 (forum.php) | ||
JPH07161643A (ja) | 真空処理装置 | |
JPH04106392A (ja) | 封止装置及び封止方法 | |
JPS6051537A (ja) | 真空系内と大気圧部間の物質移動装置 |