JPH0530059B2 - - Google Patents

Info

Publication number
JPH0530059B2
JPH0530059B2 JP59239487A JP23948784A JPH0530059B2 JP H0530059 B2 JPH0530059 B2 JP H0530059B2 JP 59239487 A JP59239487 A JP 59239487A JP 23948784 A JP23948784 A JP 23948784A JP H0530059 B2 JPH0530059 B2 JP H0530059B2
Authority
JP
Japan
Prior art keywords
wire
bonding
capillary
metal wire
noble metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59239487A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61119052A (ja
Inventor
Koichiro Atsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59239487A priority Critical patent/JPS61119052A/ja
Publication of JPS61119052A publication Critical patent/JPS61119052A/ja
Publication of JPH0530059B2 publication Critical patent/JPH0530059B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/015—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07541—
    • H10W72/50—
    • H10W72/5525—

Landscapes

  • Wire Bonding (AREA)
JP59239487A 1984-11-15 1984-11-15 非貴金属ワイヤボンデイング方法 Granted JPS61119052A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59239487A JPS61119052A (ja) 1984-11-15 1984-11-15 非貴金属ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59239487A JPS61119052A (ja) 1984-11-15 1984-11-15 非貴金属ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS61119052A JPS61119052A (ja) 1986-06-06
JPH0530059B2 true JPH0530059B2 (index.php) 1993-05-07

Family

ID=17045506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59239487A Granted JPS61119052A (ja) 1984-11-15 1984-11-15 非貴金属ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS61119052A (index.php)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152450A (en) * 1987-01-26 1992-10-06 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method

Also Published As

Publication number Publication date
JPS61119052A (ja) 1986-06-06

Similar Documents

Publication Publication Date Title
KR100874328B1 (ko) 와이어 본딩용의 감소된 산화 시스템
US4674671A (en) Thermosonic palladium lead wire bonding
US8313015B2 (en) Gas delivery system for reducing oxidation in wire bonding operations
JPH06333972A (ja) 半田ワイヤーにボール部を形成する方法
JPH0951011A (ja) 半導体チップのワイヤボンディング方法
JP2004014884A (ja) ボンディングワイヤー
JPH0530059B2 (index.php)
JPH0530060B2 (index.php)
KR930006129B1 (ko) 반도체 장치의 제조방법 및 그 장치
JPS6158246A (ja) ワイヤボンデイング方法
JP2975207B2 (ja) 半田ワイヤーによるワイヤーボンディング装置
JPS6366055B2 (index.php)
JPS60177639A (ja) 半導体装置の製造方法
JPS61172343A (ja) ワイヤボンデイング方法及び装置
JPS6197937A (ja) 半導体素子の組立方法及びその装置
JPS59201447A (ja) 半導体装置
JPH0325019B2 (index.php)
JPS63300522A (ja) 半導体装置
JP6002299B1 (ja) ボールボンディング用金（Ａｕ）分散銅ワイヤ
JPH06196522A (ja) 金属ワイヤにおけるボールの形成方法
JPS6158247A (ja) ワイヤボンデイング方法
JPS5932142A (ja) ワイヤボンダ
JP4318533B2 (ja) ボールバンプ形成用リボン
JPS59219935A (ja) ボンデイング方法
JPS5477571A (en) Nail head bonding method