JPH05299528A - Integrated circuit device - Google Patents

Abstract

PURPOSE:To manufacture the title integrated circuit device having excellent temperature cycle as well as the hardly releasable bonding surface between a substrate and a sealing resin not affecting any electronic elements on the substrate surface even if the bonding surface is releaed from the surface. CONSTITUTION:Within the title integrated circuit device provided with a substrate 1 having at least semiconductor chips 3 on the surface side 1a as well as a sealing resin 6 covering the whole body in the exposed state of the rear surface 1d of the substrate 1, the sides 1b, 1c of the substrate 1 are cut off for providing stepped parts 11, 11 so as to be filled up with a part of the sealing resin 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device using a metal or ceramic substrate.

[0002]

2. Description of the Related Art A resin-sealed hybrid integrated circuit device is known in which a semiconductor chip, a resistor, a capacitor, and the like are mixedly mounted on a metal or ceramic substrate and hardened with a resin. In such a mixed integrated circuit device, by freely designing a combination of passive elements such as resistors and capacitors to be mounted on the substrate on the substrate, an integrated circuit according to needs can be obtained.
This is used, for example, for ignition control of an automobile plug.

4 and 5 are sectional views showing an example of a conventional resin-sealed hybrid integrated circuit. In each figure, 1 is a metal substrate, 1a is the front surface of the metal substrate 1, 1b and 1c are side surfaces of the metal substrate 1, 1d is the back surface of the metal substrate 1, 2 is a copper foil pattern on the front surface 1a of the metal substrate 1, 3 is copper night pattern 2
A semiconductor chip mounted on the substrate 4, conductive thin metal wires that connect the copper foil pattern 2 and the semiconductor chip 3, 5 are external leads, and 6 is a sealing resin.

The conventional resin-encapsulated hybrid integrated circuit device is constructed as described above, and in FIG. 4, the surface 1a side and both side surfaces 1b, 1c of the metal substrate 1 on which the semiconductor chip 3 is mounted are mounted.
Is covered and sealed by the sealing resin 6, whereas the back surface 1d of the metal substrate 1 is exposed to the outside from the sealing resin 6 in order to dissipate the heat generated in the semiconductor chip 3.

[0005]

However, according to the conventional resin-encapsulated hybrid integrated circuit device, it is subjected to thermal stress when it is used for a long period of time, and as shown in FIG. There is a drawback that peeling A occurs on the adhesive surface between the metal substrate and the sealing resin, and moisture penetrates from there to destroy the circuit.

The present invention has been made in order to solve the above problems, and has good temperature cycle property, and the adhesive surface between the metal substrate and the sealing resin is not easily peeled off, which affects electronic elements on the surface of the substrate. The purpose is to obtain a highly reliable integrated circuit device.

[0007]

An integrated circuit device according to the present invention has at least a semiconductor chip 3 and electrodes on a surface 1a.
In the integrated circuit device provided with the substrate 1 provided on the side and the sealing resin 6 covering the entire back surface 1d of the substrate 1, the side surfaces 1b and 1c of the substrate 1 are cut off to form a step. The parts 11, 11 are provided, and the step parts 11, 11 are filled with the sealing resin 6.

[0008]

With the above structure, when the sealing resin is used for sealing, the sealing resin seals so as to fill the stepped portion provided on the substrate, so that the integrity of the substrate and the sealing resin is improved. And peeling is less likely to occur.

[0009]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to FIG. FIG. 1 is a cross-sectional view showing an embodiment of the present invention. The same or corresponding parts as those of the conventional example shown in FIGS. In FIG. 1, reference numeral 11 denotes a stepped portion obtained by cutting the lower end of the metal substrate 1 from the outer peripheral side toward the inner peripheral side. 6a is the stepped portion 11,
11 is a sealing resin. According to this embodiment, when the metal substrate 1 is sealed with the sealing resin 6 by forming the step portions 11 and 11, the sealing resin 6 is used.
Partially fill the stepped portions 11, 11. As a result, the metal substrate 1 is sealed so that only the central portion of the back surface 1d is exposed to the outside of the sealing resin 6. Therefore, the back surface 1 of the metal substrate 1
Since the degree of exposure of d is reduced and the bonding surface between the metal substrate 1 and the sealing resin 6 is increased accordingly, the sealing resin 6 is embedded so as to wrap around the step portions 11 and 11. The sealing resin 6 and the sealing resin 6 are in close contact with each other, the integrity is increased, and peeling is less likely to occur. Further, even if peeling occurs, since the step portions 11 and 11 are formed, the peeling does not reach the substrate surface 1a along the side surfaces 1b and 1c.
It does not affect the electronic elements on the substrate surface 1a.

Embodiment 2. FIG. 2 is a cross-sectional view showing another embodiment of the present invention, in which the same or corresponding parts as those in FIGS. 1, 4 and 5 are designated by the same reference numerals and the description thereof will be omitted. In FIG. 2, reference numeral 12 is a through hole formed so as to extend from the substrate surface 1a to the step portions 11, 11. 6b is a sealing resin 6 filling the through holes 12, 12. According to the present embodiment, when the metal substrate 1 is sealed with the sealing resin 6,
The whole substrate is covered with a sealing resin so as to fill the through holes 12, 12 together with the step portions 11, 11, so that only the central portion of the back surface 1d of the metal substrate 1 is exposed to the outside of the sealing resin 6. Seal. Therefore, rather than the one shown in Example 1,
Further, the degree of adhesion increases, and it becomes more difficult for the metal substrate 1 and the sealing resin 6 to come off. Even if peeling occurs, the step portions 11 and 11 are formed and the through holes 12 and 12 are formed.
Also, since the peeling does not reach the substrate surface 1a through the substrate side surfaces 1b and 1c, the peeling does not affect the electronic elements on the substrate surface 1a.

Embodiment 3. FIG. 3 is a cross-sectional view showing another embodiment of the present invention, in which the same or corresponding parts as those in FIGS. 1, 2, 4, and 5 are designated by the same reference numerals and the description thereof will be omitted. In FIG. 3, 13 is a groove formed inwardly on the side surfaces 1b and 1c of the metal substrate 1. 6c is the groove 13,
13 is a sealing resin. According to this embodiment, when the metal substrate 1 is sealed with the sealing resin 6, the step portion 1
The entire substrate was covered with the sealing resin 6 so as to fill the grooves 13 and 13 as well as 1 and 11, and only the central portion of the back surface 1d of the metal substrate 1 was exposed to the outside of the sealing resin 6 for sealing. Therefore, since the step portions 11 and 11 and the grooves 13 and 13 are sealed so as to be filled with the sealing resin 6, the degree of adhesion between the metal substrate 1 and the sealing resin 6 is increased, and peeling is less likely to occur. Further, even if peeling occurs, it does not reach the substrate surface 1a along the substrate side surfaces 1b and 1c, and does not affect the electronic elements on the substrate surface 1a. With this configuration, there is a problem in processing, but a certain effect can be obtained.

[0012]

According to the present invention, the lower end of the side surface of the substrate is cut off to form a stepped portion, and the stepped portion is filled with the sealing resin, so that the adhesion between the substrate and the sealing resin is improved. However, it is possible to obtain a product having high adhesiveness and high heat resistance.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of an integrated circuit device of the present invention.

FIG. 2 is a sectional view showing another embodiment of the integrated circuit device of the present invention.

FIG. 3 is a cross-sectional view showing another embodiment of the integrated circuit device of the present invention.

FIG. 4 is a sectional view showing an example of a conventional integrated circuit device.

FIG. 5 is a cross-sectional view showing a state in which peeling has occurred in a conventional integrated circuit device.

[Explanation of symbols]

 1 Metal Substrate 1a Surface of Metal Substrate 1b, 1c Side of Metal Substrate 1d Back of Metal Substrate 2 Copper Side Pattern 3 Semiconductor Chip 4 Metallic Wire 5 External Lead 6 Encapsulation Resin 6a Encapsulation Resin 6b Through Hole Filled sealing resin 6c Sealing resin filling groove 11 Step 12 Through hole 13 Groove

Claims (1)

[Claims] 1. An integrated circuit device comprising: a substrate having at least a semiconductor chip and electrodes on the front surface side; and a sealing resin covering the entire surface of the substrate with the back surface thereof exposed.
An integrated circuit device characterized in that a step portion is provided by cutting off a lower end of a side surface of the substrate, and the step portion is filled with the sealing resin.